Low-temperature direct copper-to-copper bonding enabled by creep on (111) surfaces of nanotwinned Cu - Liu, Chien-Min; Lin, Han-Wen; Huang, Yi-Sa; Chu, Yi-Cheng; Chen, Chih; Lyu, Dian-Rong; Chen, Kuan-Neng; Tu, King-Ning (Scientific reports, 2015)
Keywords: 121/143; 639/301/1005/1007; 639/301/357/995; Copper; Electron microscopy; Grain boundaries; Humanities and Social Sciences; Low temperature; multidisciplinary; Science; Temperature effects; Transmission electron microscopy