Control Al/Mg intermetallic compound formation during ultrasonic-assisted soldering Mg to Al
•The formation of the intermetallic compounds of Al3Mg2 and Al12Mg17 was avoided by using Sn-based filler metals.•A new intermetallic compound of Mg2Sn formed and it was prone to cracks at large thickness.•The formation of Mg2Sn was significantly depressed by using Sn-9Zn and decreasing soldering te...
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| Published in | Ultrasonics sonochemistry Vol. 46; pp. 79 - 88 |
|---|---|
| Main Authors | , , , , |
| Format | Journal Article |
| Language | English |
| Published |
Netherlands
Elsevier B.V
01.09.2018
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| Subjects | |
| Online Access | Get full text |
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| Abstract | •The formation of the intermetallic compounds of Al3Mg2 and Al12Mg17 was avoided by using Sn-based filler metals.•A new intermetallic compound of Mg2Sn formed and it was prone to cracks at large thickness.•The formation of Mg2Sn was significantly depressed by using Sn-9Zn and decreasing soldering temperature.•The addition of Zn in Sn-based filler metal prevented Sn whiskers.•A cavitation model during ultrasonic assisted soldering was proposed.
To prevent the formation of Al/Mg intermetallic compounds (IMCs) of Al3Mg2 and Al12Mg17, dissimilar Al/Mg were ultrasonic-assisted soldered using Sn-based filler metals. A new IMC of Mg2Sn formed in the soldered joints during this process and it was prone to crack at large thickness. The thickness of Mg2Sn was reduced to 22 μm at 285 °C when using Sn-3Cu as the filler metal. Cracks were still observed inside the blocky Mg2Sn. The thickness of Mg2Sn was significantly reduced when using Sn-9Zn as the filler metal. A 17 μm Mg2Sn layer without crack was obtained at a temperature of 200 °C, ultrasonic power of Mode I, and ultrasonic time of 2 s. The shear strengths of the joints using Sn-9Zn was much higher than those using Sn-3Cu because of the thinner Mg2Sn layer in the former joints. Sn whiskers were prevented by using Sn-9Zn. A cavitation model during ultrasonic assisted soldering was proposed. |
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| AbstractList | •The formation of the intermetallic compounds of Al3Mg2 and Al12Mg17 was avoided by using Sn-based filler metals.•A new intermetallic compound of Mg2Sn formed and it was prone to cracks at large thickness.•The formation of Mg2Sn was significantly depressed by using Sn-9Zn and decreasing soldering temperature.•The addition of Zn in Sn-based filler metal prevented Sn whiskers.•A cavitation model during ultrasonic assisted soldering was proposed.
To prevent the formation of Al/Mg intermetallic compounds (IMCs) of Al3Mg2 and Al12Mg17, dissimilar Al/Mg were ultrasonic-assisted soldered using Sn-based filler metals. A new IMC of Mg2Sn formed in the soldered joints during this process and it was prone to crack at large thickness. The thickness of Mg2Sn was reduced to 22 μm at 285 °C when using Sn-3Cu as the filler metal. Cracks were still observed inside the blocky Mg2Sn. The thickness of Mg2Sn was significantly reduced when using Sn-9Zn as the filler metal. A 17 μm Mg2Sn layer without crack was obtained at a temperature of 200 °C, ultrasonic power of Mode I, and ultrasonic time of 2 s. The shear strengths of the joints using Sn-9Zn was much higher than those using Sn-3Cu because of the thinner Mg2Sn layer in the former joints. Sn whiskers were prevented by using Sn-9Zn. A cavitation model during ultrasonic assisted soldering was proposed. To prevent the formation of Al/Mg intermetallic compounds (IMCs) of Al3Mg2 and Al12Mg17, dissimilar Al/Mg were ultrasonic-assisted soldered using Sn-based filler metals. A new IMC of Mg2Sn formed in the soldered joints during this process and it was prone to crack at large thickness. The thickness of Mg2Sn was reduced to 22 μm at 285 °C when using Sn-3Cu as the filler metal. Cracks were still observed inside the blocky Mg2Sn. The thickness of Mg2Sn was significantly reduced when using Sn-9Zn as the filler metal. A 17 μm Mg2Sn layer without crack was obtained at a temperature of 200 °C, ultrasonic power of Mode I, and ultrasonic time of 2 s. The shear