Investigation of the Chemical Structure of Ultra-Thin Polyimide Substrate for the Xenon Flash Lamp Lift-off Technology

Lift-off is one of the last steps in the production of next-generation flexible electronics. It is important that this step is completed quickly to prevent damage to ultrathin manufactured electronics. This study investigated the chemical structure of polyimide most suitable for the Xe Flash lamp-Li...

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Published inPolymers Vol. 13; no. 4; p. 546
Main Authors Jang, Seong Hyun, Han, Young Joon, Lee, Sang Yoon, Lee, Geonho, Jung, Jae Woong, Cho, Kwan Hyun, Choi, Jun
Format Journal Article
LanguageEnglish
Published Switzerland MDPI 12.02.2021
MDPI AG
Subjects
chemical structure
colorless
flexible electronics
lift-off
polyimide
xenon flash lamp
flexible electronics
colorless
lift-off
chemical structure
polyimide
xenon flash lamp
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Abstract Lift-off is one of the last steps in the production of next-generation flexible electronics. It is important that this step is completed quickly to prevent damage to ultrathin manufactured electronics. This study investigated the chemical structure of polyimide most suitable for the Xe Flash lamp-Lift-Off process, a next-generation lift-off technology that will replace the current dominant laser lift-off process. Based on the characteristics of the peeled-off polyimide films, the Xe Flash lamp based lift-off mechanism was identified as photothermal decomposition. This occurs by thermal conduction via light-to-heat conversion. The synthesized polyimide films treated with the Xe Flash lamp-Lift-Off process exhibited various thermal, optical, dielectric, and surface characteristics depending on their chemical structures. The polyimide molecules with high concentrations of -CF functional groups and kinked chemical structures demonstrated the most promising peeling properties, optical transparencies, and dielectric constants. In particular, an ultra-thin polyimide substrate (6 μm) was successfully fabricated and showed potential for use in next-generation flexible electronics.
AbstractList Lift-off is one of the last steps in the production of next-generation flexible electronics. It is important that this step is completed quickly to prevent damage to ultrathin manufactured electronics. This study investigated the chemical structure of polyimide most suitable for the Xe Flash lamp–Lift-Off process, a next-generation lift-off technology that will replace the current dominant laser lift-off process. Based on the characteristics of the peeled-off polyimide films, the Xe Flash lamp based lift-off mechanism was identified as photothermal decomposition. This occurs by thermal conduction via light-to-heat conversion. The synthesized polyimide films treated with the Xe Flash lamp–Lift-Off process exhibited various thermal, optical, dielectric, and surface characteristics depending on their chemical structures. The polyimide molecules with high concentrations of –CF 3 functional groups and kinked chemical structures demonstrated the most promising peeling properties, optical transparencies, and dielectric constants. In particular, an ultra-thin polyimide substrate (6 μm) was successfully fabricated and showed potential for use in next-generation flexible electronics.
Lift-off is one of the last steps in the production of next-generation flexible electronics. It is important that this step is completed quickly to prevent damage to ultrathin manufactured electronics. This study investigated the chemical structure of polyimide most suitable for the Xe Flash lamp-Lift-Off process, a next-generation lift-off technology that will replace the current dominant laser lift-off process. Based on the characteristics of the peeled-off polyimide films, the Xe Flash lamp based lift-off mechanism was identified as photothermal decomposition. This occurs by thermal conduction via light-to-heat conversion. The synthesized polyimide films treated with the Xe Flash lamp-Lift-Off process exhibited various thermal, optical, dielectric, and surface characteristics depending on their chemical structures. The polyimide molecules with high concentrations of -CF functional groups and kinked chemical structures demonstrated the most promising peeling properties, optical transparencies, and dielectric constants. In particular, an ultra-thin polyimide substrate (6 μm) was successfully fabricated and showed potential for use in next-generation flexible electronics.
Lift-off is one of the last steps in the production of next-generation flexible electronics. It is important that this step is completed quickly to prevent damage to ultrathin manufactured electronics. This study investigated the chemical structure of polyimide most suitable for the Xe Flash lamp–Lift-Off process, a next-generation lift-off technology that will replace the current dominant laser lift-off process. Based on the characteristics of the peeled-off polyimide films, the Xe Flash lamp based lift-off mechanism was identified as photothermal decomposition. This occurs by thermal conduction via light-to-heat conversion. The synthesized polyimide films treated with the Xe Flash lamp–Lift-Off process exhibited various thermal, optical, dielectric, and surface characteristics depending on their chemical structures. The polyimide molecules with high concentrations of –CF3 functional groups and kinked chemical structures demonstrated the most promising peeling properties, optical transparencies, and dielectric constants. In particular, an ultra-thin polyimide substrate (6 μm) was successfully fabricated and showed potential for use in next-generation flexible electronics.
Author Jang, Seong Hyun
Lee, Geonho
Lee, Sang Yoon
Jung, Jae Woong
Han, Young Joon
Cho, Kwan Hyun
Choi, Jun
AuthorAffiliation 1 Human Convergence Technology R&D Department, Korea Institute of Industrial Technology (KITECH), Ansan 15588, Korea; seonghyun@kitech.re.kr (S.H.J.); sangyoon@kitech.re.kr (S.Y.L.); geonho118@kitech.re.kr (G.L.)
2 Department of Advanced Material Engineering for Information & Electrices, Kyunghee University, Yongin 17104, Korea
4 Department of Chemical Engineering, Kyunghee University, Yongin 17104, Korea
3 Manufacturing Process Platform R&D Department, Korea Institute of Industrial Technology (KITECH), Ansan 15588, Korea; youngjhan@kitech.re.kr
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Issue 4
Keywords flexible electronics
colorless
lift-off
chemical structure
polyimide
xenon flash lamp
Language English
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  contributor:
    fullname: Kim
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Snippet Lift-off is one of the last steps in the production of next-generation flexible electronics. It is important that this step is completed quickly to prevent...
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StartPage 546
SubjectTerms chemical structure
colorless
flexible electronics
lift-off
polyimide
xenon flash lamp
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Title Investigation of the Chemical Structure of Ultra-Thin Polyimide Substrate for the Xenon Flash Lamp Lift-off Technology
URI https://www.ncbi.nlm.nih.gov/pubmed/33673286
https://search.proquest.com/docview/2498511883
https://pubmed.ncbi.nlm.nih.gov/PMC7918077
https://doaj.org/article/08644aab7142402bb0e91979308f6feb
Volume 13
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