Dielectric heating in insulating materials subjected to voltage waveforms with high harmonic content
Dielectric heating is one potential aging mechanism active below partial discharge inception voltage in materials used as high voltage insulation. When exposed to voltage waveforms containing high amount of harmonics, the heat generation will be larger due to increased power losses as compared with...
Saved in:
Published in | IEEE transactions on dielectrics and electrical insulation Vol. 16; no. 4; pp. 926 - 933 |
---|---|
Main Authors | , , , |
Format | Journal Article |
Language | English |
Published |
New York
IEEE
01.08.2009
The Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Subjects | |
Online Access | Get full text |
Cover
Loading…
Abstract | Dielectric heating is one potential aging mechanism active below partial discharge inception voltage in materials used as high voltage insulation. When exposed to voltage waveforms containing high amount of harmonics, the heat generation will be larger due to increased power losses as compared with power frequency excitation. This may result in a decreased life or even failure of insulation due to the increased operating temperature or to thermal runaway. An analysis of the power developed due to dielectric heating in two different materials subjected to voltage waveforms with high harmonic content is presented in this paper. By expressing the non-sinusoidal loss as an enhancement factor to the sinusoidal one, a geometry-independent formalism is derived. From dielectric response measurements at low voltage and at several temperatures the dielectric power loss in the material can be calculated for different voltage levels and waveforms. Two important material parameters can be extracted from the calculated dielectric power loss: (i) non-sinusoidal loss compared with sinusoidal loss with the same fundamental frequency (p fact ) and (ii) change of loss with changing temperature (dp fact /dT). These two parameters could potentially be used to indicate the suitability of materials for use in applications where voltage waveforms contain high harmonic content. |
---|---|
AbstractList | Dielectric heating is one potential aging mechanism active below partial discharge inception voltage in materials used as high voltage insulation. When exposed to voltage waveforms containing high amount of harmonics, the heat generation will be larger due to increased power losses as compared with power frequency excitation. This may result in a decreased life or even failure of insulation due to the increased operating temperature or to thermal runaway. An analysis of the power developed due to dielectric heating in two different materials subjected to voltage waveforms with high harmonic content is presented in this paper. By expressing the non-sinusoidal loss as an enhancement factor to the sinusoidal one, a geometry-independent formalism is derived. From dielectric response measurements at low voltage and at several temperatures the dielectric power loss in the material can be calculated for different voltage levels and waveforms. Two important material parameters can be extracted from the calculated dielectric power loss: (i) non-sinusoidal loss compared with sinusoidal loss with the same fundamental frequency (p fact ) and (ii) change of loss with changing temperature (dp fact /dT). These