A Si-micromachined 48-stage Knudsen pump for on-chip vacuum

This paper describes a thermal transpiration-driven multistage Knudsen pump for vacuum pumping applications. This type of pump relies upon the motion of gas molecules from the cold end to the hot end of a channel in which the flow is restricted to the free molecular or transitional regimes. To achie...

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Published inJournal of micromechanics and microengineering Vol. 22; no. 10; pp. 105026 - 8
Main Authors Gupta, Naveen K, An, Seungdo, Gianchandani, Yogesh B
Format Journal Article
LanguageEnglish
Published Bristol IOP Publishing 01.10.2012
Institute of Physics
Subjects
Applied sciences
Asymptotic properties
Compression ratio
Encapsulation
Exact sciences and technology
Gages
Gauges
High vacuum
Holes
Instruments, apparatus, components and techniques common to several branches of physics and astronomy
Integrated Pirani gauge
Mechanical engineering. Machine design
Micropump
Physics
Pump and compressors (turbocompressors, fans, etc.)
Pumping
Pumps
Thermal transpiration
Vacuum apparatus and techniques
Vacuum pumps
Aluminium oxide
Hermetic sealing
Patterning
Micromachining
Pirani gages
Vacuum pump
System on a chip
High vacuum
Inorganic compound
Atomic layer epitaxial growth
Finite element method
Nitrides
Engraving
Knudsen number
Manufacturing process
Silicon
PECVD
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Abstract This paper describes a thermal transpiration-driven multistage Knudsen pump for vacuum pumping applications. This type of pump relies upon the motion of gas molecules from the cold end to the hot end of a channel in which the flow is restricted to the free molecular or transitional regimes. To achieve a high compression ratio, 48 stages are cascaded in series in a single chip. A five-mask, single silicon wafer process is used for monolithic integration of the designed Knudsen pump. The pump has several monolithically integrated Pirani gauges to experimentally measure the vacuum pumping characteristics of the pump. It has a footprint of 10.35 × 11.45 mm2. For an input power of 1350 mW, the fabricated pump self-evacuates the encapsulated cavities from 760 to 50 Torr, resulting in a compression ratio of 15. It also pumps down from 250 to 5 Torr, resulting in a compression ratio of 50. Each integrated Pirani gauge requires 3.9 mW of power consumption, and its response is sufficiently sensitive in the operating pressure range of 760-1 Torr.
AbstractList This paper describes a thermal transpiration-driven multistage Knudsen pump for vacuum pumping applications. This type of pump relies upon the motion of gas molecules from the cold end to the hot end of a channel in which the flow is restricted to the free molecular or transitional regimes. To achieve a high compression ratio, 48 stages are cascaded in series in a single chip. A five-mask, single silicon wafer process is used for monolithic integration of the designed Knudsen pump. The pump has several monolithically integrated Pirani gauges to experimentally measure the vacuum pumping characteristics of the pump. It has a footprint of 10.35 x 11.45 mm super(2). For an input power of 1350 mW, the fabricated pump self-evacuates the encapsulated cavities from 760 to [asymptotically =]50 Torr, resulting in a compression ratio of 15. It also pumps down from 250 to [asymptotically =]5 Torr, resulting in a compression ratio of 50. Each integrated Pirani gauge requires [asymptotically =]3.9 mW of power consumption, and its response is sufficiently sensitive in the operating pressure range of 760-1 Torr.
This paper describes a thermal transpiration-driven multistage Knudsen pump for vacuum pumping applications. This type of pump relies upon the motion of gas molecules from the cold end to the hot end of a channel in which the flow is restricted to the free molecular or transitional regimes. To achieve a high compression ratio, 48 stages are cascaded in series in a single chip. A five-mask, single silicon wafer process is used for monolithic integration of the designed Knudsen pump. The pump has several monolithically integrated Pirani gauges to experimentally measure the vacuum pumping characteristics of the pump. It has a footprint of 10.35 × 11.45 mm2. For an input power of 1350 mW, the fabricated pump self-evacuates the encapsulated cavities from 760 to 50 Torr, resulting in a compression ratio of 15. It also pumps down from 250 to 5 Torr, resulting in a compression ratio of 50. Each integrated Pirani gauge requires 3.9 mW of power consumption, and its response is sufficiently sensitive in the operating pressure range of 760-1 Torr.
Author Gupta, Naveen K
Gianchandani, Yogesh B
An, Seungdo
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  givenname: Naveen K
  surname: Gupta
  fullname: Gupta, Naveen K
  email: gnaveen@umich.edu
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  givenname: Seungdo
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  givenname: Yogesh B
  surname: Gianchandani
  fullname: Gianchandani, Yogesh B
  email: yogesh@umich.edu
  organization: Department of Electrical Engineering and Computer Science, University of Michigan , 1301 Beal Avenue, Ann Arbor, MI 48109, USA
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Issue 10
Keywords Aluminium oxide
Hermetic sealing
Patterning
Micromachining
Pirani gages
Vacuum pump
System on a chip
High vacuum
Inorganic compound
Atomic layer epitaxial growth
Finite element method
Nitrides
Engraving
Knudsen number
Manufacturing process
Silicon
PECVD
Language English
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Snippet This paper describes a thermal transpiration-driven multistage Knudsen pump for vacuum pumping applications. This type of pump relies upon the motion of gas...
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StartPage 105026
SubjectTerms Applied sciences
Asymptotic properties
Compression ratio
Encapsulation
Exact sciences and technology
Gages
Gauges
High vacuum
Holes
Instruments, apparatus, components and techniques common to several branches of physics and astronomy
Integrated Pirani gauge
Mechanical engineering. Machine design
Micropump
Physics
Pump and compressors (turbocompressors, fans, etc.)
Pumping
Pumps
Thermal transpiration
Vacuum apparatus and techniques
Vacuum pumps
Title A Si-micromachined 48-stage Knudsen pump for on-chip vacuum
URI https://iopscience.iop.org/article/10.1088/0960-1317/22/10/105026
https://search.proquest.com/docview/1669897582
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