III-V-on-Si photonic integrated circuits realized using micro-transfer-printing
Silicon photonics (SiPh) enables compact photonic integrated circuits (PICs), showing superior performance for a wide variety of applications. Various optical functions have been demonstrated on this platform that allows for complex and powerful PICs. Nevertheless, laser source integration technolog...
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| Published in | APL photonics Vol. 4; no. 11; pp. 110803 - 110803-10 |
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| Main Authors | , , , , , , , , , , , , , , , , , , , , |
| Format | Journal Article |
| Language | English |
| Published |
AIP Publishing LLC
01.11.2019
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| Online Access | Get full text |
| ISSN | 2378-0967 2378-0967 |
| DOI | 10.1063/1.5120004 |
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| Abstract | Silicon photonics (SiPh) enables compact photonic integrated circuits (PICs), showing superior performance for a wide variety of applications. Various optical functions have been demonstrated on this platform that allows for complex and powerful PICs. Nevertheless, laser source integration technologies are not yet as mature, hampering the further cost reduction of the eventual Si photonic systems-on-chip and impeding the expansion of this platform to a broader range of applications. Here, we discuss a promising technology, micro-transfer-printing (μTP), for the realization of III-V-on-Si PICs. By employing a polydimethylsiloxane elastomeric stamp, the integration of III-V devices can be realized in a massively parallel manner on a wafer without substantial modifications to the SiPh process flow, leading to a significant cost reduction of the resulting III-V-on-Si PICs. This paper summarizes some of the recent developments in the use of μTP technology for realizing the integration of III-V photodiodes and lasers on Si PICs. |
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| AbstractList | Silicon photonics (SiPh) enables compact photonic integrated circuits (PICs), showing superior performance for a wide variety of applications. Various optical functions have been demonstrated on this platform that allows for complex and powerful PICs. Nevertheless, laser source integration technologies are not yet as mature, hampering the further cost reduction of the eventual Si photonic systems-on-chip and impeding the expansion of this platform to a broader range of applications. Here, we discuss a promising technology, micro-transfer-printing (μTP), for the realization of III-V-on-Si PICs. By employing a polydimethylsiloxane elastomeric stamp, the integration of III-V devices can be realized in a massively parallel manner on a wafer without substantial modifications to the SiPh process flow, leading to a significant cost reduction of the resulting III-V-on-Si PICs. This paper summarizes some of the recent developments in the use of μTP technology for realizing the integration of III-V photodiodes and lasers on Si PICs. |
| Author | Baets, Roel Thomas, Kevin Kumari, Sulakshna O’Callaghan, James Haq, Bahawal Op de Beeck, Camiel Van Thourhout, Dries Corbett, Brian Verheyen, Peter Kuyken, Bart Muliuk, Grigorij Juvert, Joan Zhang, Jing Pelucchi, Emanuele Van Campenhout, Joris Goyvaerts, Jeroen Morthier, Geert Lepage, Guy Gocalinska, Agnieszka Trindade, António José Roelkens, Gunther |
