A data-driven method for enhancing the image-based automatic inspection of IC wire bonding defects - Chen, Junlong; Zhang, Zijun; Wu, Feng (International journal of production research, 2021)
Keywords: Algorithms; Artificial neural networks; automatic inspection; Bonding; Classification; Data mining; Defects; Feature extraction; Image enhancement; Image segmentation; Inspection; Integrated circuits; intelligent manufacturing; Semiconductors; Wire; wire bonding quality; X-ray images