strengths of the joints using Sn-9Zn was much higher than those using Sn-3Cu because of the thinner Mg2Sn layer in the former joints. Sn whiskers were prevented by using Sn-9Zn. A cavitation model during ultrasonic assisted soldering was proposed.To prevent the formation of Al/Mg intermetallic compounds (IMCs) of Al3Mg2 and Al12Mg17, dissimilar Al/Mg were ultrasonic-assisted soldered using Sn-based filler metals. A new IMC of Mg2Sn formed in the soldered joints during this process and it was prone to crack at large thickness. The thickness of Mg2Sn was reduced to 22 μm at 285 °C when using Sn-3Cu as the filler metal. Cracks were still observed inside the blocky Mg2Sn. The thickness of Mg2Sn was significantly reduced when using Sn-9Zn as the filler metal. A 17 μm Mg2Sn layer without crack was obtained at a temperature of 200 °C, ultrasonic power of Mode I, and ultrasonic time of 2 s. The shear strengths of the joints using Sn-9Zn was much higher than those using Sn-3Cu because of the thinner Mg2Sn layer in the former joints. Sn whiskers were prevented by using Sn-9Zn. A cavitation model during ultrasonic assisted soldering was proposed. To prevent the formation of Al/Mg intermetallic compounds (IMCs) of Al Mg and Al Mg , dissimilar Al/Mg were ultrasonic-assisted soldered using Sn-based filler metals. A new IMC of Mg Sn formed in the soldered joints during this process and it was prone to crack at large thickness. The thickness of Mg Sn was reduced to 22 μm at 285 °C when using Sn-3Cu as the filler metal. Cracks were still observed inside the blocky Mg Sn. The thickness of Mg Sn was significantly reduced when using Sn-9Zn as the filler metal. A 17 μm Mg Sn layer without crack was obtained at a temperature of 200 °C, ultrasonic power of Mode I, and ultrasonic time of 2 s. The shear strengths of the joints using Sn-9Zn was much higher than those using Sn-3Cu because of the thinner Mg Sn layer in the former joints. Sn whiskers were prevented by using Sn-9Zn. A cavitation model during ultrasonic assisted soldering was proposed. |
| Author | Yan, Jiuchun Xu, Zhiwu Ma, Zhipeng Li, Jiaqi Li, Zhengwei |
| Author_xml | – sequence: 1 givenname: Zhiwu orcidid: 0000-0002-1571-3826 surname: Xu fullname: Xu, Zhiwu email: xuzw@hit.edu.cn organization: State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, PR China – sequence: 2 givenname: Zhengwei surname: Li fullname: Li, Zhengwei email: qingdaolzw@163.com organization: State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, PR China – sequence: 3 givenname: Jiaqi surname: Li fullname: Li, Jiaqi organization: State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, PR China – sequence: 4 givenname: Zhipeng surname: Ma fullname: Ma, Zhipeng organization: Department of Materials Science and Engineering, Northeast Petroleum University, Daqing 163318, China – sequence: 5 givenname: Jiuchun surname: Yan fullname: Yan, Jiuchun organization: State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, PR China |
| BackLink | https://www.ncbi.nlm.nih.gov/pubmed/29739515$$D View this record in MEDLINE/PubMed |
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| Keywords | Ultrasonic-assisted soldering Shear strength Cavitation Intermetallic compound Mg2Sn MgSn |
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| Snippet | •The formation of the intermetallic compounds of Al3Mg2 and Al12Mg17 was avoided by using Sn-based filler metals.•A new intermetallic compound of Mg2Sn formed... To prevent the formation of Al/Mg intermetallic compounds (IMCs) of Al Mg and Al Mg , dissimilar Al/Mg were ultrasonic-assisted soldered using Sn-based filler... To prevent the formation of Al/Mg intermetallic compounds (IMCs) of Al3Mg2 and Al12Mg17, dissimilar Al/Mg were ultrasonic-assisted soldered using Sn-based... |
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| SubjectTerms | Cavitation Intermetallic compound Mg2Sn Shear strength Ultrasonic-assisted soldering |
| Title | Control Al/Mg intermetallic compound formation during ultrasonic-assisted soldering Mg to Al |
| URI | https://dx.doi.org/10.1016/j.ultsonch.2018.04.010 https://www.ncbi.nlm.nih.gov/pubmed/29739515 https://www.proquest.com/docview/2036788733 |
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