Sintering Copper Nanoparticles with Photonic Additive for Printed Conductive Patterns by Intense Pulsed Light
In this study, an ink formulation was developed to prepare conductive copper thin films with compact structure by using intense pulsed light (IPL) sintering. To improve inter-particle connections in the sintering process, a cuprous oxide shell was synthesized over copper nanoparticles (CuNP). This c...
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| Published in | Nanomaterials (Basel, Switzerland) Vol. 9; no. 8; p. 1071 |
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| Main Authors | , , , |
| Format | Journal Article |
| Language | English |
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25.07.2019
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| Abstract | In this study, an ink formulation was developed to prepare conductive copper thin films with compact structure by using intense pulsed light (IPL) sintering. To improve inter-particle connections in the sintering process, a cuprous oxide shell was synthesized over copper nanoparticles (CuNP). This cuprous oxide shell can be reduced by IPL with the presence of a reductant and fused to form connection between large copper particles. However, the thermal yield stress after strong IPL sintering resulted in cracks of conductive copper film. Thus, a multiple pulse sintering with an off time of 2 s was needed to reach a low resistivity of 10−5 Ω·cm. To increase the light absorption efficiency and to further decrease voids between CuNPs in the copper film, cupric oxide nanoparticles (CuONP) of 50 nm, were also added into ink. The results showed that these CuONPs can be reduced to copper with a single pulse IPL and fused with the surrounding CuNPs. With an optimal CuNP/CuONP weight ratio of 1/80, the copper film showed a lowest resistivity of 7 × 10−5 Ω·cm, ~25% conductivity of bulk copper, with a single sintering energy at 3.08 J/cm2. The ink can be printed on flexible substrates as conductive tracks and the resistance remained nearly the same after 10,000 bending cycles. |
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| AbstractList | In this study, an ink formulation was developed to prepare conductive copper thin films with compact structure by using intense pulsed light (IPL) sintering. To improve inter-particle connections in the sintering process, a cuprous oxide shell was synthesized over copper nanoparticles (CuNP). This cuprous oxide shell can be reduced by IPL with the presence of a reductant and fused to form connection between large copper particles. However, the thermal yield stress after strong IPL sintering resulted in cracks of conductive copper film. Thus, a multiple pulse sintering with an off time of 2 s was needed to reach a low resistivity of 10
−5
Ω·cm. To increase the light absorption efficiency and to further decrease voids between CuNPs in the copper film, cupric oxide nanoparticles (CuONP) of 50 nm, were also added into ink. The results showed that these CuONPs can be reduced to copper with a single pulse IPL and fused with the surrounding CuNPs. With an optimal CuNP/CuONP weight ratio of 1/80, the copper film showed a lowest resistivity of 7 × 10
−5
Ω·cm, ~25% conductivity of bulk copper, with a single sintering energy at 3.08 J/cm
2
. The ink can be printed on flexible substrates as conductive tracks and the resistance remained nearly the same after 10,000 bending cycles. In this study, an ink formulation was developed to prepare conductive copper thin films with compact structure by using intense pulsed light (IPL) sintering. To improve inter-particle connections in the sintering process, a cuprous oxide shell was synthesized over copper nanoparticles (CuNP). This cuprous oxide shell can be reduced by IPL with the presence of a reductant and fused to form connection between large copper particles. However, the thermal yield stress after strong IPL sintering resulted in cracks of conductive copper film. Thus, a multiple pulse sintering with an off time of 2 s was needed to reach a low resistivity of 10 