Santos, W. L., Silva, B. L., Bertelli, F., Spinelli, J. E., Cheung, N., & Garcia, A. (2016). An alternative thermal approach to evaluate the wettability of solder alloys. Applied thermal engineering, 107, 431-440. https://doi.org/10.1016/j.applthermaleng.2016.06.177
Chicago Style (17th ed.) CitationSantos, Washington L.R., Bismarck L. Silva, Felipe Bertelli, José E. Spinelli, Noé Cheung, and Amauri Garcia. "An Alternative Thermal Approach to Evaluate the Wettability of Solder Alloys." Applied Thermal Engineering 107 (2016): 431-440. https://doi.org/10.1016/j.applthermaleng.2016.06.177.
MLA (9th ed.) CitationSantos, Washington L.R., et al. "An Alternative Thermal Approach to Evaluate the Wettability of Solder Alloys." Applied Thermal Engineering, vol. 107, 2016, pp. 431-440, https://doi.org/10.1016/j.applthermaleng.2016.06.177.