Thermal runaway evaluation using DSC1, VSP2, and kinetics models on Cu etchant and its waste in high-tech etching process - Lin, Yu-Jung; Lin, Zih-Syuan; Wang, Yih-Wen (Journal of thermal analysis and calorimetry, 2021)
Keywords: Analytical Chemistry; Atmospheric models; Backup software; Calorimetry; Chemical reaction, Rate of; Chemistry; Chemistry and Materials Science; Copper; Enthalpy; Etchants; Etching; Evaluation; Exothermic reactions; Gas evolution; Hydrogen peroxide; Inorganic Chemistry; Kinetics; Measurement Science and Instrumentation; Occupational health and safety; Parameter identification; Peroxides; Physical Chemistry; Polymer Sciences; Pyrolysis; Reaction kinetics; Thermal decomposition; Thermal runaway; Hydrogen peroxide; Cu etchant; Thermal decomposition; Thermokinetic analysis