Ω·cm. To increase the light absorption efficiency and to further decrease voids between CuNPs in the copper film, cupric oxide nanoparticles (CuONP) of 50 nm, were also added into ink. The results showed that these CuONPs can be reduced to copper with a single pulse IPL and fused with the surrounding CuNPs. With an optimal CuNP/CuONP weight ratio of 1/80, the copper film showed a lowest resistivity of 7 × 10 Ω·cm, ~25% conductivity of bulk copper, with a single sintering energy at 3.08 J/cm . The ink can be printed on flexible substrates as conductive tracks and the resistance remained nearly the same after 10,000 bending cycles. In this study, an ink formulation was developed to prepare conductive copper thin films with compact structure by using intense pulsed light (IPL) sintering. To improve inter-particle connections in the sintering process, a cuprous oxide shell was synthesized over copper nanoparticles (CuNP). This cuprous oxide shell can be reduced by IPL with the presence of a reductant and fused to form connection between large copper particles. However, the thermal yield stress after strong IPL sintering resulted in cracks of conductive copper film. Thus, a multiple pulse sintering with an off time of 2 s was needed to reach a low resistivity of 10−5 Ω·cm. To increase the light absorption efficiency and to further decrease voids between CuNPs in the copper film, cupric oxide nanoparticles (CuONP) of 50 nm, were also added into ink. The results showed that these CuONPs can be reduced to copper with a single pulse IPL and fused with the surrounding CuNPs. With an optimal CuNP/CuONP weight ratio of 1/80, the copper film showed a lowest resistivity of 7 × 10−5 Ω·cm, ~25% conductivity of bulk copper, with a single sintering energy at 3.08 J/cm2. The ink can be printed on flexible substrates as conductive tracks and the resistance remained nearly the same after 10,000 bending cycles. In this study, an ink formulation was developed to prepare conductive copper thin films with compact structure by using intense pulsed light (IPL) sintering. To improve inter-particle connections in the sintering process, a cuprous oxide shell was synthesized over copper nanoparticles (CuNP). This cuprous oxide shell can be reduced by IPL with the presence of a reductant and fused to form connection between large copper particles. However, the thermal yield stress after strong IPL sintering resulted in cracks of conductive copper film. Thus, a multiple pulse sintering with an off time of 2 s was needed to reach a low resistivity of 10-5 Ω·cm. To increase the light absorption efficiency and to further decrease voids between CuNPs in the copper film, cupric oxide nanoparticles (CuONP) of 50 nm, were also added into ink. The results showed that these CuONPs can be reduced to copper with a single pulse IPL and fused with the surrounding CuNPs. With an optimal CuNP/CuONP weight ratio of 1/80, the copper film showed a lowest resistivity of 7 × 10-5 Ω·cm, ~25% conductivity of bulk copper, with a single sintering energy at 3.08 J/cm2. The ink can be printed on flexible substrates as conductive tracks and the resistance remained nearly the same after 10,000 bending cycles.In this study, an ink formulation was developed to prepare conductive copper thin films with compact structure by using intense pulsed light (IPL) sintering. To improve inter-particle connections in the sintering process, a cuprous oxide shell was synthesized over copper nanoparticles (CuNP). This cuprous oxide shell can be reduced by IPL with the presence of a reductant and fused to form connection between large copper particles. However, the thermal yield stress after strong IPL sintering resulted in cracks of conductive copper film. Thus, a multiple pulse sintering with an off time of 2 s was needed to reach a low resistivity of 10-5 Ω·cm. To increase the light absorption efficiency and to further decrease voids between CuNPs in the copper film, cupric oxide nanoparticles (CuONP) of 50 nm, were also added into ink. The results showed that these CuONPs can be reduced to copper with a single pulse IPL and fused with the surrounding CuNPs. With an optimal CuNP/CuONP weight ratio of 1/80, the copper film showed a lowest resistivity of 7 × 10-5 Ω·cm, ~25% conductivity of bulk copper, with a single sintering energy at 3.08 J/cm2. The ink can be printed on flexible substrates as conductive tracks and the resistance remained nearly the same after 10,000 bending cycles. |