| Author_xml | – sequence: 1 givenname: Jing surname: Zhang fullname: Zhang, Jing email: jingzhan.Zhang@ugent.be organization: Ghent University—imec – sequence: 2 givenname: Grigorij surname: Muliuk fullname: Muliuk, Grigorij organization: Ghent University—imec – sequence: 3 givenname: Joan surname: Juvert fullname: Juvert, Joan organization: Ghent University—imec – sequence: 4 givenname: Sulakshna surname: Kumari fullname: Kumari, Sulakshna organization: Ghent University—imec – sequence: 5 givenname: Jeroen surname: Goyvaerts fullname: Goyvaerts, Jeroen organization: Ghent University—imec – sequence: 6 givenname: Bahawal surname: Haq fullname: Haq, Bahawal organization: Ghent University—imec – sequence: 7 givenname: Camiel surname: Op de Beeck fullname: Op de Beeck, Camiel organization: Ghent University—imec – sequence: 8 givenname: Bart surname: Kuyken fullname: Kuyken, Bart organization: Ghent University—imec – sequence: 9 givenname: Geert surname: Morthier fullname: Morthier, Geert organization: Ghent University—imec – sequence: 10 givenname: Dries surname: Van Thourhout fullname: Van Thourhout, Dries organization: Ghent University—imec – sequence: 11 givenname: Roel surname: Baets fullname: Baets, Roel organization: Ghent University—imec – sequence: 12 givenname: Guy surname: Lepage fullname: Lepage, Guy organization: imec – sequence: 13 givenname: Peter surname: Verheyen fullname: Verheyen, Peter organization: imec – sequence: 14 givenname: Joris surname: Van Campenhout fullname: Van Campenhout, Joris organization: imec – sequence: 15 givenname: Agnieszka surname: Gocalinska fullname: Gocalinska, Agnieszka organization: Tyndall National Institute, University College Cork – sequence: 16 givenname: James surname: O’Callaghan fullname: O’Callaghan, James organization: Tyndall National Institute, University College Cork – sequence: 17 givenname: Emanuele surname: Pelucchi fullname: Pelucchi, Emanuele organization: Tyndall National Institute, University College Cork – sequence: 18 givenname: Kevin surname: Thomas fullname: Thomas, Kevin organization: Tyndall National Institute, University College Cork – sequence: 19 givenname: Brian surname: Corbett fullname: Corbett, Brian organization: Tyndall National Institute, University College Cork – sequence: 20 givenname: António José surname: Trindade fullname: Trindade, António José organization: X-Celeprint Limited – sequence: 21 givenname: Gunther surname: Roelkens fullname: Roelkens, Gunther organization: Ghent University—imec |
| BookMark | eNp9kElLAzEAhYNUcD34D-aqEM2emaMUl4FCDy7XkMkkNaVOSpIK-uuNti6oeEp4fO8LeXtgNITBAnCE0SlGgp7hU44JQohtgV1CZQ1RI-To230HHKY0LwQWEjeM74Jp27bwHoYB3vhq-RByGLyp_JDtLOps-8r4aFY-pypavfAvJVklP8yqR29igDnqITkb4TKWTskPwLbTi2QPN-c-uLu8uB1fw8n0qh2fT6BhQmRICTGYuo6wrpFMIC6EIVZQaQi2lDPGeGNthwnlXS8d7zuja6I7SYSVDDm6D9q1tw96rsrrjzo-q6C9eg9CnCkdszcLq5wWtXYM99xShoxrus4wXfOaSs1I3xfX8dpVfpRStO7Th5F6G1ZhtRm2sGc_WOOzzj4MZQq_-LNxsm6kD_JT_xTiF6iWvfsP_m1-BQvkl4s |
| CODEN | APPHD2 |
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| ContentType | Journal Article |
| Copyright | Author(s) |
