Ultralow Thermal Conductivity, Multiband Electronic Structure and High Thermoelectric Figure of Merit in TlCuSe

• Published in: Advanced materials (Weinheim) Vol. 33; no. 44; pp. e2104908 - n/a
• Main Authors: Lin, Wenwen, He, Jiangang, Su, Xianli, Zhang, Xiaomi, Xia, Yi, Bailey, Trevor P., Stoumpos, Constantinos C., Tan, Ganjian, Rettie, Alexander J. E., Chung, Duck Young, Dravid, Vinayak P., Uher, Ctirad, Wolverton, Chris, Kanatzidis, Mercouri G.
• Format: Journal Article
• Language: English
• Published: Weinheim Wiley Subscription Services, Inc 01.11.2021; Wiley Blackwell (John Wiley & Sons)
• Subjects: Acoustic velocity; Anharmonicity; Atomic properties; Bonding strength; chalcogenides; Chemical bonds; Conductivity; Electrical resistivity; Electronic structure; Electrons; Energy conversion; Entanglement; Figure of merit; Heat conductivity; Heat transfer; Materials science; narrow‐gap semiconductors; Phonons; Power factor; Seebeck effect; Tetrahedra; Thermal conductivity; Thermoelectric materials; Valence band

The entanglement of lattice thermal conductivity, electrical conductivity, and Seebeck coefficient complicates the process of optimizing thermoelectric performance in most thermoelectric materials. Semiconductors with ultralow lattice thermal conductivities and high power factors at the same time ar...