two parameters could potentially be used to indicate the suitability of materials for use in applications where voltage waveforms contain high harmonic content. Dielectric heating is one potential aging mechanism active below partial discharge inception voltage in materials used as high voltage insulation. When exposed to voltage waveforms containing high amount of harmonics, the heat generation will be larger due to increased power losses as compared with power frequency excitation. This may result in a decreased life or even failure of insulation due to the increased operating temperature or to thermal runaway. An analysis of the power developed due to dielectric heating in two different materials subjected to voltage waveforms with high harmonic content is presented in this paper. By expressing the non-sinusoidal loss as an enhancement factor to the sinusoidal one, a geometry-independent formalism is derived. From dielectric response measurements at low voltage and at several temperatures the dielectric power loss in the material can be calculated for different voltage levels and waveforms. Two important material parameters can be extracted from the calculated dielectric power loss: (i) non-sinusoidal loss compared with sinusoidal loss with the same fundamental frequency (p sub(fact)) and (ii) change of loss with changing temperature (dp sub(fact)/dT). These two parameters could potentially be used to indicate the suitability of materials for use in applications where voltage waveforms contain high harmonic content. When exposed to voltage waveforms containing high amount of harmonics, the heat generation will be larger due to increased power losses as compared with power frequency excitation. |
Author | Blennow, J. Sonerud, B. Bengtsson, T. Gubanski, S.M. |
Author_xml | – sequence: 1 givenname: B. surname: Sonerud fullname: Sonerud, B. organization: Dept. of Mater. & Manuf. Technol., Chalmers Univ. of Technol., Goteborg, Sweden – sequence: 2 givenname: T. surname: Bengtsson fullname: Bengtsson, T. organization: Dept. of Mater. & Manuf. Technol., Chalmers Univ. of Technol., Goteborg, Sweden – sequence: 3 givenname: J. surname: Blennow fullname: Blennow, J. organization: Dept. of Mater. & Manuf. Technol., Chalmers Univ. of Technol., Goteborg, Sweden – sequence: 4 givenname: S.M. surname: Gubanski fullname: Gubanski, S.M. organization: Dept. of Mater. & Manuf. Technol., Chalmers Univ. of Technol., Goteborg, Sweden |
BackLink | https://research.chalmers.se/publication/95709$$DView record from Swedish Publication Index |
BookMark | eNp9kc1u1DAURiNUJNrCAyA2EQvEJoOvf2J7idoClSqxYPaW49zMeJTEg-10xNvjIaULFkiWfS2feyz7u6ou5jBjVb0FsgEg-tP29u5-QwnRG0EBFBMvqksQQjUcmLgoNZGk0UqqV9VVSgdCgAvaXlb9rccRXY7e1Xu02c-72s9lpGVcd5PNGL0dU52W7lBQ7Osc6scwZrvD-mQfcQhxSvXJ532997sy2TiFuRhdmDPO-XX1cigCfPO0XlfbL3fbm2_Nw_ev9zefHxrHGc3NAIpaZltgjnfAlWCArQDqGCgukamWt5L20kHfiaFFjjDIrue9E0r0hF1XP1ZtOuFx6cwx-snGXyZYbyImtNHtjdvbccKYTEIjJeECuDYDRWG4U8ooTsAgZdhqzTWxslg_rNZjDD8XTNlMPjkcRztjWJJhXEtK9fn6j_8FgTBgHAQXBX3_D3oIS5zL3xgNlClG_kCwQi6GlCIOzw8CYs6hm3Po5hy6eQq99LxbezwiPvN_T38DgAupYA |
CODEN | ITDIES |
