Thermal runaway evaluation using DSC1, VSP2, and kinetics models on Cu etchant and its waste in high-tech etching process

• Published in: Journal of thermal analysis and calorimetry Vol. 144; no. 2; pp. 285 - 294
• Main Authors: Lin, Yu-Jung, Lin, Zih-Syuan, Wang, Yih-Wen
• Format: Journal Article
• Language: English
• Published: Cham Springer International Publishing 01.04.2021; Springer; Springer Nature B.V
• Subjects: Analytical Chemistry; Atmospheric models; Backup software; Calorimetry; Chemical reaction, Rate of; Chemistry; Chemistry and Materials Science; Copper; Enthalpy; Etchants; Etching; Evaluation; Exothermic reactions; Gas evolution; Hydrogen peroxide; Inorganic Chemistry; Kinetics; Measurement Science and Instrumentation; Occupational health and safety; Parameter identification; Peroxides; Physical Chemistry; Polymer Sciences; Pyrolysis; Reaction kinetics; Thermal decomposition; Thermal runaway; Hydrogen peroxide; Cu etchant; Thermal decomposition; Thermokinetic analysis

Cu etchant solutions have been widely used in etching processes because of their high etching efficiency and low cost for manufacturing electric products. Hydrogen peroxide (H 2 O 2 ), a major components of Cu etchants, is known for its instability and reactivity under thermal induction, metal-ion c...