APA (7th ed.) Citation

Li, J., Liu, Y., Wang, T., & Lu, X. (2015). Chemical effects on the tribological behavior during copper chemical mechanical planarization. Materials chemistry and physics, 153, 48-53. https://doi.org/10.1016/j.matchemphys.2014.12.033

Chicago Style (17th ed.) Citation

Li, Jing, Yuhong Liu, Tongqing Wang, and Xinchun Lu. "Chemical Effects on the Tribological Behavior During Copper Chemical Mechanical Planarization." Materials Chemistry and Physics 153 (2015): 48-53. https://doi.org/10.1016/j.matchemphys.2014.12.033.

MLA (9th ed.) Citation

Li, Jing, et al. "Chemical Effects on the Tribological Behavior During Copper Chemical Mechanical Planarization." Materials Chemistry and Physics, vol. 153, 2015, pp. 48-53, https://doi.org/10.1016/j.matchemphys.2014.12.033.