| Author | Lai, Yi-Chin Liao, Ying-Chih Yonezawa, Tetsu Chung, Wan-Yu |
| AuthorAffiliation | 2 Division of Materials Science and Engineering, Hokkaido University, Sapporo 060-0808, Japan 1 Department of Chemical Engineering, National Taiwan University, Taipei 10617, Taiwan |
| AuthorAffiliation_xml | – name: 2 Division of Materials Science and Engineering, Hokkaido University, Sapporo 060-0808, Japan – name: 1 Department of Chemical Engineering, National Taiwan University, Taipei 10617, Taiwan |
| Author_xml | – sequence: 1 givenname: Wan-Yu surname: Chung fullname: Chung, Wan-Yu – sequence: 2 givenname: Yi-Chin surname: Lai fullname: Lai, Yi-Chin – sequence: 3 givenname: Tetsu orcidid: 0000-0001-7371-204X surname: Yonezawa fullname: Yonezawa, Tetsu – sequence: 4 givenname: Ying-Chih orcidid: 0000-0001-9496-4190 surname: Liao fullname: Liao, Ying-Chih |
| BackLink | https://www.ncbi.nlm.nih.gov/pubmed/31349711$$D View this record in MEDLINE/PubMed |
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| Cites_doi | 10.1007/s11664-010-1384-0 10.1039/c3ra41480a 10.1039/C4CC08749F 10.1149/2.0061504jss 10.1039/C7RA01005B 10.1021/acsami.5b12516 10.1039/C6TC00628K 10.1038/srep19696 10.1063/1.4798387 10.1021/acsami.6b14462 10.1039/C6TC04360G 10.1021/am404581b 10.1246/bcsj.20150305 10.1007/s00339-009-5360-6 10.1088/0957-4484/25/26/265601 10.1039/C3NR05479A 10.3390/s19143068 10.1021/nn901868t 10.1039/C6NR00607H 10.1021/acs.langmuir.5b01207 10.3390/ma3094626 10.1021/acsami.5b03061 10.1039/C5RA06599B 10.1039/C5TC00745C 10.1088/1361-6528/aa6cda 10.1016/j.mee.2009.10.043 10.1021/acsami.5b03854 10.1088/2053-1583/aa69b5 10.1016/j.tsf.2016.02.033 10.1021/acs.langmuir.6b01704 10.2352/ISSN.2169-4451.2013.29.1.art00056_2 10.1246/cl.2010.548 10.1021/am302505j |
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| Keywords | copper nanoparticle conductive patterns porosity photonic sintering light absorption |
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| References | Kim (ref_7) 2013; 3 Abargues (ref_11) 2010; 87 Yu (ref_20) 2017; 28 Pan (ref_32) 2016; 28 Kang (ref_13) 2013; 2013 ref_14 Hwang (ref_26) 2016; 8 Yong (ref_28) 2015; 3 Kim (ref_31) 2009; 97 Schuppert (ref_12) 2015; 7 Schulz (ref_2) 2016; 32 Yonezawa (ref_27) 2015; 5 Chen (ref_1) 2015; 4 Chen (ref_21) 2012; 4 Choi (ref_22) 2015; 31 Draper (ref_15) 2015; 7 Yong (ref_29) 2017; 5 Matsubara (ref_17) 2015; 88 Kang (ref_16) 2014; 6 Farraj (ref_24) 2017; 9 Hwang (ref_19) 2016; 6 Marchena (ref_35) 2017; 4 Magdassi (ref_5) 2010; 4 Schulz (ref_3) 2016; 8 Shen (ref_9) 2014; 6 Videla (ref_30) 2013; 113 Ryu (ref_18) 2011; 40 Huang (ref_25) 2017; 7 Joo (ref_33) 2014; 25 Magdassi (ref_6) 2010; 3 Abargues (ref_10) 2009; 26 Albrecht (ref_4) 2016; 4 Yonezawa (ref_8) 2010; 39 Jeon (ref_34) 2016; 603 Farraj (ref_23) 2015; 51 |
| References_xml | – volume: 40 start-page: 42 year: 2011 ident: ref_18 article-title: Reactive sintering of copper nanoparticles using intense pulsed light for printed electronics publication-title: J. Electron. Mater. doi: 10.1007/s11664-010-1384-0 – volume: 3 start-page: 15169 year: 2013 ident: ref_7 article-title: Synthesis of oxidation-resistant core–shell copper nanoparticles publication-title: RSC Adv. doi: 10.1039/c3ra41480a – volume: 51 start-page: 1587 year: 2015 ident: ref_23 article-title: Self-reduction of a copper complex mod ink for inkjet printing conductive patterns on plastics publication-title: Chem. Commun. doi: 10.1039/C4CC08749F – volume: 28 start-page: 817 year: 2016 ident: ref_32 article-title: Investigations of cuprous oxide and cupric oxide thin films by controlling the deposition atmosphere in the reactive sputtering method publication-title: