Sn–Ag–Cu nanosolders: Melting behavior and phase diagram prediction in the Sn-rich corner of the ternary system
Melting temperatures of Sn–Ag–Cu (SAC) alloys in the Sn-rich corner are of interest for lead-free soldering. At the same time, nanoparticle solders with depressed melting temperatures close to the Sn–Pb eutectic temperature have received increasing attention. Recently, the phase stability of nanopar...
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| Published in | Calphad Vol. 49; pp. 101 - 109 |
|---|---|
| Main Authors | , , , , |
| Format | Journal Article |
| Language | English |
| Published |
Netherlands
Elsevier Ltd
01.06.2015
Elsevier B.V |
| Subjects | |
| Online Access | Get full text |
| ISSN | 0364-5916 1873-2984 |
| DOI | 10.1016/j.calphad.2015.04.003 |
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| Abstract | Melting temperatures of Sn–Ag–Cu (SAC) alloys in the Sn-rich corner are of interest for lead-free soldering. At the same time, nanoparticle solders with depressed melting temperatures close to the Sn–Pb eutectic temperature have received increasing attention. Recently, the phase stability of nanoparticles has been the subject of plenty of theoretical and empirical investigations. In the present study, SAC nanoparticles of various sizes have been synthesized via chemical reduction and the size dependent melting point depression of these particles has been specified experimentally. The liquidus projection in the Sn-rich corner of the ternary SAC system has also been calculated as a function of particle size, based on the CALPHAD-approach. The calculated melting temperatures were compared with those obtained experimentally and with values reported in the literature, which revealed good agreement. The model also predicts that with decreasing particle size, the eutectic composition shifts towards the Sn-rich corner.
•The first CALPHAD-type modeling of a ternary system that includes the size effect.•Sn–3.8Ag–0.7Cu nanoparticles of different size were synthesized via chemical reduction.•The liquidus projection in the Sn-rich corner was calculated as a function of particle size.•The size dependent melting depression behavior of nanoparticles was verified.•The eutectic composition changed towards the Sn-rich corner with decreasing particle size. |
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| AbstractList | Melting temperatures of Sn–Ag–Cu (SAC) alloys in the Sn-rich corner are of interest for lead-free soldering. At the same time, nanoparticle solders with depressed melting temperatures close to the Sn–Pb eutectic temperature have received increasing attention. Recently, the phase stability of nanoparticles has been the subject of plenty of theoretical and empirical investigations. In the present study, SAC nanoparticles of various sizes have been synthesized via chemical reduction and the size dependent melting point depression of these particles has been specified experimentally. The liquidus projection in the Sn-rich corner of the ternary SAC system has also been calculated as a function of particle size, based on the CALPHAD-approach. The calculated melting temperatures were compared with those obtained experimentally and with values reported in the literature, which revealed good agreement. The model also predicts that with decreasing particle size, the eutectic composition shifts towards the Sn-rich corner.
