Analytical Evaluation of Via-Plate Capacitance for Multilayer Printed Circuit Boards and Packages

The via-plate capacitance for a via transition to a multilayer printed circuit board is evaluated analytically in terms of higher order parallel-plate modes. The Green's function in a bounded coaxial cavity for a concentric magnetic ring current is first derived by introducing reflection coeffi...

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Bibliographic Details
Published inIEEE transactions on microwave theory and techniques Vol. 56; no. 9; pp. 2118 - 2128
Main Authors Yaojiang Zhang, Fan, J., Selli, G., Cocchini, M., de Paulis, F.
Format Journal Article
LanguageEnglish
Published New York, NY IEEE 01.09.2008
Institute of Electrical and Electronics Engineers
The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
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