Sens. Mater. – volume: 4 start-page: P3026 year: 2015 ident: ref_1 article-title: Inkjet printed conductive tracks for printed electronics publication-title: ECS J. Solid State Sci. Technol. doi: 10.1149/2.0061504jss – volume: 7 start-page: 25095 year: 2017 ident: ref_25 article-title: Stabilization of the thermal decomposition process of self-reducible copper ion ink for direct printed conductive patterns publication-title: RSC Adv. doi: 10.1039/C7RA01005B – volume: 8 start-page: 8591 year: 2016 ident: ref_26 article-title: Intensive plasmonic flash light sintering of copper nanoinks using a band-pass light filter for highly electrically conductive electrodes in printed electronics publication-title: ACS Appl. Mater. Interfaces doi: 10.1021/acsami.5b12516 – volume: 4 start-page: 3546 year: 2016 ident: ref_4 article-title: Inkjet printing and photonic sintering of silver and copper oxide nanoparticles for ultra-low-cost conductive patterns publication-title: J. Mater. Chem. C doi: 10.1039/C6TC00628K – volume: 6 start-page: 19696 year: 2016 ident: ref_19 article-title: All-photonic drying and sintering process via flash white light combined with deep-uv and near-infrared irradiation for highly conductive copper nano-ink publication-title: Sci. Rep. doi: 10.1038/srep19696 – volume: 113 start-page: 134305 year: 2013 ident: ref_30 article-title: Analysis of the structure, configuration, and sizing of cu and cu oxide nanoparticles generated by fs laser ablation of solid target in liquids publication-title: J. Appl. Phys. doi: 10.1063/1.4798387 – volume: 9 start-page: 8766 year: 2017 ident: ref_24 article-title: Plasma-induced decomposition of copper complex ink for the formation of highly conductive copper tracks on heat-sensitive substrates publication-title: ACS Appl. Mater. Interfaces doi: 10.1021/acsami.6b14462 – volume: 5 start-page: 1033 year: 2017 ident: ref_29 article-title: Use of decomposable polymer-coated submicron cu particles with effective additive for production of highly conductive cu films at low sintering temperature publication-title: J. Mater. Chem. C doi: 10.1039/C6TC04360G – volume: 6 start-page: 1682 year: 2014 ident: ref_16 article-title: Direct intense pulsed light sintering of inkjet-printed copper oxide layers within six milliseconds publication-title: ACS Appl. Mater. Interfaces doi: 10.1021/am404581b – volume: 88 start-page: 1755 year: 2015 ident: ref_17 article-title: Effect of glass transition temperature of stabilizing polymer of air-stable gelatin-stabilized copper fine particles during redox two-step low-temperature sintering process publication-title: Bull. Chem. Soc. Jpn. doi: 10.1246/bcsj.20150305 – volume: 97 start-page: 791 year: 2009 ident: ref_31 article-title: Intense pulsed light sintering of copper nanoink for printed electronics publication-title: Appl. Phys. A Mater. Sci. Process. doi: 10.1007/s00339-009-5360-6 – volume: 25 start-page: 265601 year: 2014 ident: ref_33 article-title: Highly conductive copper nano/microparticles ink via flash light sintering for printed electronics publication-title: Nanotechnology doi: 10.1088/0957-4484/25/26/265601 – volume: 6 start-page: 1622 year: 2014 ident: ref_9 article-title: Preparation of solid silver nanoparticles for inkjet printed flexible electronics with high conductivity publication-title: Nanoscale doi: 10.1039/C3NR05479A – ident: ref_14 doi: 10.3390/s19143068 – volume: 4 start-page: 1943 year: 2010 ident: ref_5 article-title: Triggering the sintering of silver nanoparticles at room temperature publication-title: ACS Nano doi: 10.1021/nn901868t – volume: 8 start-page: 7296 year: 2016 ident: ref_3 article-title: Effective pegylation of gold nanorods publication-title: Nanoscale doi: 10.1039/C6NR00607H – volume: 31 start-page: 8101 year: 2015 ident: ref_22 article-title: Effect of the amine concentration on phase evolution and densification in printed films using cu (ii) complex ink publication-title: Langmuir doi: 10.1021/acs.langmuir.5b01207 – volume: 3 start-page: 4626 year: 2010 ident: ref_6 article-title: Copper nanoparticles for printed