•The first CALPHAD-type modeling of a ternary system that includes the size effect.•Sn–3.8Ag–0.7Cu nanoparticles of different size were synthesized via chemical reduction.•The liquidus projection in the Sn-rich corner was calculated as a function of particle size.•The size dependent melting depression behavior of nanoparticles was verified.•The eutectic composition changed towards the Sn-rich corner with decreasing particle size. Melting temperatures of Sn–Ag–Cu (SAC) alloys in the Sn-rich corner are of interest for lead-free soldering. At the same time, nanoparticle solders with depressed melting temperatures close to the Sn–Pb eutectic temperature have received increasing attention. Recently, the phase stability of nanoparticles has been the subject of plenty of theoretical and empirical investigations. In the present study, SAC nanoparticles of various sizes have been synthesized via chemical reduction and the size dependent melting point depression of these particles has been specified experimentally. The liquidus projection in the Sn-rich corner of the ternary SAC system has also been calculated as a function of particle size, based on the CALPHAD-approach. The calculated melting temperatures were compared with those obtained experimentally and with values reported in the literature, which revealed good agreement. The model also predicts that with decreasing particle size, the eutectic composition shifts towards the Sn-rich corner. • The first CALPHAD-type modeling of a ternary system that includes the size effect. • Sn–3.8Ag–0.7Cu nanoparticles of different size were synthesized via chemical reduction. • The liquidus projection in the Sn-rich corner was calculated as a function of particle size. • The size dependent melting depression behavior of nanoparticles was verified. • The eutectic composition changed towards the Sn-rich corner with decreasing particle size. Melting temperatures of Sn-Ag-Cu (SAC) alloys in the Sn-rich corner are of interest for lead-free soldering. At the same time, nanoparticle solders with depressed melting temperatures close to the Sn-Pb eutectic temperature have received increasing attention. Recently, the phase stability of nanoparticles has been the subject of plenty of theoretical and empirical investigations. In the present study, SAC nanoparticles of various sizes have been synthesized via chemical reduction and the size dependent melting point depression of these particles has been specified experimentally. The liquidus projection in the Sn-rich corner of the ternary SAC system has also been calculated as a function of particle size, based on the CALPHAD-approach. The calculated melting temperatures were compared with those obtained experimentally and with values reported in the literature, which revealed good agreement. The model also predicts that with decreasing particle size, the eutectic composition shifts towards the Sn-rich corner.Melting temperatures of Sn-Ag-Cu (SAC) alloys in the Sn-rich corner are of interest for lead-free soldering. At the same time, nanoparticle solders with depressed melting temperatures close to the Sn-Pb eutectic temperature have received increasing attention. Recently, the phase stability of nanoparticles has been the subject of plenty of theoretical and empirical investigations. In the present study, SAC nanoparticles of various sizes have been synthesized via chemical reduction and the size dependent melting point depression of these particles has been specified experimentally. The liquidus projection in the Sn-rich corner of the ternary SAC system has also been calculated as a function of particle size, based on the CALPHAD-approach. The calculated melting temperatures were compared with those obtained experimentally and with values reported in the literature, which revealed good agreement. The model also predicts that with decreasing particle size, the eutectic composition shifts towards the Sn-rich corner. Melting temperatures of Sn-Ag-Cu (SAC) alloys in the Sn-rich corner are of interest for lead-free soldering. At the same