Structure, microparameters and properties of crosslinked DGEBA/MTHPA: A molecular dynamics simulation

• Published in: AIP advances Vol. 8; no. 7; pp. 075332 - 075332-14
• Main Authors: Xie, Qing, Liang, Shaodong, Liu, Bowen, Fu, Kexin, Zhan, Zhenyu, Lu, Lu, Yang, Xueming, Lü, Fangcheng, Huang, Zhengyong
• Format: Journal Article
• Language: English
• Published: Melville American Institute of Physics 01.07.2018; AIP Publishing LLC
• Subjects: Anhydrides; Computer simulation; Crosslinking; Curing agents; Density; Dependence; Epoxy resins; Glass transition temperature; High voltages; Insulation; Mathematical models; Mechanical properties; Molecular dynamics; Process parameters; Thermal expansion; Thermodynamic properties

Investigating the relationship between microstructure and macroscopic properties of epoxy resin (EP) materials for high-voltage insulation at the molecular level can provide theoretical guidance for the synthetic design of EP. Here, using diglycidyl ether (DGEBA) as the resin matrix and methyl tetra...