Enhanced cyclic deformation responses of ultrafine-grained Cu and nanocrystalline Cu–Al alloys - An, X.H.; Wu, S.D.; Wang, Z.G.; Zhang, Z.F. (Acta materialia, 2014)
Keywords: Alloys; Amplitudes; Applied sciences; Copper; COPPER ALLOYS (40 TO 99.3 CU); COPPER ALUMINUM ALLOYS; Copper base alloys; CRYSTAL STRUCTURE; Cyclic softening; DEFORMATION; Exact sciences and technology; Fatigue; Fatigue (materials); Fatigue damage mechanism; FATIGUE PROPERTIES; GRAIN SIZE AND SHAPE; High cycle fatigue; Intermetallic compounds; Low cycle fatigue; Mechanical properties and methods of testing. Rheology. Fracture mechanics. Tribology; Metals. Metallurgy; Nanocrystalline Cu–Al alloys; SOFTENING; Stacking fault energy; Ultrafine-grained Cu; Stacking fault energy; Cyclic softening; Ultrafine-grained Cu; Fatigue damage mechanism; Nanocrystalline Cu–Al alloys; Aluminium base alloys; Deformation; Strain softening; Nanocrystalline Cu-Al alloys; Mechanical properties; Stacking fault; Fatigue; Mechanism; Cyclic load; Fine grain structure; Nanocrystal