time, nanoparticle solders with depressed melting temperatures close to the Sn-Pb eutectic temperature have received increasing attention. Recently, the phase stability of nanoparticles has been the subject of plenty of theoretical and empirical investigations. In the present study, SAC nanoparticles of various sizes have been synthesized via chemical reduction and the size dependent melting point depression of these particles has been specified experimentally. The liquidus projection in the Sn-rich corner of the ternary SAC system has also been calculated as a function of particle size, based on the CALPHAD-approach. The calculated melting temperatures were compared with those obtained experimentally and with values reported in the literature, which revealed good agreement. The model also predicts that with decreasing particle size, the eutectic composition shifts towards the Sn-rich corner. |
| Author | Roshanghias, Ali Ipser, Herbert Yakymovych, Andriy Richter, Klaus W. Vrestal, Jan |
| AuthorAffiliation | b Masaryk University, CEITEC MU, Brno, Czech Republic a Department of Inorganic Chemistry (Materials Chemistry), University of Vienna, A-1090 Vienna, Austria |
| AuthorAffiliation_xml | – name: a Department of Inorganic Chemistry (Materials Chemistry), University of Vienna, A-1090 Vienna, Austria – name: b Masaryk University, CEITEC MU, Brno, Czech Republic |
| Author_xml | – sequence: 1 givenname: Ali surname: Roshanghias fullname: Roshanghias, Ali email: Ali.roshanghias@univie.ac.at organization: Department of Inorganic Chemistry (Materials Chemistry), University of Vienna, A-1090 Vienna, Austria – sequence: 2 givenname: Jan surname: Vrestal fullname: Vrestal, Jan organization: Masaryk University, CEITEC MU, Brno, Czech Republic – sequence: 3 givenname: Andriy surname: Yakymovych fullname: Yakymovych, Andriy organization: Department of Inorganic Chemistry (Materials Chemistry), University of Vienna, A-1090 Vienna, Austria – sequence: 4 givenname: Klaus W. surname: Richter fullname: Richter, Klaus W. organization: Department of Inorganic Chemistry (Materials Chemistry), University of Vienna, A-1090 Vienna, Austria – sequence: 5 givenname: Herbert surname: Ipser fullname: Ipser, Herbert organization: Department of Inorganic Chemistry (Materials Chemistry), University of Vienna, A-1090 Vienna, Austria |
| BackLink | https://www.ncbi.nlm.nih.gov/pubmed/26082567$$D View this record in MEDLINE/PubMed |
| BookMark | eNqFUs2O0zAYtNAitlt4BJCPXBLsxD8JSKBVxZ-0iMPC2XLsz42rxC52WmlvvANvyJOQ0i4CLr3Ykr-Z-UaeuUIXIQZA6CklJSVUvNiURg_bXtuyIpSXhJWE1A_QgjayLqq2YRdoQWrBCt5ScYmuct4QQmRds0foshKkqbiQC5Rvw8_vP67X87Ha4aBDzHGwkPJL_AmGyYc17qDXex8T1sHieWMGbL1eJz3ibQLrzeRjwD7gqQd8G4rkTY9NTAESju736wQp6HSH812eYHyMHjo9ZHhyupfo67u3X1YfipvP7z-urm8KwwmZCuqYtK4WXacbWxOgunOcttJywzpXtYxQWTedocRS7UzHbdu0smLAhCMOeL1Er4-62103gjUQpqQHtU1-nM2oqL36dxJ8r9Zxrxjjgs7iS_T8JJDitx3kSY0-GxgGHSDusqJNJQSVomLnoZI2rWiIPKg--9vWHz_3ocyAV0eASTHnBE4ZP-nDL88u_aAoUYcKqI06VUAdKqAIU3MFZjb_j32_4BzvzZEHcyR7D0ll4yGYOeEEZlI2-jMKvwDVlNHX |
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| ContentType | Journal Article |
| Copyright | 2015 The Authors 2015 The Authors 2015 |
| Copyright_xml | – notice: 2015 The Authors – notice: 2015 The Authors 2015 |
| DBID | 6I. AAFTH AAYXX CITATION NPM 7SC 8BQ 8FD H8G JG9 JQ2 L7M L~C L~D 7X8 5PM |
| DOI | 10.1016/j.calphad.2015.04.003 |
| DatabaseName | ScienceDirect Open Access Titles Elsevier:ScienceDirect:Open Access CrossRef PubMed Computer and Information Systems Abstracts METADEX Technology Research Database Copper Technical Reference Library Materials Research Database ProQuest Computer Science Collection Advanced Technologies Database with Aerospace Computer and Information Systems Abstracts Academic Computer and Information Systems Abstracts Professional MEDLINE - Academic PubMed Central (Full Participant titles) |
