Analytical Evaluation of Via-Plate Capacitance for Multilayer Printed Circuit Boards and Packages
The via-plate capacitance for a via transition to a multilayer printed circuit board is evaluated analytically in terms of higher order parallel-plate modes. The Green's function in a bounded coaxial cavity for a concentric magnetic ring current is first derived by introducing reflection coeffi...
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Published in | IEEE transactions on microwave theory and techniques Vol. 56; no. 9; pp. 2118 - 2128 |
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Main Authors | , , , , |
Format | Journal Article |
Language | English |
Published |
New York, NY
IEEE
01.09.2008
Institute of Electrical and Electronics Engineers The Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Subjects | |
Online Access | Get full text |
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