CitedBy_id | crossref_primary_10_1016_j_engfailanal_2023_107222 crossref_primary_10_1109_TDEI_2023_3296711 crossref_primary_10_1049_iet_smt_2011_0187 crossref_primary_10_1109_TDEI_2019_007856 crossref_primary_10_1016_j_measurement_2022_111198 crossref_primary_10_1049_hve_2019_0178 crossref_primary_10_1088_1361_6463_acd85a crossref_primary_10_1088_1361_6463_acd55f crossref_primary_10_1109_TIE_2021_3108721 crossref_primary_10_3390_en13010013 crossref_primary_10_1109_TDEI_2022_3193652 crossref_primary_10_1109_TPWRD_2020_3016952 crossref_primary_10_3390_en15072650 crossref_primary_10_1049_hve_2018_5051 crossref_primary_10_1109_TDEI_2014_004448 crossref_primary_10_3390_en14030663 crossref_primary_10_1007_s00202_021_01480_6 crossref_primary_10_1109_JESTPE_2019_2914997 crossref_primary_10_1002_app_55104 crossref_primary_10_1109_TDEI_2019_007913 crossref_primary_10_1109_TDEI_2019_8726045 crossref_primary_10_1049_mnl_2018_5702 crossref_primary_10_1109_ACCESS_2021_3117907 crossref_primary_10_1080_15325008_2014_978050 crossref_primary_10_1109_TDEI_2017_006905 crossref_primary_10_1016_j_ijepes_2021_106861 crossref_primary_10_1109_TDEI_2010_5492240 crossref_primary_10_1109_ACCESS_2022_3163374 crossref_primary_10_1109_MEI_2009_5191414 crossref_primary_10_1109_TPWRD_2020_3033447 crossref_primary_10_1109_TDEI_2018_006898 crossref_primary_10_1109_OJIA_2020_2998000 crossref_primary_10_1109_TDEI_2013_6678848 crossref_primary_10_1049_iet_smt_2018_5079 crossref_primary_10_1109_TDEI_2010_5595539 crossref_primary_10_1109_TDEI_2012_6311495 crossref_primary_10_1002_tee_23291 crossref_primary_10_1016_j_tej_2016_11_006 crossref_primary_10_1109_TDEI_2014_6832234 crossref_primary_10_1109_JESTPE_2021_3064702 crossref_primary_10_1063_5_0108674 crossref_primary_10_1109_JESTPE_2018_2886140 crossref_primary_10_1049_gtd2_12117 crossref_primary_10_1016_j_cej_2023_145199 crossref_primary_10_1016_j_epsr_2021_107179 crossref_primary_10_1109_JESTPE_2022_3155751 crossref_primary_10_1016_j_epsr_2023_109973 |
Cites_doi | 10.1109/57.603555 10.1109/57.637150 10.1109/CITCON.2007.358997 10.1109/TDEI.2008.4591211 10.1109/60.182659 10.1109/MEI.2005.1412216 10.1109/ICSD.2007.4290739 10.1109/94.775617 10.1109/TPWRD.2003.817724 10.1109/ICSD.2001.955625 10.1109/2943.863631 |
ContentType | Journal Article |
Copyright | Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2009 |
Copyright_xml | – notice: Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2009 |
DBID | 97E RIA RIE AAYXX CITATION 7SP 8FD L7M F28 FR3 ADTPV AOWAS F1S |
DOI | 10.1109/TDEI.2009.5211835 |
DatabaseName | IEEE All-Society Periodicals Package (ASPP) 2005-present IEEE All-Society Periodicals Package (ASPP) 1998-Present IEEE Electronic Library (IEL) CrossRef Electronics & Communications Abstracts Technology Research Database Advanced Technologies Database with Aerospace ANTE: Abstracts in New Technology & Engineering Engineering Research Database SwePub SwePub Articles SWEPUB Chalmers tekniska högskola |
DatabaseTitle | CrossRef Technology Research Database Advanced Technologies Database with Aerospace Electronics & Communications Abstracts Engineering Research Database ANTE: Abstracts in New Technology & Engineering |
DatabaseTitleList | Engineering Research Database Technology Research Database Engineering Research Database |
Database_xml | – sequence: 1 dbid: RIE name: IEEE Electronic Library (IEL) url: https://proxy.k.utb.cz/login?url=https://ieeexplore.ieee.org/ sourceTypes: Publisher |
DeliveryMethod | fulltext_linktorsrc |
Discipline | Engineering Physics |
EISSN | 1558-4135 |
EndPage | 933 |
