APA (7th ed.) Citation

Lin, W., He, J., Su, X., Zhang, X., Xia, Y., Bailey, T. P., . . . Kanatzidis, M. G. (2021). Ultralow Thermal Conductivity, Multiband Electronic Structure and High Thermoelectric Figure of Merit in TlCuSe. Advanced materials (Weinheim), 33(44), e2104908-n/a. https://doi.org/10.1002/adma.202104908

Chicago Style (17th ed.) Citation

Lin, Wenwen, et al. "Ultralow Thermal Conductivity, Multiband Electronic Structure and High Thermoelectric Figure of Merit in TlCuSe." Advanced Materials (Weinheim) 33, no. 44 (2021): e2104908-n/a. https://doi.org/10.1002/adma.202104908.

MLA (9th ed.) Citation

Lin, Wenwen, et al. "Ultralow Thermal Conductivity, Multiband Electronic Structure and High Thermoelectric Figure of Merit in TlCuSe." Advanced Materials (Weinheim), vol. 33, no. 44, 2021, pp. e2104908-n/a, https://doi.org/10.1002/adma.202104908.