An abrasive-free chemical polishing method assisted by nickel catalyst generated by in situ electrochemical plating
An abrasive-free polishing method using water and a Pt catalyst, called catalyst-referred etching (CARE), has been developed for the finishing of optical and semiconductor surfaces. This method realizes well-ordered surfaces with a smoothness of several tens of picometers without crystallographic di...
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Published in | Review of scientific instruments Vol. 91; no. 4; p. 045108 |
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Main Authors | , , , , , |
Format | Journal Article |
Language | English |
Published |
United States
01.04.2020
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Abstract | An abrasive-free polishing method using water and a Pt catalyst, called catalyst-referred etching (CARE), has been developed for the finishing of optical and semiconductor surfaces. This method realizes well-ordered surfaces with a smoothness of several tens of picometers without crystallographic disturbance. In this study, we propose a new CARE method using a Ni catalyst with in situ electrochemical plating and dissolution, which enable enhancing the catalytic capability of Ni. This method has advantages to realize more than ten times higher removal rate and better stability compared with the conventional CARE method. |
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AbstractList | An abrasive-free polishing method using water and a Pt catalyst, called catalyst-referred etching (CARE), has been developed for the finishing of optical and semiconductor surfaces. This method realizes well-ordered surfaces with a smoothness of several tens of picometers without crystallographic disturbance. In this study, we propose a new CARE method using a Ni catalyst with in situ electrochemical plating and dissolution, which enable enhancing the catalytic capability of Ni. This method has advantages to realize more than ten times higher removal rate and better stability compared with the conventional CARE method. |
Author | Matsuyama, Satoshi Toh, Daisetsu Sano, Yasuhisa Van Bui, Pho Yamauchi, Kazuto Isohashi, Ai |
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Title | An abrasive-free chemical polishing method assisted by nickel catalyst generated by in situ electrochemical plating |
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