Effect of annealing on wear resistance and electroconductivity of copper processed by high-pressure torsion
The influences of annealing temperature on the wear properties and electrical conductivity of Cu were studied after processing by high-pressure torsion (HPT). The annealing of Cu specimens processed by HPT leads to an increase in electroconductivity and a decrease in the wear rate. It is apparent th...
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| Published in | Journal of materials science Vol. 49; no. 5; pp. 2270 - 2278 |
|---|---|
| Main Authors | , , , , |
| Format | Journal Article |
| Language | English |
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Springer US
01.03.2014
Springer Springer Nature B.V |
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| Abstract | The influences of annealing temperature on the wear properties and electrical conductivity of Cu were studied after processing by high-pressure torsion (HPT). The annealing of Cu specimens processed by HPT leads to an increase in electroconductivity and a decrease in the wear rate. It is apparent that a nanotribolayer at the surface induced during wear sliding plays a more significant role than the ultrafine-grained structure. A slight increase was observed in the microhardness of HPT copper specimens upon annealing at a relatively low temperature (100 °C), and this is most likely due to a change in texture. The annealing leads to an increase in the Taylor factor by ~5 %, which is in good agreement with the increase in the microhardness level which is also by ~5 %. It is apparent that low-temperature annealing of HPT copper may produce optimal properties of the specimens including high strength and electroconductivity with a lower wear rate. |
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| AbstractList | The influences of annealing temperature on the wear properties and electrical conductivity of Cu were studied after processing by high-pressure torsion (HPT). The annealing of Cu specimens processed by HPT leads to an increase in electroconductivity and a decrease in the wear rate. It is apparent that a nanotribolayer at the surface induced during wear sliding plays a more significant role than the ultrafine-grained structure. A slight increase was observed in the microhardness of HPT copper specimens upon annealing at a relatively low temperature (100 °C), and this is most likely due to a change in texture. The annealing leads to an increase in the Taylor factor by ~5 %, which is in good agreement with the increase in the microhardness level which is also by ~5 %. It is apparent that low-temperature annealing of HPT copper may produce optimal properties of the specimens including high strength and electroconductivity with a lower wear rate. The influences of annealing temperature on the wear properties and electrical conductivity of Cu were studied after processing by high-pressure torsion (HPT). The annealing of Cu specimens processed by HPT leads to an increase in electroconductivity and a decrease in the wear rate. It is apparent that a nanotribolayer at the surface induced during wear sliding plays a more significant role than the ultrafine-grained structure. A slight increase was observed in the microhardness of HPT copper specimens upon annealing at a relatively low temperature (100 °C), and this is most likely due to a change in texture. The annealing leads to an increase in the Taylor factor by ~5 %, which is in good agreement with the increase in the microhardness level which is also by ~5 %. It is apparent that low-temperature annealing of HPT copper may produce optimal properties of the specimens including high strength and electroconductivity with a lower wear rate. The influences of annealing temperature on the wear properties and electrical conductivity of Cu were studied after processing by high-pressure torsion (HPT). The annealing of Cu specimens processed by HPT leads to an increase in electroconductivity and a decrease in the wear rate. It is apparent that a nanotribolayer at the surface induced during wear sliding plays a more significant role than the ultrafine-grained structure. A slight increase was observed in the microhardness of HPT copper specimens upon annealing at a relatively low temperature (100°C), and this is most likely due to a change in texture. The annealing leads to an increase in the Taylor factor by ~5 %, which is in good agreement with the increase in the microhardness level which is also by ~5%. It is apparent that low-temperature annealing of HPT copper may produce optimal properties of the specimens including high strength and electroconductivity with a lower