ExternalDocumentID | oai_research_chalmers_se_77045149_f2e5_4c88_8401_e23e699490a7 2545586371 10_1109_TDEI_2009_5211835 5211835 |
Genre | orig-research |
GroupedDBID | -~X 0R~ 29I 4.4 5GY 5VS 6IK 97E AAJGR AASAJ ABQJQ ABVLG ACGFO ACGFS ACIWK AENEX AETIX AI. AIBXA AKJIK ALLEH ALMA_UNASSIGNED_HOLDINGS ASUFR ATWAV BEFXN BFFAM BGNUA BKEBE BPEOZ CS3 DU5 EBS EJD F5P HZ~ H~9 ICLAB IFIPE IFJZH IPLJI JAVBF LAI M43 O9- OCL P2P RIA RIE RIG RNS RXW TAE TAF TN5 VH1 XFK AAYXX CITATION 7SP 8FD L7M F28 FR3 ADTPV AOWAS F1S |
ID | FETCH-LOGICAL-c432t-f182a3a613c4b148531e6512c31847e3864672d7c1db5f6e4e1f7bd4dc585d03 |
IEDL.DBID | RIE |
ISSN | 1070-9878 1558-4135 |
IngestDate | Sat Aug 24 00:50:30 EDT 2024 Fri Aug 16 22:13:11 EDT 2024 Sat Aug 17 03:43:28 EDT 2024 Thu Oct 10 19:20:00 EDT 2024 Fri Aug 23 01:06:13 EDT 2024 Wed Jun 26 19:28:49 EDT 2024 |
IsPeerReviewed | true |
IsScholarly | true |
Issue | 4 |
Language | English |
LinkModel | DirectLink |
MergedId | FETCHMERGED-LOGICAL-c432t-f182a3a613c4b148531e6512c31847e3864672d7c1db5f6e4e1f7bd4dc585d03 |
Notes | ObjectType-Article-2 SourceType-Scholarly Journals-1 ObjectType-Feature-1 content type line 23 |
PQID | 912383045 |
PQPubID | 23500 |
PageCount | 8 |
ParticipantIDs | proquest_journals_912383045 crossref_primary_10_1109_TDEI_2009_5211835 swepub_primary_oai_research_chalmers_se_77045149_f2e5_4c88_8401_e23e699490a7 proquest_miscellaneous_34972290 ieee_primary_5211835 proquest_miscellaneous_1031341545 |
PublicationCentury | 2000 |
PublicationDate | 2009-08-01 |
PublicationDateYYYYMMDD | 2009-08-01 |
PublicationDate_xml | – month: 08 year: 2009 text: 2009-08-01 day: 01 |
PublicationDecade | 2000 |
PublicationPlace | New York |
PublicationPlace_xml | – name: New York |
PublicationTitle | IEEE transactions on dielectrics and electrical insulation |
PublicationTitleAbbrev | T-DEI |
PublicationYear | 2009 |
Publisher | IEEE The Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Publisher_xml | – name: IEEE – name: The Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
References | ref13 ref12 ref10 ref2 ref1 wolter (ref11) 1987; ii ref8 ref7 ref9 ref4 ref3 ref5 chapman (ref6) 1954; 51 |
References_xml | – ident: ref8 doi: 10.1109/57.603555 – ident: ref1 doi: 10.1109/57.637150 – ident: ref9 doi: 10.1109/CITCON.2007.358997 – volume: 51 start-page: 136 year: 1954 ident: ref6 article-title: Dielectric strength of solid insulation publication-title: Electrical Manufacturing contributor: fullname: chapman – ident: ref13 doi: 10.1109/TDEI.2008.4591211 – ident: ref2 doi: 10.1109/60.182659 – ident: ref10 doi: 10.1109/MEI.2005.1412216 – ident: ref12 doi: 10.1109/ICSD.2007.4290739 – ident: ref7 doi: 10.1109/94.775617 – volume: ii start-page: 408 year: 1987 ident: ref11 article-title: Polymer Degradation and Its Measurement publication-title: Engineering Dielectrics contributor: fullname: wolter – ident: ref4 doi: 10.1109/TPWRD.2003.817724 – ident: ref5 doi: 10.1109/ICSD.2001.955625 – ident: ref3 doi: 10.1109/2943.863631 |
SSID | ssj0014526 |
Score | 2.2326035 |
Snippet | Dielectric heating is one potential aging mechanism active below partial discharge inception voltage in materials used as high voltage insulation. When exposed... When exposed to voltage waveforms containing high amount of harmonics, the heat generation will be larger due to increased power losses as compared with power... |
SourceID | swepub proquest crossref ieee |
