APA (7th ed.) Citation

Lin, Y., Lin, Z., & Wang, Y. (2021). Thermal runaway evaluation using DSC1, VSP2, and kinetics models on Cu etchant and its waste in high-tech etching process. Journal of thermal analysis and calorimetry, 144(2), 285-294. https://doi.org/10.1007/s10973-020-10094-2

Chicago Style (17th ed.) Citation

Lin, Yu-Jung, Zih-Syuan Lin, and Yih-Wen Wang. "Thermal Runaway Evaluation Using DSC1, VSP2, and Kinetics Models on Cu Etchant and Its Waste in High-tech Etching Process." Journal of Thermal Analysis and Calorimetry 144, no. 2 (2021): 285-294. https://doi.org/10.1007/s10973-020-10094-2.

MLA (9th ed.) Citation

Lin, Yu-Jung, et al. "Thermal Runaway Evaluation Using DSC1, VSP2, and Kinetics Models on Cu Etchant and Its Waste in High-tech Etching Process." Journal of Thermal Analysis and Calorimetry, vol. 144, no. 2, 2021, pp. 285-294, https://doi.org/10.1007/s10973-020-10094-2.