An abrasive-free chemical polishing method assisted by nickel catalyst generated by in situ electrochemical plating

An abrasive-free polishing method using water and a Pt catalyst, called catalyst-referred etching (CARE), has been developed for the finishing of optical and semiconductor surfaces. This method realizes well-ordered surfaces with a smoothness of several tens of picometers without crystallographic di...

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Published inReview of scientific instruments Vol. 91; no. 4; p. 045108
Main Authors Toh, Daisetsu, Van Bui, Pho, Isohashi, Ai, Matsuyama, Satoshi, Yamauchi, Kazuto, Sano, Yasuhisa
Format Journal Article
LanguageEnglish
Published United States 01.04.2020
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Abstract An abrasive-free polishing method using water and a Pt catalyst, called catalyst-referred etching (CARE), has been developed for the finishing of optical and semiconductor surfaces. This method realizes well-ordered surfaces with a smoothness of several tens of picometers without crystallographic disturbance. In this study, we propose a new CARE method using a Ni catalyst with in situ electrochemical plating and dissolution, which enable enhancing the catalytic capability of Ni. This method has advantages to realize more than ten times higher removal rate and better stability compared with the conventional CARE method.
AbstractList An abrasive-free polishing method using water and a Pt catalyst, called catalyst-referred etching (CARE), has been developed for the finishing of optical and semiconductor surfaces. This method realizes well-ordered surfaces with a smoothness of several tens of picometers without crystallographic disturbance. In this study, we propose a new CARE method using a Ni catalyst with in situ electrochemical plating and dissolution, which enable enhancing the catalytic capability of Ni. This method has advantages to realize more than ten times higher removal rate and better stability compared with the conventional CARE method.
Author Matsuyama, Satoshi
Toh, Daisetsu
Sano, Yasuhisa
Van Bui, Pho
Yamauchi, Kazuto
Isohashi, Ai
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  organization: Department of Precision Science and Technology, Graduate School of Engineering, Osaka University, 2-1 Yamada-oka, Suita, Osaka 565-0871, Japan
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Title An abrasive-free chemical polishing method assisted by nickel catalyst generated by in situ electrochemical plating
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