Sintering Copper Nanoparticles with Photonic Additive for Printed Conductive Patterns by Intense Pulsed Light

• Published in: Nanomaterials (Basel, Switzerland) Vol. 9; no. 8; p. 1071
• Main Authors: Chung, Wan-Yu, Lai, Yi-Chin, Yonezawa, Tetsu, Liao, Ying-Chih
• Format: Journal Article
• Language: English
• Published: Switzerland MDPI AG 25.07.2019; MDPI
• Subjects: conductive patterns; Conductivity; Copper; copper nanoparticle; Copper oxides; Cracks; Decomposition; Electrical resistivity; Electromagnetic absorption; Glass substrates; High temperature; light absorption; Nanoparticles; Oxidation; photonic sintering; Photonics; porosity; Sintering; Substrates; Thin films; Yield stress; St Louis Missouri; United States > US; Japan; copper nanoparticle; conductive patterns; porosity; photonic sintering; light absorption

In this study, an ink formulation was developed to prepare conductive copper thin films with compact structure by using intense pulsed light (IPL) sintering. To improve inter-particle connections in the sintering process, a cuprous oxide shell was synthesized over copper nanoparticles (CuNP). This c...