APA (7th ed.) Citation

Chung, W., Lai, Y., Yonezawa, T., & Liao, Y. (2019). Sintering Copper Nanoparticles with Photonic Additive for Printed Conductive Patterns by Intense Pulsed Light. Nanomaterials (Basel, Switzerland), 9(8), 1071. https://doi.org/10.3390/nano9081071

Chicago Style (17th ed.) Citation

Chung, Wan-Yu, Yi-Chin Lai, Tetsu Yonezawa, and Ying-Chih Liao. "Sintering Copper Nanoparticles with Photonic Additive for Printed Conductive Patterns by Intense Pulsed Light." Nanomaterials (Basel, Switzerland) 9, no. 8 (2019): 1071. https://doi.org/10.3390/nano9081071.

MLA (9th ed.) Citation

Chung, Wan-Yu, et al. "Sintering Copper Nanoparticles with Photonic Additive for Printed Conductive Patterns by Intense Pulsed Light." Nanomaterials (Basel, Switzerland), vol. 9, no. 8, 2019, p. 1071, https://doi.org/10.3390/nano9081071.