Copper-to-copper direct bonding on highly (111)-oriented nanotwinned copper in no-vacuum ambient
A vacuum-free Cu-to-Cu direct bonding by using (111)-oriented and nanotwinned Cu has been achieved. A fast bonding process occurs in 5 min under a temperature gradient between 450 and 100 °C. It is verified by grain growth across the bonded interface. To investigate the grain growth behavior, furthe...
Saved in:
Published in | Scientific reports Vol. 8; no. 1; pp. 13910 - 11 |
---|---|
Main Authors | , , , , , , |
Format | Journal Article |
Language | English |
Published |
London
Nature Publishing Group UK
17.09.2018
Nature Publishing Group |
Subjects | |
Online Access | Get full text |
Cover
Loading…
Be the first to leave a comment!