Design and fabrication of a multiple-thickness electrochemical cantilever sensor
[Display omitted] •Cantilever thicknesses are achieved by etching at a low etching rate recipes.•A small-scale thickness difference (<30nm) is successful obtained.•The thickness distribution of cantilever can be altered and broadened.•A fluidic cell is designed to pour solutions and set an electr...
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Published in | Microelectronic engineering Vol. 119; pp. 1 - 5 |
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Main Authors | , , , |
Format | Journal Article |
Language | English |
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Elsevier B.V
01.05.2014
Elsevier |
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Abstract | [Display omitted]
•Cantilever thicknesses are achieved by etching at a low etching rate recipes.•A small-scale thickness difference (<30nm) is successful obtained.•The thickness distribution of cantilever can be altered and broadened.•A fluidic cell is designed to pour solutions and set an electrochemical cell.•Issues of electrical and fluidic connections are addressed.
This paper presents a new design and fabrication process of a multiple-thickness electrochemical cantilever sensor, in order to assess the role of the cantilever’s thickness on the chemically-induced mechanical effects. Each cantilever can act not only as a functionalized cantilever, but also as an independent working electrode (WE) for electrochemical measurement. The different thicknesses of the silicon nitride layer are achieved by successive masking and reactive ion etching of partially overlapping openings at a low etch rate (10.8nm/min, 15.8nm/min, 20.1nm/min, or 26.5nm/min). A small-scale thickness difference (<30nm) is successfully obtained. One advantage of this fabrication process is that the thickness distribution of cantilevers can be altered and broadened by combination of different RIE recipes or modification of the etching time. In addition, the integration of the cantilever chip with a fluidic cell, a printed circuit board (PCB) and a temperature-controlled plate to form a hybrid system is also addressed. |
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AbstractList | This paper presents a new design and fabrication process of a multiple-thickness electrochemical cantilever sensor, in order to assess the role of the cantilever's thickness on the chemically-induced mechanical effects. Each cantilever can act not only as a functionalized cantilever, but also as an independent working electrode (WE) for electrochemical measurement. The different thicknesses of the silicon nitride layer are achieved by successive masking and reactive ion etching of partially overlapping openings at a low etch rate (10.8 nm/min, 15.8 nm/min, 20.1 nm/min, or 26.5 nm/min). A small-scale thickness difference (<30 nm) is successfully obtained. One advantage of this fabrication process is that the thickness distribution of cantilevers can be altered and broadened by combination of different RIE recipes or modification of the etching time. In addition, the integration of the cantilever chip with a fluidic cell, a printed circuit board (PCB) and a temperature-controlled plate to form a hybrid system is also addressed. [Display omitted] •Cantilever thicknesses are achieved by etching at a low etching rate recipes.•A small-scale thickness difference (<30nm) is successful obtained.•The thickness distribution of cantilever can be altered and broadened.•A fluidic cell is designed to pour solutions and set an electrochemical cell.•Issues of electrical and fluidic connections are addressed. This paper presents a new design and fabrication process of a multiple-thickness electrochemical cantilever sensor, in order to assess the role of the cantilever’s thickness on the chemically-induced mechanical effects. Each cantilever can act not only as a functionalized cantilever, but also as an independent working electrode (WE) for electrochemical measurement. The different thicknesses of the silicon nitride layer are achieved by successive masking and reactive ion etching of partially overlapping openings at a low etch rate (10.8nm/min, 15.8nm/min, 20.1nm/min, or 26.5nm/min). A small-scale thickness difference (<30nm) is successfully obtained. One advantage of this fabrication process is that the thickness distribution of cantilevers can be altered and broadened by combination of different RIE recipes or modification of the etching time. In addition, the integration of the cantilever chip with a fluidic cell, a printed circuit board (PCB) and a temperature-controlled plate to form a hybrid system is also addressed. |
Author | Petrini, Valérie Amiot, Fabien Wu, Chang Joseph, Eric |
Author_xml | – sequence: 1 givenname: Chang surname: Wu fullname: Wu, Chang email: chang.wu@femto-st.fr organization: FEMTO-ST Institute, CNRS-UMR 6174, Department of Applied Mechanics, 25000 Besançon, France – sequence: 2 givenname: Valérie surname: Petrini fullname: Petrini, Valérie organization: FEMTO-ST Institute, CNRS-UMR 6174, Department of Micro and Nano Sciences and Systems, 25000 Besançon, France – sequence: 3 givenname: Eric surname: Joseph fullname: Joseph, Eric organization: FEMTO-ST Institute, CNRS-UMR 6174, Department of Applied Mechanics, 25000 Besançon, France – sequence: 4 givenname: Fabien surname: Amiot fullname: Amiot, Fabien organization: FEMTO-ST Institute, CNRS-UMR 6174, Department of Applied Mechanics, 25000 Besançon, France |
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Keywords | Fabrication Thickness Cantilever sensor Electrochemical |
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References | Stoney (b0015) 1909; 82 Boisen, Dohn, Keller, Schmid, Tenje (b0005) 2011; 74 Ziegler (b0010) 2004; 379 Tabard-Cossa, Godin, Beaulieu, Grütter (b0025) 2005; 107 Amiot (b0040) 2007; 2 Amiot (b0045) 2013 Amiot, Hild, Kanoufi, Roger (b0030) 2007; 40 Raiteri, Grattarola, Butt, Skládal (b0020) 2001; 79 Fischer, Pedersen, Elkjær, Noeth, Dohn, Boisen, Tenje (b0035) 2011; 157 Raiteri (10.1016/j.mee.2014.01.009_b0020) 2001; 79 Stoney (10.1016/j.mee.2014.01.009_b0015) 1909; 82 Amiot (10.1016/j.mee.2014.01.009_b0030) 2007; 40 Tabard-Cossa (10.1016/j.mee.2014.01.009_b0025) 2005; 107 Fischer (10.1016/j.mee.2014.01.009_b0035) 2011; 157 Boisen (10.1016/j.mee.2014.01.009_b0005) 2011; 74 Amiot (10.1016/j.mee.2014.01.009_b0045) 2013 Ziegler (10.1016/j.mee.2014.01.009_b0010) 2004; 379 Amiot (10.1016/j.mee.2014.01.009_b0040) 2007; 2 |
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•Cantilever thicknesses are achieved by etching at a low etching rate recipes.•A small-scale thickness difference (<30nm) is successful... This paper presents a new design and fabrication process of a multiple-thickness electrochemical cantilever sensor, in order to assess the role of the... |
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SubjectTerms | Boards Cantilever sensor Circuit boards Design engineering Electrochemical Electrodes Engineering Sciences Etching Fabrication Micro and nanotechnologies Microelectronics Printed circuits Reactive ion etching Sensors Thickness |
Title | Design and fabrication of a multiple-thickness electrochemical cantilever sensor |
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