Enhanced dielectric properties of polypropylene based composite using Bi2S3 nanorod filler

<正>A novel two-phase composite system using polypropylene(PP) as matrix and semiconductor bismuth sulfide(Bi2S3) as filler,was prepared by a simple process.Surfactant KH550 was chosen to modify the interface between inorganic fillers and organic PP matrix.The variations of dielectric p...

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Published inProgress in natural science Vol. 21; no. 3; pp. 216 - 220
Main Authors DANG, Yu, WANG, Yao, DENG, Yuan, LI, Mao, ZHANG, Ye, ZHANG, Zhi-wei
Format Journal Article
LanguageEnglish
Published Elsevier Ltd 01.06.2011
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ISSN1002-0071
DOI10.1016/S1002-0071(12)60033-1

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Abstract <正>A novel two-phase composite system using polypropylene(PP) as matrix and semiconductor bismuth sulfide(Bi2S3) as filler,was prepared by a simple process.Surfactant KH550 was chosen to modify the interface between inorganic fillers and organic PP matrix.The variations of dielectric properties of the Bi2S3/PP composites with the volume fraction of Bi2S3,frequency and temperature were discussed.The results reveal a percolative behavior of the composites with the threshold of 0.08.The composite is demonstrated to have good dielectric properties.The thermal stability of dielectric property and high breakdown strength of the composites show their potential application in film capacitor.
AbstractList A novel two-phase composite system using polypropylene (PP) as matrix and semiconductor bismuth sulfide (Bi2S3) as filler, was prepared by a simple process. Surfactant KH550 was chosen to modify the interface between inorganic fillers and organic PP matrix. The variations of dielectric properties of the Bi2S3/PP composites with the volume fraction of Bi2S3, frequency and temperature were discussed. The results reveal a percolative behavior of the composites with the threshold of 0.08. The composite is demonstrated to have good dielectric properties. The thermal stability of dielectric property and high breakdown strength of the composites show their potential application in film capacitor.
<正>A novel two-phase composite system using polypropylene(PP) as matrix and semiconductor bismuth sulfide(Bi2S3) as filler,was prepared by a simple process.Surfactant KH550 was chosen to modify the interface between inorganic fillers and organic PP matrix.The variations of dielectric properties of the Bi2S3/PP composites with the volume fraction of Bi2S3,frequency and temperature were discussed.The results reveal a percolative behavior of the composites with the threshold of 0.08.The composite is demonstrated to have good dielectric properties.The thermal stability of dielectric property and high breakdown strength of the composites show their potential application in film capacitor.
Author Yu DANG,Yao WANG,Yuan DENG,Mao LI,Ye ZHANG,Zhi-wei ZHANG Beijing Key Laboratory of Special Functional Materials and Film,School of Chemistry and Environment, Beihang University,Beijing 100191,China
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Keywords interface
dielectric properties
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Notes Yu DANG,Yao WANG,Yuan DENG,Mao LI,Ye ZHANG,Zhi-wei ZHANG Beijing Key Laboratory of Special Functional Materials and Film,School of Chemistry and Environment, Beihang University,Beijing 100191,China
11-3853/N
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  doi: 10.1002/adfm.200800109
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Snippet <正>A novel two-phase composite system using polypropylene(PP) as matrix and semiconductor bismuth sulfide(Bi2S3) as filler,was prepared by a simple...
A novel two-phase composite system using polypropylene (PP) as matrix and semiconductor bismuth sulfide (Bi2S3) as filler, was prepared by a simple process....
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chongqing
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StartPage 216
SubjectTerms composite
composite materials
dielectric
dielectric properties
interface
materials
properties
Title Enhanced dielectric properties of polypropylene based composite using Bi2S3 nanorod filler
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https://dx.doi.org/10.1016/S1002-0071(12)60033-1
Volume 21
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