SourceType | Open Access Repository Aggregation Database Publisher |
StartPage | 926 |
SubjectTerms | Aging Dielectric heating Dielectric loss measurement Dielectric losses Dielectric materials dielectric response Dielectrics Dielectrics and electrical insulation Electric potential electrothermal effects Frequency Harmonics Heating Insulation Power loss Power system harmonics pulse width modulation Studies Temperature Voltage Waveforms |
Title | Dielectric heating in insulating materials subjected to voltage waveforms with high harmonic content |
URI | https://ieeexplore.ieee.org/document/5211835 https://www.proquest.com/docview/912383045 https://search.proquest.com/docview/1031341545 https://search.proquest.com/docview/34972290 https://research.chalmers.se/publication/95709 |
Volume | 16 |
hasFullText | 1 |
inHoldings | 1 |
isFullTextHit | |
isPrint | |
link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwjV1ba9VAEB7agqAPXlrFY72s4JOY002yueyj2JYq1qcj9G3Zy4QeCjlikhb89c5kc0IrCr4l2U2yl9m57Mx-A_CuVNo5iU3SSC8ThcElzlpMSDj42lZN7T0biuffyrPv6stFcbEDH-azMIg4Bp_hki9HX37Y-IG3yo5I1BAFFruwW8ssntWaPQacKjvGF8qE7Oh68mCmUh-tjk8-R2TK6QN3ZNCYVOWufnkbM3SUM6eP4HzbwhhecrUcerf0v_4Ab_zfLjyGh5PCKT5GCnkCO9juw4NbMIT7cG8MA_XdAYTjdcyLs_aCuTQVi3UrxoD1eEcKbqRZ0Q2O93AwiH4jiMn1xJnEjb1GVoM7wRu8gsGQBYNjMwCv4LB4at1TWJ2erD6dJVMehsSrPOuThmwQm1sS_F45Mp9o2WJJioInfqAqzOuSuG0WKp8GVzQlKkybygUVPNkiQebPYK_dtPgchC5UioHe5uA4hY1zhbUpaUQhNNK5dAHvtxNjfkS0DTNaKVIbnkVOmqnNNIYLOODxnSvOjw-3U2mm9dgZTQK6ZqfwAt7OpbSQ2DtiW9wMneF8FyTSC67z5h91cqUrBshfwNdII_PPGaV7gme6NP5yzH3TmQ5NVTGCj9KmybAwyte1IZs6NZjlWGqttLTVi7_35BDuR98Vhxu-hL3-54CvSAXq3euR9n8DOXAEtw |
link.rule.ids | 230,315,786,790,802,891,27955,27956,55107 |
linkProvider | IEEE |
linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwjV1Lb9QwEB6VIkQ58OhDLAVqJE6IbJ2N8_AR0VZb2O1pkXqzYnuirpCyiCQg8euZibNRi0DilsRO4sd4Hp7xNwBvM6WtlVhFlXQyUuhtZMsSIxIOrijzqnCODcXlVTb_oj5dp9c78H48C4OIffAZTvmy9-X7jet4q-yURA1RYHoP7pOcl3k4rTX6DDhZdogwlBFZ0sXgw4ylPl2dnV8GbMrhE3ekUJ9W5a6GeRs1tJc0F09guW1jCDD5Ou1aO3W__oBv_N9OPIXHg8opPgQaeQY7WO_Do1tAhPvwoA8Edc0B-LN1yIyzdoL5NBWLdS36kPVwRypuoFrRdJZ3cdCLdiOIzbXEm8TP8geyItwI3uIVDIcsGB6bIXgFB8ZT6w5hdXG--jiPhkwMkVPJrI0qskLKpCTR75QlA4oWLmakKjjiCCrHpMiI38587mJv0ypDhXGVW6-8I2vEy-QIdutNjc9B6FTF6OltDo9TWFmblmVMOpH3lbQ2nsC77cSYbwFvw_R2itSGZ5HTZmozjOEEDnh8x4rj4-PtVJphRTZGk4gu2C08gTdjKS0l9o-UNW66xnDGCxLqKdc5-UedROmcIfInsAg0Mv6ccboHgKYb42767DeNadDkOWP4KG2qGaZGuaIwZFXHBmcJZlorLcv8xd97cgIP56vlwiwurz4fw17wZHHw4UvYbb93-IoUota-7tfBbxJ3CAs |
openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Ajournal&rft.genre=article&rft.atitle=Dielectric+Heating+in+Insulating+Materials+Subjected+to+Voltage+Waveforms+with+High+Harmonic+Content&rft.jtitle=IEEE+transactions+on+dielectrics+and+electrical+insulation&rft.au=Sonerud%2C+Bj%C3%B6rn&rft.au=Bengtsson%2C+Tord&rft.au=Blennow%2C+J%C3%B6rgen&rft.au=Gubanski%2C+Stanislaw&rft.date=2009-08-01&rft.issn=1558-4135&rft.volume=16&rft.issue=4&rft.spage=926&rft_id=info:doi/10.1109%2FTDEI.2009.5211835&rft.externalDocID=oai_research_chalmers_se_77045149_f2e5_4c88_8401_e23e699490a7 |
thumbnail_l | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/lc.gif&issn=1070-9878&client=summon |
thumbnail_m | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/mc.gif&issn=1070-9878&client=summon |
thumbnail_s | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/sc.gif&issn=1070-9878&client=summon |