Self-Healing and Reprocessable Oleic Acid-Based Elastomer with Dynamic S-S Bonds as Solvent-Free Reusable Adhesive on Copper Surface
In the last decade, the application of dynamic covalent chemistry in the field of polymeric materials has become the subject of an increasing number of studies, gaining applicative relevance. This is due to the fact that polymers containing dynamic functions possess a structure that affords reproces...
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| Published in | Polymers Vol. 14; no. 22; p. 4919 |
|---|---|
| Main Authors | , , , , , , , , , , , |
| Format | Journal Article |
| Language | English |
| Published |
Switzerland
MDPI AG
14.11.2022
MDPI |
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| Online Access | Get full text |
| ISSN | 2073-4360 2073-4360 |
| DOI | 10.3390/polym14224919 |
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| Abstract | In the last decade, the application of dynamic covalent chemistry in the field of polymeric materials has become the subject of an increasing number of studies, gaining applicative relevance. This is due to the fact that polymers containing dynamic functions possess a structure that affords reprocessability, recyclability and peculiar self-healing properties inconceivable for “classic” polymer networks. Consequently, the synthesis of a dynamic covalent chemistry-based polymer and its chemical, thermal, and mechanical characterizations are reported in the present research. In particular, oleic acid has been used as starting material to follow the founding principles of the circular economy system and, thanks to the aromatic disulfide component, which is the foundation of the material dynamic characteristics, the obtained polymer resulted as being reprocessable and self-healable. Moreover, the polymer can strongly interact with copper surfaces through the formation of stable Cu-S bonds. Then, the application of the polymer as a solvent-free reusable adhesive for copper was investigated by lap joint shear tests and comparisons with the properties of an analogous material, devoid of the disulfide bonds, were conducted. |
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| AbstractList | In the last decade, the application of dynamic covalent chemistry in the field of polymeric materials has become the subject of an increasing number of studies, gaining applicative relevance. This is due to the fact that polymers containing dynamic functions possess a structure that affords reprocessability, recyclability and peculiar self-healing properties inconceivable for “classic” polymer networks. Consequently, the synthesis of a dynamic covalent chemistry-based polymer and its chemical, thermal, and mechanical characterizations are reported in the present research. In particular, oleic acid has been used as starting material to follow the founding principles of the circular economy system and, thanks to the aromatic disulfide component, which is the foundation of the material dynamic characteristics, the obtained polymer resulted as being reprocessable and self-healable. Moreover, the polymer can strongly interact with copper surfaces through the formation of stable Cu-S bonds. Then, the application of the polymer as a solvent-free reusable adhesive for copper was investigated by lap joint shear tests and comparisons with the properties of an analogous material, devoid of the disulfide bonds, were conducted. In the last decade, the application of dynamic covalent chemistry in the field of polymeric materials has become the subject of an increasing number of studies, gaining applicative relevance. This is due to the fact that polymers containing dynamic functions possess a structure that affords reprocessability, recyclability and peculiar self-healing properties inconceivable for "classic" polymer networks. Consequently, the synthesis of a dynamic covalent chemistry-based polymer and its chemical, thermal, and mechanical characterizations are reported in the present research. In particular, oleic acid has been used as starting material to follow the founding principles of the circular economy system and, thanks to the aromatic disulfide component, which is the foundation of the material dynamic characteristics, the obtained polymer resulted as being reprocessable and