Recycling of AlSi8Cu3 alloy chips via high pressure torsion

• Published in: Materials science & engineering. A, Structural materials : properties, microstructure and processing Vol. 560; pp. 121 - 128
• Main Authors: Abd El Aal, Mohamed Ibrahim, Yoo Yoon, Eun, Seop Kim, Hyoung
• Format: Journal Article
• Language: English
• Published: Kidlington Elsevier B.V 10.01.2013; Elsevier
• Subjects: Aluminum; Aluminum base alloys; Al–Si alloy; Applied sciences; Chip recycling; Chips; Cold working, work hardening; annealing, quenching, tempering, recovery, and recrystallization; textures; Compacting; Condensed matter: structure, mechanical and thermal properties; Consolidation; Cross-disciplinary physics: materials science; rheology; Defects and impurities in crystals; microstructure; Deformation; Densification; Exact sciences and technology; Grain and twin boundaries; Grain boundaries; Grain refinement; Hardness; High pressure torsion; Materials science; Mechanical properties and methods of testing. Rheology. Fracture mechanics. Tribology; Metals. Metallurgy; Microstructure; Physics; Severe plastic deformation; Structural materials; Structure of solids and liquids; crystallography; Treatment of materials and its effects on microstructure and properties; Severe plastic deformation; Densification; High pressure torsion; Chip recycling; Grain refinement; Al–Si alloy; Particle size; High strain; Aluminium base alloys; Mechanical properties; Plastic deformation; Hardness; Crystal defect; Chip; Microhardness; Grain boundary; Pressure effect; Al―Si alloy; Microstructure

In this paper, AlSi8Cu3 alloy chips were consolidated via HPT at an applied pressure 8GPa for 10 revolutions at room temperature. The microstructure and hardness of the HPT consolidated chips were investigated and compared with those of the HPT processed solid AlSi8Cu3 alloy samples and cold compact...