Impact of Thermal Cycling on Sn-Ag-Cu Solder Joints and Board-Level Drop Reliability

• Published in: Journal of electronic materials Vol. 37; no. 6; pp. 880 - 886
• Main Authors: Xu, Luhua, Pang, John H. L., Che, Faxing
• Format: Journal Article
• Language: English
• Published: Boston Springer US 01.06.2008; Institute of Electrical and Electronics Engineers; Springer Nature B.V
• Subjects: Applied sciences; Brazing. Soldering; Characterization and Evaluation of Materials; Chemistry and Materials Science; Electronics; Electronics and Microelectronics; Exact sciences and technology; Impact tests; Instrumentation; Intermetallic compounds; Joining, thermal cutting: metallurgical aspects; Lead free solders; Materials; Materials Science; Metals. Metallurgy; Microelectronic fabrication (materials and surfaces technology); Optical and Electronic Materials; Reliability; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices; Solid State Physics; Thermal cycling; Kirkendall void; Drop impact; Pb-free solder; thermal cycling; intermetallic compound; ball grid array; Thermal ageing; Brittle fracture; Thermal cycle; Kirkendall effect; Crystal defect; BGA technology; Electronic packaging; Lead free solder; Void; Copper; Bonding; Gold; Intermetallic compound; Durability; Surface treatment; Lifetime; Soldered joint; Nickel; Reliability; Impact test; Interface; Fracture mode

The electronic packaging industry uses electroless nickel immersion gold (ENIG) or Cu-organic solderability preservative (Cu-OSP) as a bonding pad surface finish for solder joints. In portable electronic products, drop impact tests induce solder joint failures via the interfacial intermetallic, whic...