| DatabaseTitle | CrossRef PubMed Materials Research Database Copper Technical Reference Library Technology Research Database Computer and Information Systems Abstracts – Academic ProQuest Computer Science Collection Computer and Information Systems Abstracts Advanced Technologies Database with Aerospace METADEX Computer and Information Systems Abstracts Professional MEDLINE - Academic |
| DatabaseTitleList | MEDLINE - Academic Materials Research Database PubMed |
| Database_xml | – sequence: 1 dbid: NPM name: PubMed url: https://proxy.k.utb.cz/login?url=http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed sourceTypes: Index Database |
| DeliveryMethod | fulltext_linktorsrc |
| Discipline | Chemistry |
| EISSN | 1873-2984 |
| EndPage | 109 |
| ExternalDocumentID | PMC4456117 26082567 10_1016_j_calphad_2015_04_003 S0364591615001479 |
| Genre | Journal Article |
| GroupedDBID | --K --M .~1 0R~ 1B1 1~. 1~5 29B 4.4 457 4G. 5GY 5VS 6I. 7-5 71M 8P~ 9JN AABXZ AAEDT AAEDW AAEPC AAFTH AAIKJ AAKOC AALRI AAOAW AAQFI AATTM AAXKI AAXUO AAYWO ABJNI ABMAC ABXDB ABXRA ACDAQ ACGFS ACNNM ACRLP ADBBV ADEZE AEBSH AEIPS AEKER AEZYN AFJKZ AFRZQ AFTJW AGCQF AGHFR AGUBO AGYEJ AHHHB AI. AIEXJ AIIUN AIKHN AITUG ALMA_UNASSIGNED_HOLDINGS AMRAJ ANKPU APXCP ASPBG AVWKF AXJTR AZFZN BKOJK BLXMC CS3 EBS EFJIC EFKBS EJD EO8 EO9 EP2 EP3 FDB FEDTE FGOYB FIRID FNPLU FYGXN G-2 G-Q GBLVA HVGLF HZ~ IHE J1W KOM M24 M41 MAGPM MO0 N9A O-L O9- OAUVE OZT P-8 P-9 PC. Q38 R2- RNS ROL RPZ SDF SDG SES SEW SMS SPC SPCBC SSM SSZ T5K UHS VH1 WUQ XPP ~G- AAYXX AGRNS BNPGV CITATION RIG SSH AFXIZ NPM 7SC 8BQ 8FD H8G JG9 JQ2 L7M L~C L~D 7X8 5PM |
| ID | FETCH-LOGICAL-c500t-1f47df36bba8d30e1abf5197d5c4bf29401738bc10d1afcb5d989724e46f0fe53 |
| IEDL.DBID | .~1 |
| ISSN | 0364-5916 |
| IngestDate | Thu Aug 21 18:17:12 EDT 2025 Thu Jul 10 18:27:16 EDT 2025 Mon Jul 21 09:33:26 EDT 2025 Mon Jul 21 05:49:42 EDT 2025 Tue Jul 01 03:00:16 EDT 2025 Thu Apr 24 23:00:59 EDT 2025 Tue Aug 26 06:13:04 EDT 2025 |
| IsDoiOpenAccess | true |
| IsOpenAccess | true |
| IsPeerReviewed | true |
| IsScholarly | true |
| Keywords | Nanoparticles CALPHAD Lead free solders Size effect Melting point depression |
| Language | English |
| License | http://creativecommons.org/licenses/by/4.0 This is an open access article under the CC BY license (http://creativecommons.org/licenses/by/4.0/). |
| LinkModel | DirectLink |
| MergedId | FETCHMERGED-LOGICAL-c500t-1f47df36bba8d30e1abf5197d5c4bf29401738bc10d1afcb5d989724e46f0fe53 |
| Notes | ObjectType-Article-1 SourceType-Scholarly Journals-1 ObjectType-Feature-2 content type line 23 |
| OpenAccessLink | https://www.sciencedirect.com/science/article/pii/S0364591615001479 |
| PMID | 26082567 |
| PQID | 1718968077 |
| PQPubID | 23500 |
| PageCount | 9 |
| ParticipantIDs | pubmedcentral_primary_oai_pubmedcentral_nih_gov_4456117 proquest_miscellaneous_1826617624 proquest_miscellaneous_1718968077 pubmed_primary_26082567 crossref_citationtrail_10_1016_j_calphad_2015_04_003 crossref_primary_10_1016_j_calphad_2015_04_003 elsevier_sciencedirect_doi_10_1016_j_calphad_2015_04_003 |
| ProviderPackageCode | CITATION AAYXX |
| PublicationCentury | 2000 |
| PublicationDate | June 2015 2015-06-00 2015-Jun 20150601 |
| PublicationDateYYYYMMDD | 2015-06-01 |
| PublicationDate_xml | – month: 06 year: 2015 text: June 2015 |
| PublicationDecade | 2010 |
| PublicationPlace | Netherlands |
| PublicationPlace_xml | – name: Netherlands |
| PublicationTitle | Calphad |
| PublicationTitleAlternate | CALPHAD |
| PublicationYear | 2015 |
| Publisher | Elsevier Ltd Elsevier B.V |
| Publisher_xml | – name: Elsevier Ltd – name: Elsevier B.V |
