Interfacial structure of nanostructured Cu-Nb filamentary composite fabricated by the bundling and drawing process

• Published in: Philosophical magazine letters Vol. 84; no. 8; pp. 515 - 523
• Main Authors: Lee, K. H., Hong †, S. I.
• Format: Journal Article
• Language: English
• Published: London Taylor & Francis Group 01.07.2004; Taylor & Francis
• Subjects: Composition; defects and impurities; Condensed matter: structure, mechanical and thermal properties; Exact sciences and technology; Physics; Solid surfaces and solid-solid interfaces; Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties); Drawing; Misfit dislocations; Composite materials; Transmission electron microscopy; Matrix fiber interface; Moire fringes; Nanostructures; Copper; Wire; Inclination
• ISSN: 0950-0839; 1362-3036
• DOI: 10.1080/09500830412331298877

A high-resolution electron microscope (HREM) has been used to study the interfacial structure of Cu-Nb filamentary composites fabricated by the bundling and drawing process. At the matrix/filament interface, misfit interface dislocations were introduced periodically to relieve the misfit strain. The spacing between interfacial misfit dislocations for the interface between (1 1) Cu and (10 ) Nb planes was observed to vary with the local tilt angle of the interface. The moiré fringes appeared in association with interfacial dislocations and the spacing between moiré fringes was found to be quite close to that between interfacial dislocations.