APA (7th ed.) Citation

Chen, J., Zhang, Z., & Wu, F. (2021). A data-driven method for enhancing the image-based automatic inspection of IC wire bonding defects. International journal of production research, 59(16), 4779-4793. https://doi.org/10.1080/00207543.2020.1821928

Chicago Style (17th ed.) Citation

Chen, Junlong, Zijun Zhang, and Feng Wu. "A Data-driven Method for Enhancing the Image-based Automatic Inspection of IC Wire Bonding Defects." International Journal of Production Research 59, no. 16 (2021): 4779-4793. https://doi.org/10.1080/00207543.2020.1821928.

MLA (9th ed.) Citation

Chen, Junlong, et al. "A Data-driven Method for Enhancing the Image-based Automatic Inspection of IC Wire Bonding Defects." International Journal of Production Research, vol. 59, no. 16, 2021, pp. 4779-4793, https://doi.org/10.1080/00207543.2020.1821928.