Evidence of Stress Development as a Source of Driving Force for Grain-Boundary Migration in a Ni Bicrystalline TEM Specimen

• Published in: Materials Vol. 13; no. 2; p. 360
• Main Authors: Lee, Sung Bo, Jung, Jinwook, Han, Heung Nam
• Format: Journal Article
• Language: English
• Published: Switzerland MDPI AG 12.01.2020; MDPI
• Subjects: Bicrystals; Compressive properties; Energy; Finite element method; Grain boundary migration; High resolution electron microscopy; Ion beams; Lamella; nickel; stacking fault; Stacking faults; stress development; Stress state; Transmission electron microscopy; transmission electron microscopy (tem); nickel; transmission electron microscopy (TEM); stacking fault; grain-boundary migration; stress development

In a previous study, using high-resolution transmission electron microscopy (HRTEM), we examined grain-boundary migration behavior in a Ni bicrystal. A specimen for transmission electron microscopy (TEM) was prepared using focused ion beam. The Ni lamella in the specimen was composed of two grains w...