Ultralow Thermal Conductivity, Multiband Electronic Structure and High Thermoelectric Figure of Merit in TlCuSe - Lin, Wenwen; He, Jiangang; Su, Xianli; Zhang, Xiaomi; Xia, Yi; Bailey, Trevor P.; Stoumpos, Constantinos C.; Tan, Ganjian; Rettie, Alexander J. E.; Chung, Duck Young; Dravid, Vinayak P.; Uher, Ctirad; et al. (Advanced materials (Weinheim), 2021)
Keywords: Acoustic velocity; Anharmonicity; Atomic properties; Bonding strength; chalcogenides; Chemical bonds; Conductivity; Electrical resistivity; Electronic structure; Electrons; Energy conversion; Entanglement; Figure of merit; Heat conductivity; Heat transfer; Materials science; narrow‐gap semiconductors; Phonons; Power factor; Seebeck effect; Tetrahedra; Thermal conductivity; Thermoelectric materials; Valence band