wear rate. The influences of annealing temperature on the wear properties and electrical conductivity of Cu were studied after processing by high-pressure torsion (HPT). The annealing of Cu specimens processed by HPT leads to an increase in electroconductivity and a decrease in the wear rate. It is apparent that a nanotribolayer at the surface induced during wear sliding plays a more significant role than the ultrafine-grained structure. A slight increase was observed in the microhardness of HPT copper specimens upon annealing at a relatively low temperature (100 degree C), and this is most likely due to a change in texture. The annealing leads to an increase in the Taylor factor by ~5 %, which is in good agreement with the increase in the microhardness level which is also by ~5 %. It is apparent that low-temperature annealing of HPT copper may produce optimal properties of the specimens including high strength and electroconductivity with a lower wear rate. |
| Audience | Academic |
| Author | Kaibyshev, R. Zhilyaev, Alexander P. Langdon, Terence G. Shakhova, I. Belyakov, A. |
| Author_xml | – sequence: 1 givenname: Alexander P. surname: Zhilyaev fullname: Zhilyaev, Alexander P. email: a.zhilyaev@soton.ac.uk organization: Materials Research Group, Faculty of Engineering and the Environment, University of Southampton, Institute for Metals Superplasticity Problems – sequence: 2 givenname: I. surname: Shakhova fullname: Shakhova, I. organization: Belgorod State University – sequence: 3 givenname: A. surname: Belyakov fullname: Belyakov, A. organization: Belgorod State University – sequence: 4 givenname: R. surname: Kaibyshev fullname: Kaibyshev, R. organization: Belgorod State University – sequence: 5 givenname: Terence G. surname: Langdon fullname: Langdon, Terence G. organization: Materials Research Group, Faculty of Engineering and the Environment, University of Southampton, Departments of Aerospace & Mechanical Engineering and Materials Science, University of Southern California |
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| CitedBy_id | crossref_primary_10_1016_j_wear_2015_04_014 crossref_primary_10_1016_j_jmrt_2014_06_008 crossref_primary_10_1016_j_msea_2020_138985 crossref_primary_10_1007_s10853_016_0331_8 crossref_primary_10_1016_j_wear_2014_12_022 crossref_primary_10_22226_2410_3535_2020_3_322_327 crossref_primary_10_1080_14786435_2019_1703055 crossref_primary_10_1002_adem_201900547 crossref_primary_10_1088_1361_6528_acbb7d crossref_primary_10_3390_met7080289 crossref_primary_10_3390_cryst13030413 crossref_primary_10_1007_s11837_019_03752_w crossref_primary_10_1016_j_matchar_2022_112059 crossref_primary_10_1016_j_msea_2016_01_027 crossref_primary_10_22226_2410_3535_2019_4_561_565 crossref_primary_10_1007_s10853_014_8208_1 |
| Cites_doi | 10.1134/S0036029511110085 10.1080/09500830410001663734 10.1016/j.actamat.2009.05.017 10.1016/j.wear.2007.01.012 10.1016/j.msea.2007.05.083 10.1016/0036-9748(79)90395-8 10.1002/1521-396X(199708)162:2<559::AID-PSSA559>3.0.CO;2-Z 10.1016/S0921-5093(00)01881-5 10.1016/j.msea.2007.08.086 10.1016/S0921-5093(00)00919-9 10.1016/S0043-1648(97)00164-6 10.1002/adma.200602276 10.1016/j.actamat.2004.06.040 10.1557/JMR.1999.0546 10.1016/j.wear.2012.07.008 10.1016/j.wear.2007.01.095 10.1126/science.1124268 10.1016/j.msea.2005.08.027 10.1016/j.matlet.2010.10.090 10.4028/www.scientific.net/MSF.503-504.113 10.1016/j.wear.2013.06.001 10.1016/0036-9748(79)90222-9 10.1016/j.wear.2009.07.009 10.1146/annurev.ms.18.080188.001041 10.1007/s11249-009-9498-3 10.1016/j.wear.2008.12.102 10.1016/S0079-6425(99)00007-9 10.1016/j.msea.2006.04.156 10.1016/j.actamat.2012.02.027 10.1016/j.msea.2005.08.133 10.1016/j.msea.2007.08.070 10.1016/j.actamat.2006.07.013 10.1134/S0036029510110091 10.1007/s10853-010-4643-9 10.1007/s11837-012-0427-9 10.1007/s10853-006-0745-9 10.1016/j.msea.2011.07.040 |
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| Keywords | Taylor Factor Misorientation Distribution Wear Test Wear Rate Orientation Imaging Microscopy |
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| SubjectTerms | Annealing ANNEALING PROCESSES Characterization and Evaluation of Materials Chemistry and Materials Science Classical Mechanics Copper Crystallography and Scattering Methods Electric properties Electrical conductivity Electrical resistivity Materials Science Microhardness Polymer Sciences Solid Mechanics Torsion Ultrafines Wear rate Wear resistance |
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| Title | Effect of annealing on wear resistance and electroconductivity of copper processed by high-pressure torsion |
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