Comb Capacitor Structures for On-Chip Physical Uncloneable Function

• Published in: IEEE transactions on semiconductor manufacturing Vol. 22; no. 1; pp. 96 - 102
• Main Authors: Roy, D., Klootwijk, J.H., Verhaegh, N., Roosen, H., Wolters, R.
• Format: Journal Article
• Language: English
• Published: New York, NY IEEE 01.02.2009; Institute of Electrical and Electronics Engineers; The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
• Subjects: Applied sciences; Capacitance; Capacitance measurement; Capacitors; Chips; Coating; Coatings; Comb capacitors; Data security; Dielectric measurements; Dielectric, amorphous and glass solid devices; Electric fields; Electronics; Exact sciences and technology; Information security; Mathematical models; Memory; Metallization; Microelectronic fabrication (materials and surfaces technology); physical uncloneable function (PUF); postprocessing; Recording and replay of audio and video signals; security coating; Semiconductor device measurement; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices; Semiconductors; Smart cards; Spreads; Storage and reproduction of information; Studies; physical uncloneable function (PUF); postprocessing; Data storage; Metallizing; Comb capacitors; Coatings; Algorithm; Optimization; security coating; Microelectronic fabrication; Electric field; Field distribution; Capacitance; Capacitive coupling; Measurement accuracy; Capacitor; Planar technology

Planar inter-digitated comb capacitor structures are an excellent tool for on-chip capacitance measurement and evaluation of properties of coating layers with varying composition. These comb structures are easily fabricated in a single step in the last metallization layer of a standard IC process. C...