electronics: Routes towards achieving oxidation stability publication-title: Materials doi: 10.3390/ma3094626 – volume: 26 start-page: 2825 year: 2009 ident: ref_10 article-title: Au-pva nanocomposite negative resist for one-step three-dimensional e-beam lithography publication-title: Langmuir – volume: 7 start-page: 18273 year: 2015 ident: ref_12 article-title: Inkjet fabrication of copper patterns for flexible electronics: Using paper with active precoatings publication-title: ACS Appl. Mater. Interfaces doi: 10.1021/acsami.5b03061 – volume: 5 start-page: 61290 year: 2015 ident: ref_27 article-title: Low-temperature nanoredox two-step sintering of gelatin nanoskin-stabilized submicrometer-sized copper fine particles for preparing highly conductive layers publication-title: RSC Adv. doi: 10.1039/C5RA06599B – volume: 3 start-page: 5890 year: 2015 ident: ref_28 article-title: The mechanism of alkylamine-stabilized copper fine particles towards improving the electrical conductivity of copper films at low sintering temperature publication-title: J. Mater. Chem. C doi: 10.1039/C5TC00745C – volume: 28 start-page: 205205 year: 2017 ident: ref_20 article-title: Multi-pulse flash light sintering of bimodal cu nanoparticle-ink for highly conductive printed cu electrodes publication-title: Nanotechnology doi: 10.1088/1361-6528/aa6cda – volume: 87 start-page: 1147 year: 2010 ident: ref_11 article-title: Resist-based silver nanocomposites synthesized by lithographic methods publication-title: Microelectron. Eng. doi: 10.1016/j.mee.2009.10.043 – volume: 7 start-page: 16478 year: 2015 ident: ref_15 article-title: Fabrication of elemental copper by intense pulsed light processing of a copper nitrate hydroxide ink publication-title: ACS Appl. Mater. Interfaces doi: 10.1021/acsami.5b03854 – volume: 4 start-page: 025088 year: 2017 ident: ref_35 article-title: Direct growth of 2d and 3d graphene nano-structures over large glass substrates by tuning a sacrificial cu-template layer publication-title: 2D Mater. doi: 10.1088/2053-1583/aa69b5 – volume: 603 start-page: 382 year: 2016 ident: ref_34 article-title: Two-step flash light sintering process for enhanced adhesion between copper complex ion/silane ink and a flexible substrate publication-title: Thin Solid Film. doi: 10.1016/j.tsf.2016.02.033 – volume: 32 start-page: 7897 year: 2016 ident: ref_2 article-title: Ligand layer engineering to control stability and interfacial properties of nanoparticles publication-title: Langmuir doi: 10.1021/acs.langmuir.6b01704 – volume: 2013 start-page: 494 year: 2013 ident: ref_13 article-title: Photonic Sintering of Inkjet Printed Copper Oxide Layer publication-title: NIP Digit. Fabr. Conf. doi: 10.2352/ISSN.2169-4451.2013.29.1.art00056_2 – volume: 39 start-page: 548 year: 2010 ident: ref_8 article-title: One-pot preparation of antioxidized copper fine particles with a unique structure by chemical reduction at room temperature publication-title: Chem. Lett. doi: 10.1246/cl.2010.548 – volume: 4 start-page: 7064 year: 2012 ident: ref_21 article-title: Silver conductive features on flexible substrates from a thermally accelerated chain reaction at low sintering temperatures publication-title: ACS Appl. Mater. Interfaces doi: 10.1021/am302505j |
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| Snippet | In this study, an ink formulation was developed to prepare conductive copper thin films with compact structure by using intense pulsed light (IPL) sintering.... |
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| SubjectTerms | conductive patterns Conductivity Copper copper nanoparticle Copper oxides Cracks Decomposition Electrical resistivity Electromagnetic absorption Glass substrates High temperature light absorption Nanoparticles Oxidation photonic sintering Photonics porosity Sintering Substrates Thin films Yield stress |
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| Title | Sintering Copper Nanoparticles with Photonic Additive for Printed Conductive Patterns by Intense Pulsed Light |
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