| Copyright_xml | – notice: Author(s) |
| DBID | AJDQP AAYXX CITATION DOA |
| DOI | 10.1063/1.5120004 |
| DatabaseName | AIP Open Access Journals CrossRef DOAJ Directory of Open Access Journals |
| DatabaseTitle | CrossRef |
| DatabaseTitleList | CrossRef |
| Database_xml | – sequence: 1 dbid: DOA name: DOAJ Directory of Open Access Journals url: https://www.doaj.org/ sourceTypes: Open Website – sequence: 2 dbid: AJDQP name: AIP Open Access Journals url: https://publishing.aip.org/librarians/open-access-policy sourceTypes: Enrichment Source Publisher |
| DeliveryMethod | fulltext_linktorsrc |
| Discipline | Applied Sciences |
| EISSN | 2378-0967 |
| EndPage | 110803-10 |
| ExternalDocumentID | oai_doaj_org_article_fa68af41d5e340cf9bbc4a85837a42dd 10_1063_1_5120004 app |
| GrantInformation_xml | – fundername: CALADAN grantid: 825453 – fundername: SAFESIDE grantid: 3.6.176 – fundername: IPIC grantid: 12/RC/2276 – fundername: TeroBoard grantid: 688510 – fundername: MicroPrince grantid: 737465 – fundername: TOPHIT grantid: 645314 |
| GroupedDBID | 5VS AAYEQ ADBBV ADCTM AGKCL AGLKD AHSDT AJDQP ALMA_UNASSIGNED_HOLDINGS ASPBG BCNDV EBS FRJ GROUPED_DOAJ KQ8 M~E OK1 RIP RQS AAYXX ABJGX ADMLS AKSGC CITATION |
| ID | FETCH-LOGICAL-c466t-322c13fb24b97460566c2e637c21e3544459eeb1235bd7f5dbca82ab726e740f3 |
| IEDL.DBID | DOA |
| ISSN | 2378-0967 |
| IngestDate | Wed Aug 27 01:31:57 EDT 2025 Thu Apr 24 23:04:45 EDT 2025 Thu Jul 03 08:21:06 EDT 2025 Wed Nov 11 00:05:00 EST 2020 Fri Jun 21 00:14:35 EDT 2024 |
| IsDoiOpenAccess | true |
| IsOpenAccess | true |
| IsPeerReviewed | true |
| IsScholarly | true |
| Issue | 11 |
| Language | English |
| License | All article content, except where otherwise noted, is licensed under a Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/). 2378-0967/2019/4(11)/110803/10/$0.00 |
| LinkModel | DirectLink |
| MergedId | FETCHMERGED-LOGICAL-c466t-322c13fb24b97460566c2e637c21e3544459eeb1235bd7f5dbca82ab726e740f3 |
| ORCID | 0000-0003-1266-1319 0000-0003-0778-2669 0000-0003-3974-347X 0000-0001-7682-0601 0000-0001-6608-9990 0000-0001-9355-6603 0000-0003-0111-431X |
| OpenAccessLink | https://doaj.org/article/fa68af41d5e340cf9bbc4a85837a42dd |
| PageCount | 10 |
| ParticipantIDs | crossref_primary_10_1063_1_5120004 scitation_primary_10_1063_1_5120004 doaj_primary_oai_doaj_org_article_fa68af41d5e340cf9bbc4a85837a42dd crossref_citationtrail_10_1063_1_5120004 |
| PublicationCentury | 2000 |
| PublicationDate | 20191101 2019-11-01 |
| PublicationDateYYYYMMDD | 2019-11-01 |
| PublicationDate_xml | – month: 11 year: 2019 text: 20191101 day: 01 |
| PublicationDecade | 2010 |
| PublicationTitle | APL photonics |
| PublicationYear | 2019 |
| Publisher | AIP Publishing LLC |
| Publisher_xml | – name: AIP Publishing LLC |
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| SSID | ssj0001671945 |
| Score | 2.5036771 |
| Snippet | Silicon photonics (SiPh) enables compact photonic integrated circuits (PICs), showing superior performance for a wide variety of applications. Various optical... |
| SourceID | doaj crossref scitation |
| SourceType | Open Website Enrichment Source Index Database Publisher |
| StartPage | 110803 |
