Interfacial heat transport in nano-carbon assemblies

• Published in: Carbon (New York) Vol. 178; pp. 391 - 412
• Main Authors: Qiu, Lin, Zhang, Xiaohua, Guo, Zhixin, Li, Qingwen
• Format: Journal Article
• Language: English
• Published: New York Elsevier Ltd 30.06.2021; Elsevier BV
• Subjects: Assemblies; Carbon; heat tolerance; Heat transfer; Interfacial heat transport; Lattice vibration; Low-frequency phonons; Measurement methods; Nano-carbon assembly; Nanomaterials; Nanostructure; Nanostructured materials; Phonons; Studies; Thermal conductivity; Thermal resistance; Thermal utilization; Thermodynamic properties; Thermal conductivity; Measurement methods; Nano-carbon assembly; Interfacial heat transport; Low-frequency phonons

Although the individual one- and two-dimensional (1D and 2D) carbon nanostructures possess extremely high thermal conductivity, their macroscopic assemblies do not efficiently utilize it due to the larger interfacial contact thermal resistance. To improve the overall performance, the key is the inte...