A Si-micromachined 48-stage Knudsen pump for on-chip vacuum
This paper describes a thermal transpiration-driven multistage Knudsen pump for vacuum pumping applications. This type of pump relies upon the motion of gas molecules from the cold end to the hot end of a channel in which the flow is restricted to the free molecular or transitional regimes. To achie...
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Published in | Journal of micromechanics and microengineering Vol. 22; no. 10; pp. 105026 - 8 |
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Main Authors | , , |
Format | Journal Article |
Language | English |
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Bristol
IOP Publishing
01.10.2012
Institute of Physics |
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Abstract | This paper describes a thermal transpiration-driven multistage Knudsen pump for vacuum pumping applications. This type of pump relies upon the motion of gas molecules from the cold end to the hot end of a channel in which the flow is restricted to the free molecular or transitional regimes. To achieve a high compression ratio, 48 stages are cascaded in series in a single chip. A five-mask, single silicon wafer process is used for monolithic integration of the designed Knudsen pump. The pump has several monolithically integrated Pirani gauges to experimentally measure the vacuum pumping characteristics of the pump. It has a footprint of 10.35 × 11.45 mm2. For an input power of 1350 mW, the fabricated pump self-evacuates the encapsulated cavities from 760 to 50 Torr, resulting in a compression ratio of 15. It also pumps down from 250 to 5 Torr, resulting in a compression ratio of 50. Each integrated Pirani gauge requires 3.9 mW of power consumption, and its response is sufficiently sensitive in the operating pressure range of 760-1 Torr. |
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AbstractList | This paper describes a thermal transpiration-driven multistage Knudsen pump for vacuum pumping applications. This type of pump relies upon the motion of gas molecules from the cold end to the hot end of a channel in which the flow is restricted to the free molecular or transitional regimes. To achieve a high compression ratio, 48 stages are cascaded in series in a single chip. A five-mask, single silicon wafer process is used for monolithic integration of the designed Knudsen pump. The pump has several monolithically integrated Pirani gauges to experimentally measure the vacuum pumping characteristics of the pump. It has a footprint of 10.35 x 11.45 mm super(2). For an input power of 1350 mW, the fabricated pump self-evacuates the encapsulated cavities from 760 to [asymptotically =]50 Torr, resulting in a compression ratio of 15. It also pumps down from 250 to [asymptotically =]5 Torr, resulting in a compression ratio of 50. Each integrated Pirani gauge requires [asymptotically =]3.9 mW of power consumption, and its response is sufficiently sensitive in the operating pressure range of 760-1 Torr. This paper describes a thermal transpiration-driven multistage Knudsen pump for vacuum pumping applications. This type of pump relies upon the motion of gas molecules from the cold end to the hot end of a channel in which the flow is restricted to the free molecular or transitional regimes. To achieve a high compression ratio, 48 stages are cascaded in series in a single chip. A five-mask, single silicon wafer process is used for monolithic integration of the designed Knudsen pump. The pump has several monolithically integrated Pirani gauges to experimentally measure the vacuum pumping characteristics of the pump. It has a footprint of 10.35 × 11.45 mm2. For an input power of 1350 mW, the fabricated pump self-evacuates the encapsulated cavities from 760 to 50 Torr, resulting in a compression ratio of 15. It also pumps down from 250 to 5 Torr, resulting in a compression ratio of 50. Each integrated Pirani gauge requires 3.9 mW of power consumption, and its response is sufficiently sensitive in the operating pressure range of 760-1 Torr. |
Author | Gupta, Naveen K Gianchandani, Yogesh B An, Seungdo |
Author_xml | – sequence: 1 givenname: Naveen K surname: Gupta fullname: Gupta, Naveen K email: gnaveen@umich.edu organization: Department of Electrical Engineering and Computer Science, University of Michigan , 1301 Beal Avenue, Ann Arbor, MI 48109, USA – sequence: 2 givenname: Seungdo surname: An fullname: An, Seungdo email: sdan@umich.edu organization: Department of Electrical Engineering and Computer Science, University of Michigan , 1301 Beal Avenue, Ann Arbor, MI 48109, USA – sequence: 3 givenname: Yogesh B surname: Gianchandani fullname: Gianchandani, Yogesh B email: yogesh@umich.edu organization: Department of Electrical Engineering and Computer Science, University of Michigan , 1301 Beal Avenue, Ann Arbor, MI 48109, USA |
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Keywords | Aluminium oxide Hermetic sealing Patterning Micromachining Pirani gages Vacuum pump System on a chip High vacuum Inorganic compound Atomic layer epitaxial growth Finite element method Nitrides Engraving Knudsen number Manufacturing process Silicon PECVD |
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Snippet | This paper describes a thermal transpiration-driven multistage Knudsen pump for vacuum pumping applications. This type of pump relies upon the motion of gas... |
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SubjectTerms | Applied sciences Asymptotic properties Compression ratio Encapsulation Exact sciences and technology Gages Gauges High vacuum Holes Instruments, apparatus, components and techniques common to several branches of physics and astronomy Integrated Pirani gauge Mechanical engineering. Machine design Micropump Physics Pump and compressors (turbocompressors, fans, etc.) Pumping Pumps Thermal transpiration Vacuum apparatus and techniques Vacuum pumps |
Title | A Si-micromachined 48-stage Knudsen pump for on-chip vacuum |
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