| SummonAdditionalLinks | – databaseName: AIP Open Access Journals dbid: AJDQP link: http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwjV1LT9wwEB6h5UA58GpRl0cVFQ5cTBN7bG-OQItYpNIiCuIW2Y5dVlp2V0vgwK9nnM0uVKKISw7WOJFmPJlvPOPPALscnbF5isxoemDQyHLUhklrQ2ZoSclOPO_880ydXOLptbyeg53_VPCV-JbtU0xKa87PeU7gmLdg_uD0-_nv560UpSkVl1PeoJdz_ok2NSn_IixQbJmUuV9EkuMVWGogYHIwsdkqzPnBGiw3cDBpnO3uI_zqdrvsig0H7KKXjG6GVWSxTWb8DmXiemN336vuEgJ-_d4jjcQu9r_JbWyyY1UNSf2Yxa272Nz8CS6Pf_w5OmHN_QfMoVIVI19zmQiWoyXUT3mHUo57JbTjmRcSEWXu6V_LhbSlDrK0znS4sZorrzENYh1ag-HAf4aEkppSUy5nrTYoBc9TR0hLGaeklT7HNuxN9VRMtRPvqOgXdZFaiSIrGpW24etMdDRhxHhN6DAqeyYQSazrAbJs0fhEEYzqmIBZKb3A1IXcWoemIylnNsjLsg07M1O99alXpB6G42eJYlSGjXe9axM-ECDKJ2cNt6BVje_9NoGOyn5pFt0TS4zRJQ priority: 102 providerName: American Institute of Physics |
| Title | III-V-on-Si photonic integrated circuits realized using micro-transfer-printing |
| URI | http://dx.doi.org/10.1063/1.5120004 https://doaj.org/article/fa68af41d5e340cf9bbc4a85837a42dd |
| Volume | 4 |
| hasFullText | 1 |
| inHoldings | 1 |
| isFullTextHit | |
| isPrint | |
| link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwrV1LbxMxELZQONAeoNBWDY9qBRx6cbNrj-34GChVE4mXSlBvK9trtyulSZRsOPDrGe9uQpAiuHDZgzXSWuPHfJ89_oaQtwycsToFahR-ICigGpShwtqQGZxSoh_fO3_8JK_GMLoRN1ulvmJOWCMP3DiuF4zsmwBZITyH1AVtrQPTF0isDLCiiLtvqtMtMlWfrkiF7FzUleWihKyWai0rJHkvO8cwF9HMH8Go1uzfJ48w9DS34FuB5vKAPG4RYjJoevaUPPDTZ-RJixaTdi0uD8nn4XBIv9PZlF6XyfxuVkWR22Qj_1Akrly4VVktE8SFk_IntsQk99vkPubg0apGrH5B48lezH0-IuPLD9_eX9G2PAJ1IGVFcSm6jAfLwCIpQFoipWNecuVY5rkAAKE9bsWMC1uoIArrTJ8Zq5j0CtLAj0lnOpv6E5Ig5ykUUj1r0amCM506BGLSOCms8Bq65Gztp3ztnVjCYpLXd9iS51neurRLXm9M541gxi6jd9HZG4OocV034Mjn7cjn_xr5LnmzGaq__WqH1Y_Z4rdFPi_C8__RoRdkD-GUbl4qviSdarHyrxCyVPaUPByMLr5-Oa1n6S8MaegR |
| linkProvider | Directory of Open Access Journals |
| linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwjV1LT9wwELbQcqA9tKUPsX0RtT30Ykjssb050gfapUBbFSpuke3YEGm7G-1me-iv7zjx7oKEEJccrHFizdiZb-yZz4R8YGC1yVOgWuEDvAKag9JUGOMzjVNKDEK988mpHJ7D0YW4iLk5oRYGBzHf01XdUQTX9X5UIB0j5lzUa8IByfezPfRWacsGuqkCoWWPbB4cffn5Y73JIhUG6WLJKHS9zw0_1NL1PyRb6HW6A_BrPubwCXkUwWFy0A1mm2y4yVPyOALFJC7D-TPyfTQa0d90OqG_qqS-mjaB3zZZMT-Uia1mdlE18wQh4bj6hy0hv_0y-RPS72jTglU3o2FTL6Q9Pyfnh1_PPg9pvBmBWpCyobgKbca9YWAwHsCIRErLnOTKssxxAQAid_gXZlyYUnlRGqsHTBvFpFOQev6C9CbTidshCYY7pcIozxilQXCWpxYxmNRWCiNcDn3ycamnYqmdcHvFuGiPryUvsiKqtE_erUTrjivjNqFPQdkrgUBv3TagwYto7MJrOdAeslI4Dqn1uTEW9EBgNK2BlWWfvF-Z6q5P3SL1dzpbSxR16V_e6127ZGt4dnJcHI9Ov70iDxA25V1F4mvSa2YL9wahSWPexgn4H1kK3i4 |
| openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Ajournal&rft.genre=article&rft.atitle=III-V-on-Si+photonic+integrated+circuits+realized+using+micro-transfer-printing&rft.jtitle=APL+photonics&rft.au=Jing+Zhang&rft.au=Grigorij+Muliuk&rft.au=Joan+Juvert&rft.au=Sulakshna+Kumari&rft.date=2019-11-01&rft.pub=AIP+Publishing+LLC&rft.issn=2378-0967&rft.eissn=2378-0967&rft.volume=4&rft.issue=11&rft.spage=110803&rft.epage=110803-10&rft_id=info:doi/10.1063%2F1.5120004&rft.externalDBID=DOA&rft.externalDocID=oai_doaj_org_article_fa68af41d5e340cf9bbc4a85837a42dd |
| thumbnail_l | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/lc.gif&issn=2378-0967&client=summon |
| thumbnail_m | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/mc.gif&issn=2378-0967&client=summon |
| thumbnail_s | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/sc.gif&issn=2378-0967&client=summon |