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| SSID | ssj0007334 |
| Score | 2.213149 |
| Snippet | Melting temperatures of Sn–Ag–Cu (SAC) alloys in the Sn-rich corner are of interest for lead-free soldering. At the same time, nanoparticle solders with... Melting temperatures of Sn-Ag-Cu (SAC) alloys in the Sn-rich corner are of interest for lead-free soldering. At the same time, nanoparticle solders with... |
| SourceID | pubmedcentral proquest pubmed crossref elsevier |
| SourceType | Open Access Repository Aggregation Database Index Database Enrichment Source Publisher |
| StartPage | 101 |
| SubjectTerms | CALPHAD COMPUTER SIMULATION Corners Lead free solders MATHEMATICAL ANALYSIS Mathematical models Melting Melting point depression MICROSTRUCTURES Nanoparticles Nanostructure Phase diagrams Phase transformations Size effect Tin TIN ALLOYS (50 TO 99 SN) Tin base alloys |
| Title | Sn–Ag–Cu nanosolders: Melting behavior and phase diagram prediction in the Sn-rich corner of the ternary system |
| URI | https://dx.doi.org/10.1016/j.calphad.2015.04.003 https://www.ncbi.nlm.nih.gov/pubmed/26082567 https://www.proquest.com/docview/1718968077 https://www.proquest.com/docview/1826617624 https://pubmed.ncbi.nlm.nih.gov/PMC4456117 |
| Volume | 49 |
| hasFullText | 1 |
| inHoldings | 1 |
| isFullTextHit | |
| isPrint | |
| link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwnV1Lb9QwELaqcoAL4s3yqIzENd147dgOt1VEtTxaIZZKvVl2bNOtKu9qHwcuiP_AP-SXMJPHlqUSlbgkSjKWHM9kHvHMN4S8ZjGPIyVD5iV3mbAxgB7kMcuLCALm61EZsN75-EROTsX7s-Jsj1R9LQymVXa6v9Xpjbbu7gy71RwuZrPhtNlBK9FjQT9fYRGfEAql_PD7VZqH4ryDkBIZUl9V8QwvIATEglYEDGVFg3ja9866bp-u-59_p1H-YZeO7pG7nUNJx-2c75O9kB6Q21Xfx-0hWU3Trx8_x1_hUG1osmkO4obpy2_ocbjErGfa1-pTmzyFqa4CBbHBvC26WOJODnKPzhIFb5FOUwa685xC2JrCks5jc7f5r7j8Rltk6Efk9Ojtl2qSda0WshpWb52xKJSPXDpnted5YNZFLGn1RS1cHJUQhSmuXc1yz2ysXeFLXaqRCEICs0PBH5P9NE_hKaGOywhBKRB4LYLVVmgfYs1LFoNXXg6I6BfY1B0OObbDuDR9wtmF6fhikC8mFwhgOiCH22GLFojjpgG6557ZkSgDxuKmoa96bhtgFm6h2BTmm5VhYMpLqXOl_kGj0ekBIyMG5EkrIdsZQ_QIIbmE0WpHdrYEiPa9-yTNzhvUb4GuLlPP_v-1npM7eNUmur0g--vlJrwEl2rtDppv5oDcGlefP37C87sPk5Pffa8n-Q |
| linkProvider | Elsevier |
| linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwnV07b9swED6kzpAuRdKnmz5YoKtqyaREqpthNHCa2IsTIBshimTjIKANP4Zu_Q_9h_0lvdPDjRugAbpoIHkAxTvdQ7z7DuBj4mPfl5mLbMZNJArvUA9yH8WpRwGzZT93VO88nmSjS_H1Kr3ag2FbC0NplY3ur3V6pa2bkV5zmr3FbNabVjdoOXks5OfL_BHsEzpV2oH9wenZaLJVyJLzBkVKRETwp5Cnd4NRINW0EmZoklagp237rPsm6r4L-ncm5R3TdHIITxqfkg3qbR_BngtP4WDYtnJ7Bqtp-PXj5-AbPoYbFoowR4mjDObPbOxuKfGZteX6rAiW4VZXjqHkUOoWWyzpMocYyGaBocPIpiFC9XnNMHINbsnmvhqtfi0uv7MaHPo5XJ58uRiOoqbbQlTiAa6jxAtpPc-MKZTlsUsK46mq1aalML6fYyAmuTJlEtuk8KVJba5y2RdOZMhvl_IX0Anz4F4BMzzzGJfiAquEK1QhlHW-5HninZU264JoD1iXDRQ5dcS41W3O2Y1u-KKJLzoWhGHahU9bskWNxfEQgWq5p3eESqO9eIj0Q8ttjcyiW5QiuPlmpRO05nmmYin_sUaR34N2RnThZS0h2x1jAIlReYbUckd2tgsI8Ht3JsyuK-BvQd5uIl___2u9h4PRxfhcn59Ozo7hMc3UeW9voLNebtxb9LDW5l3zBf0GN9MpFQ |
| openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Ajournal&rft.genre=article&rft.atitle=Sn-Ag-Cu+nanosolders%3A+Melting+behavior+and+phase+diagram+prediction+in+the+Sn-rich+corner+of+the+ternary+system&rft.jtitle=Calphad&rft.au=Roshanghias%2C+Ali&rft.au=Vrestal%2C+Jan&rft.au=Yakymovych%2C+Andriy&rft.au=Richter%2C+Klaus+W&rft.date=2015-06-01&rft.issn=0364-5916&rft.volume=49&rft.spage=101&rft.epage=109&rft_id=info:doi/10.1016%2Fj.calphad.2015.04.003&rft.externalDBID=NO_FULL_TEXT |
| thumbnail_l | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/lc.gif&issn=0364-5916&client=summon |
| thumbnail_m | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/mc.gif&issn=0364-5916&client=summon |
| thumbnail_s | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/sc.gif&issn=0364-5916&client=summon |