On the Roadmap, Off the Roadmap, Beyond the Roadmap for Lithography

• Published in: Journal of Photopolymer Science and Technology Vol. 12; no. 4; pp. 585 - 590
• Main Author: Sasago, Masaru
• Format: Journal Article
• Language: English
• Published: Hiratsuka The Society of Photopolymer Science and Technology(SPST) 1999; Japan Science and Technology Agency
• Subjects: ArF excimer laser; electron beam direct writing; extreme ultraviolet; lithography; mask; proximity X-ray; resist; vacuum ultraviolet
• DOI: 10.2494/photopolymer.12.585
• ISSN: 0914-9244

The semiconductor industry, the long period of sustained growth which is, in no small measure due to the optical lithography process, is now faced with a dilemma. Optical lithography has reached a crossroad, and after many years of steady improvement in device performance, device integration, and cost reduction, the industry is facing a major crisis. In Japan, Europe and the U.S., consortiums comprising members from government, business, and academic organizations have been formed in an effort to ward off the coming crisis. Their work seeks to extend the useful life of optical lithography as well as to foster the development of post-optical lithographic processes. The main problem faced by them is to ascertain how the development of sub-0.1μm lithographic technology will affect the economics of semiconductor manufacture. In this paper discusses the limits of current optical lithography processes such as VUV lithography and worldwide trends in developing post-optical lithographic processes. Future miniaturization trends in semiconductor production are also discussed.