Electrodeposition Behavior of Nickel from a Low Temperature Urea-molten Salt

The electrodeposition behavior of nickel at glassy carbon(GC) and stainless steel(SS) electrodes in low temperature urea-acetamide-NaBr-KBr melt was investigated using cyclic voltammetry, chrono-amperometric current-time transients and scanning electron microscopy. Cyclic voltammograms and dimension...

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Bibliographic Details
Published inChinese journal of chemical engineering Vol. 21; no. 12; pp. 1397 - 1403
Main Author 张启波 华一新
Format Journal Article
LanguageEnglish
Published Elsevier B.V 01.12.2013
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ISSN1004-9541
2210-321X
DOI10.1016/S1004-9541(13)60641-2

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Summary:The electrodeposition behavior of nickel at glassy carbon(GC) and stainless steel(SS) electrodes in low temperature urea-acetamide-NaBr-KBr melt was investigated using cyclic voltammetry, chrono-amperometric current-time transients and scanning electron microscopy. Cyclic voltammograms and dimensionless chronoamperometric current-time transients analysis show that the electrodeposition of nickel is an irreversible process and proceeds via three-dimensional progressive nucleation with diffusion-controlled growth on both GC and SS substrates. Scanning electron microscopic analysis indicates the nickel deposits obtained on SS electrode are generally uniform, dense, and adherent to the substrate with rounded crystallites in the nanometer size regime. It is also found that the crystal structure of the electrodeposited nickel is independent on the deposition potential. The nickel deposits produced from the melt at higher cathodic potential exhibit larger grain size.
Bibliography:ZHANG Qibo;HUA Yixin( Key Laboratory of Ionic Liquids Metallurgy, Faculty of Metallurgical and Energy Engineering, Kunming University of Science and Tech-nology, Kunming 650093, China)
11-3270/TQ
electrodeposition; nickel; urea molten salt; nucleation
The electrodeposition behavior of nickel at glassy carbon(GC) and stainless steel(SS) electrodes in low temperature urea-acetamide-NaBr-KBr melt was investigated using cyclic voltammetry, chrono-amperometric current-time transients and scanning electron microscopy. Cyclic voltammograms and dimensionless chronoamperometric current-time transients analysis show that the electrodeposition of nickel is an irreversible process and proceeds via three-dimensional progressive nucleation with diffusion-controlled growth on both GC and SS substrates. Scanning electron microscopic analysis indicates the nickel deposits obtained on SS electrode are generally uniform, dense, and adherent to the substrate with rounded crystallites in the nanometer size regime. It is also found that the crystal structure of the electrodeposited nickel is independent on the deposition potential. The nickel deposits produced from the melt at higher cathodic potential exhibit larger grain size.
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ISSN:1004-9541
2210-321X
DOI:10.1016/S1004-9541(13)60641-2