self-healable. Moreover, the polymer can strongly interact with copper surfaces through the formation of stable Cu-S bonds. Then, the application of the polymer as a solvent-free reusable adhesive for copper was investigated by lap joint shear tests and comparisons with the properties of an analogous material, devoid of the disulfide bonds, were conducted.In the last decade, the application of dynamic covalent chemistry in the field of polymeric materials has become the subject of an increasing number of studies, gaining applicative relevance. This is due to the fact that polymers containing dynamic functions possess a structure that affords reprocessability, recyclability and peculiar self-healing properties inconceivable for "classic" polymer networks. Consequently, the synthesis of a dynamic covalent chemistry-based polymer and its chemical, thermal, and mechanical characterizations are reported in the present research. In particular, oleic acid has been used as starting material to follow the founding principles of the circular economy system and, thanks to the aromatic disulfide component, which is the foundation of the material dynamic characteristics, the obtained polymer resulted as being reprocessable and self-healable. Moreover, the polymer can strongly interact with copper surfaces through the formation of stable Cu-S bonds. Then, the application of the polymer as a solvent-free reusable adhesive for copper was investigated by lap joint shear tests and comparisons with the properties of an analogous material, devoid of the disulfide bonds, were conducted. |
| Audience | Academic |
| Author | Pettazzoni, Luca Vetica, Fabrizio Napoleone, Valerio Marrani, Andrea Giacomo Amato, Francesco Alfano, Sara Migneco, Luisa Maria Colecchia, Andrea Leonelli, Francesca Celio, Lorenzo Di Lisio, Valerio Martinelli, Andrea |
| AuthorAffiliation | 1 Department of Chemistry, Sapienza University of Rome, 00185 Rome, Italy 2 Donostia International Physics Center, Paseo Manuel de Lardizabal, 4, 20018 San Sebastian, Spain |
| AuthorAffiliation_xml | – name: 2 Donostia International Physics Center, Paseo Manuel de Lardizabal, 4, 20018 San Sebastian, Spain – name: 1 Department of Chemistry, Sapienza University of Rome, 00185 Rome, Italy |
| Author_xml | – sequence: 1 givenname: Luca surname: Pettazzoni fullname: Pettazzoni, Luca – sequence: 2 givenname: Francesca orcidid: 0000-0002-4135-5727 surname: Leonelli fullname: Leonelli, Francesca – sequence: 3 givenname: Andrea Giacomo orcidid: 0000-0002-3203-9642 surname: Marrani fullname: Marrani, Andrea Giacomo – sequence: 4 givenname: Luisa Maria orcidid: 0000-0001-6657-7994 surname: Migneco fullname: Migneco, Luisa Maria – sequence: 5 givenname: Fabrizio orcidid: 0000-0002-7171-8779 surname: Vetica fullname: Vetica, Fabrizio – sequence: 6 givenname: Lorenzo orcidid: 0000-0001-6953-6733 surname: Celio fullname: Celio, Lorenzo – sequence: 7 givenname: Valerio surname: Napoleone fullname: Napoleone, Valerio – sequence: 8 givenname: Sara orcidid: 0000-0002-8460-800X surname: Alfano fullname: Alfano, Sara – sequence: 9 givenname: Andrea surname: Colecchia fullname: Colecchia, Andrea – sequence: 10 givenname: Francesco orcidid: 0000-0003-1577-7421 surname: Amato fullname: Amato, Francesco – sequence: 11 givenname: Valerio orcidid: 0000-0001-7729-8069 surname: Di Lisio fullname: Di Lisio, Valerio – sequence: 12 givenname: Andrea orcidid: 0000-0002-6401-9988 surname: Martinelli fullname: Martinelli, Andrea |
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| Keywords | bio-based elastomer adhesive disulfide self-healing |
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| SubjectTerms | Bond strength Chemical bonds Chemical synthesis Chromatography Contact angle Copper Copper products Dynamic characteristics Elastomers Lap joints Mechanical properties Monounsaturated fatty acids Oleic acid Particle size Polymers Recyclability Shear tests Solvents |
| Title | Self-Healing and Reprocessable Oleic Acid-Based Elastomer with Dynamic S-S Bonds as Solvent-Free Reusable Adhesive on Copper Surface |
| URI | https://www.ncbi.nlm.nih.gov/pubmed/36433046 https://www.proquest.com/docview/2739454429 https://www.proquest.com/docview/2740510681 https://pubmed.ncbi.nlm.nih.gov/PMC9695700 |
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