Benzo-cyclo-butene bonding process with ‘stamp’ printing for wafer level package

• Published in: Micro & nano letters Vol. 9; no. 5; pp. 363 - 366
• Main Authors: Xia, Wen, Li, Lei, Deng, Kangfa, Li, Song, Su, Weiguo, Zhang, Wei
• Format: Journal Article
• Language: English
• Published: Stevenage The Institution of Engineering and Technology 01.05.2014; John Wiley & Sons, Inc
• Subjects: acceleration microswitch; auxiliary wafer material; benzo‐cyclo‐butene bonding process; Bonding; bonding quality; Bonding strength; curing; Holes; Liquids; Manuals; microswitches; organic compounds; Packages; precuring time; Printing; stamp printing; tensile bonding test; tensile testing; three‐dimensional structures; wafer bonding; wafer level package; wafer level packaging; Wafers; microswitches; stamp printing; benzo-cyclo-butene bonding process; bonding quality; tensile bonding test; wafer level packaging; auxiliary wafer material; acceleration microswitch; tensile testing; wafer bonding; bonding strength; curing; organic compounds; three-dimensional structures; wafer level package; precuring time

Presented is a novel process of benzo-cyclo-butene (BCB) bonding for a wafer level package with ‘stamp’ printing, in which the BCB structure is transferred and patterned by pressing the cap wafer towards another wafer with a liquid BCB layer. Compared with the conventional BCB bonding process, this...