Design and fabrication of a multiple-thickness electrochemical cantilever sensor

[Display omitted] •Cantilever thicknesses are achieved by etching at a low etching rate recipes.•A small-scale thickness difference (<30nm) is successful obtained.•The thickness distribution of cantilever can be altered and broadened.•A fluidic cell is designed to pour solutions and set an electr...

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Published inMicroelectronic engineering Vol. 119; pp. 1 - 5
Main Authors Wu, Chang, Petrini, Valérie, Joseph, Eric, Amiot, Fabien
Format Journal Article
LanguageEnglish
Published Elsevier B.V 01.05.2014
Elsevier
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Abstract [Display omitted] •Cantilever thicknesses are achieved by etching at a low etching rate recipes.•A small-scale thickness difference (<30nm) is successful obtained.•The thickness distribution of cantilever can be altered and broadened.•A fluidic cell is designed to pour solutions and set an electrochemical cell.•Issues of electrical and fluidic connections are addressed. This paper presents a new design and fabrication process of a multiple-thickness electrochemical cantilever sensor, in order to assess the role of the cantilever’s thickness on the chemically-induced mechanical effects. Each cantilever can act not only as a functionalized cantilever, but also as an independent working electrode (WE) for electrochemical measurement. The different thicknesses of the silicon nitride layer are achieved by successive masking and reactive ion etching of partially overlapping openings at a low etch rate (10.8nm/min, 15.8nm/min, 20.1nm/min, or 26.5nm/min). A small-scale thickness difference (<30nm) is successfully obtained. One advantage of this fabrication process is that the thickness distribution of cantilevers can be altered and broadened by combination of different RIE recipes or modification of the etching time. In addition, the integration of the cantilever chip with a fluidic cell, a printed circuit board (PCB) and a temperature-controlled plate to form a hybrid system is also addressed.
AbstractList This paper presents a new design and fabrication process of a multiple-thickness electrochemical cantilever sensor, in order to assess the role of the cantilever's thickness on the chemically-induced mechanical effects. Each cantilever can act not only as a functionalized cantilever, but also as an independent working electrode (WE) for electrochemical measurement. The different thicknesses of the silicon nitride layer are achieved by successive masking and reactive ion etching of partially overlapping openings at a low etch rate (10.8 nm/min, 15.8 nm/min, 20.1 nm/min, or 26.5 nm/min). A small-scale thickness difference (<30 nm) is successfully obtained. One advantage of this fabrication process is that the thickness distribution of cantilevers can be altered and broadened by combination of different RIE recipes or modification of the etching time. In addition, the integration of the cantilever chip with a fluidic cell, a printed circuit board (PCB) and a temperature-controlled plate to form a hybrid system is also addressed.
[Display omitted] •Cantilever thicknesses are achieved by etching at a low etching rate recipes.•A small-scale thickness difference (<30nm) is successful obtained.•The thickness distribution of cantilever can be altered and broadened.•A fluidic cell is designed to pour solutions and set an electrochemical cell.•Issues of electrical and fluidic connections are addressed. This paper presents a new design and fabrication process of a multiple-thickness electrochemical cantilever sensor, in order to assess the role of the cantilever’s thickness on the chemically-induced mechanical effects. Each cantilever can act not only as a functionalized cantilever, but also as an independent working electrode (WE) for electrochemical measurement. The different thicknesses of the silicon nitride layer are achieved by successive masking and reactive ion etching of partially overlapping openings at a low etch rate (10.8nm/min, 15.8nm/min, 20.1nm/min, or 26.5nm/min). A small-scale thickness difference (<30nm) is successfully obtained. One advantage of this fabrication process is that the thickness distribution of cantilevers can be altered and broadened by combination of different RIE recipes or modification of the etching time. In addition, the integration of the cantilever chip with a fluidic cell, a printed circuit board (PCB) and a temperature-controlled plate to form a hybrid system is also addressed.
Author Petrini, Valérie
Amiot, Fabien
Wu, Chang
Joseph, Eric
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Cites_doi 10.2140/jomms.2007.2.1787
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Keywords Fabrication
Thickness
Cantilever sensor
Electrochemical
Language English
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Snippet [Display omitted] •Cantilever thicknesses are achieved by etching at a low etching rate recipes.•A small-scale thickness difference (<30nm) is successful...
This paper presents a new design and fabrication process of a multiple-thickness electrochemical cantilever sensor, in order to assess the role of the...
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SubjectTerms Boards
Cantilever sensor
Circuit boards
Design engineering
Electrochemical
Electrodes
Engineering Sciences
Etching
Fabrication
Micro and nanotechnologies
Microelectronics
Printed circuits
Reactive ion etching
Sensors
Thickness
Title Design and fabrication of a multiple-thickness electrochemical cantilever sensor
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