APA (7th ed.) Citation

Cui, J., Liu, X., Xie, Y., Wu, K., Wang, Y., Liu, Y., . . . Xia, Y. (2020). Improved electrochemical reversibility of Zn plating/stripping: A promising approach to suppress water-induced issues through the formation of H-bonding. Materials today energy, 18(C), 100563. https://doi.org/10.1016/j.mtener.2020.100563

Chicago Style (17th ed.) Citation

Cui, Jin, Xiaoyu Liu, Yihua Xie, Kai Wu, Yongqing Wang, Yuyu Liu, Jiujun Zhang, Jin Yi, and Yongyao Xia. "Improved Electrochemical Reversibility of Zn Plating/stripping: A Promising Approach to Suppress Water-induced Issues Through the Formation of H-bonding." Materials Today Energy 18, no. C (2020): 100563. https://doi.org/10.1016/j.mtener.2020.100563.

MLA (9th ed.) Citation

Cui, Jin, et al. "Improved Electrochemical Reversibility of Zn Plating/stripping: A Promising Approach to Suppress Water-induced Issues Through the Formation of H-bonding." Materials Today Energy, vol. 18, no. C, 2020, p. 100563, https://doi.org/10.1016/j.mtener.2020.100563.