Control Al/Mg intermetallic compound formation during ultrasonic-assisted soldering Mg to Al

• Published in: Ultrasonics sonochemistry Vol. 46; pp. 79 - 88
• Main Authors: Xu, Zhiwu, Li, Zhengwei, Li, Jiaqi, Ma, Zhipeng, Yan, Jiuchun
• Format: Journal Article
• Language: English
• Published: Netherlands Elsevier B.V 01.09.2018
• Subjects: Cavitation; Intermetallic compound; Mg2Sn; Shear strength; Ultrasonic-assisted soldering; Ultrasonic-assisted soldering; Shear strength; Cavitation; Intermetallic compound; Mg2Sn; MgSn

•The formation of the intermetallic compounds of Al3Mg2 and Al12Mg17 was avoided by using Sn-based filler metals.•A new intermetallic compound of Mg2Sn formed and it was prone to cracks at large thickness.•The formation of Mg2Sn was significantly depressed by using Sn-9Zn and decreasing soldering te...