Dielectric heating in insulating materials subjected to voltage waveforms with high harmonic content

Dielectric heating is one potential aging mechanism active below partial discharge inception voltage in materials used as high voltage insulation. When exposed to voltage waveforms containing high amount of harmonics, the heat generation will be larger due to increased power losses as compared with...

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Published inIEEE transactions on dielectrics and electrical insulation Vol. 16; no. 4; pp. 926 - 933
Main Authors Sonerud, B., Bengtsson, T., Blennow, J., Gubanski, S.M.
Format Journal Article
LanguageEnglish
Published New York IEEE 01.08.2009
The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
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Abstract Dielectric heating is one potential aging mechanism active below partial discharge inception voltage in materials used as high voltage insulation. When exposed to voltage waveforms containing high amount of harmonics, the heat generation will be larger due to increased power losses as compared with power frequency excitation. This may result in a decreased life or even failure of insulation due to the increased operating temperature or to thermal runaway. An analysis of the power developed due to dielectric heating in two different materials subjected to voltage waveforms with high harmonic content is presented in this paper. By expressing the non-sinusoidal loss as an enhancement factor to the sinusoidal one, a geometry-independent formalism is derived. From dielectric response measurements at low voltage and at several temperatures the dielectric power loss in the material can be calculated for different voltage levels and waveforms. Two important material parameters can be extracted from the calculated dielectric power loss: (i) non-sinusoidal loss compared with sinusoidal loss with the same fundamental frequency (p fact ) and (ii) change of loss with changing temperature (dp fact /dT). These two parameters could potentially be used to indicate the suitability of materials for use in applications where voltage waveforms contain high harmonic content.
AbstractList Dielectric heating is one potential aging mechanism active below partial discharge inception voltage in materials used as high voltage insulation. When exposed to voltage waveforms containing high amount of harmonics, the heat generation will be larger due to increased power losses as compared with power frequency excitation. This may result in a decreased life or even failure of insulation due to the increased operating temperature or to thermal runaway. An analysis of the power developed due to dielectric heating in two different materials subjected to voltage waveforms with high harmonic content is presented in this paper. By expressing the non-sinusoidal loss as an enhancement factor to the sinusoidal one, a geometry-independent formalism is derived. From dielectric response measurements at low voltage and at several temperatures the dielectric power loss in the material can be calculated for different voltage levels and waveforms. Two important material parameters can be extracted from the calculated dielectric power loss: (i) non-sinusoidal loss compared with sinusoidal loss with the same fundamental frequency (p fact ) and (ii) change of loss with changing temperature (dp fact /dT). These two parameters could potentially be used to indicate the suitability of materials for use in applications where voltage waveforms contain high harmonic content.
Dielectric heating is one potential aging mechanism active below partial discharge inception voltage in materials used as high voltage insulation. When exposed to voltage waveforms containing high amount of harmonics, the heat generation will be larger due to increased power losses as compared with power frequency excitation. This may result in a decreased life or even failure of insulation due to the increased operating temperature or to thermal runaway. An analysis of the power developed due to dielectric heating in two different materials subjected to voltage waveforms with high harmonic content is presented in this paper. By expressing the non-sinusoidal loss as an enhancement factor to the sinusoidal one, a geometry-independent formalism is derived. From dielectric response measurements at low voltage and at several temperatures the dielectric power loss in the material can be calculated for different voltage levels and waveforms. Two important material parameters can be extracted from the calculated dielectric power loss: (i) non-sinusoidal loss compared with sinusoidal loss with the same fundamental frequency (p sub(fact)) and (ii) change of loss with changing temperature (dp sub(fact)/dT). These two parameters could potentially be used to indicate the suitability of materials for use in applications where voltage waveforms contain high harmonic content.
When exposed to voltage waveforms containing high amount of harmonics, the heat generation will be larger due to increased power losses as compared with power frequency excitation.
Author Blennow, J.
Sonerud, B.
Bengtsson, T.
Gubanski, S.M.
Author_xml – sequence: 1
  givenname: B.
  surname: Sonerud
  fullname: Sonerud, B.
  organization: Dept. of Mater. & Manuf. Technol., Chalmers Univ. of Technol., Goteborg, Sweden
– sequence: 2
  givenname: T.
  surname: Bengtsson
  fullname: Bengtsson, T.
  organization: Dept. of Mater. & Manuf. Technol., Chalmers Univ. of Technol., Goteborg, Sweden
– sequence: 3
  givenname: J.
  surname: Blennow
  fullname: Blennow, J.
  organization: Dept. of Mater. & Manuf. Technol., Chalmers Univ. of Technol., Goteborg, Sweden
– sequence: 4
  givenname: S.M.
  surname: Gubanski
  fullname: Gubanski, S.M.
  organization: Dept. of Mater. & Manuf. Technol., Chalmers Univ. of Technol., Goteborg, Sweden
BackLink https://research.chalmers.se/publication/95709$$DView record from Swedish Publication Index
BookMark eNp9kc1u1DAURiNUJNrCAyA2EQvEJoOvf2J7idoClSqxYPaW49zMeJTEg-10xNvjIaULFkiWfS2feyz7u6ou5jBjVb0FsgEg-tP29u5-QwnRG0EBFBMvqksQQjUcmLgoNZGk0UqqV9VVSgdCgAvaXlb9rccRXY7e1Xu02c-72s9lpGVcd5PNGL0dU52W7lBQ7Osc6scwZrvD-mQfcQhxSvXJ532997sy2TiFuRhdmDPO-XX1cigCfPO0XlfbL3fbm2_Nw_ev9zefHxrHGc3NAIpaZltgjnfAlWCArQDqGCgukamWt5L20kHfiaFFjjDIrue9E0r0hF1XP1ZtOuFx6cwx-snGXyZYbyImtNHtjdvbccKYTEIjJeECuDYDRWG4U8ooTsAgZdhqzTWxslg_rNZjDD8XTNlMPjkcRztjWJJhXEtK9fn6j_8FgTBgHAQXBX3_D3oIS5zL3xgNlClG_kCwQi6GlCIOzw8CYs6hm3Po5hy6eQq99LxbezwiPvN_T38DgAupYA
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ContentType Journal Article
Copyright Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2009
Copyright_xml – notice: Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2009
DBID 97E
RIA
RIE
AAYXX
CITATION
7SP
8FD
L7M
F28
FR3
ADTPV
AOWAS
F1S
DOI 10.1109/TDEI.2009.5211835
DatabaseName IEEE All-Society Periodicals Package (ASPP) 2005-present
IEEE All-Society Periodicals Package (ASPP) 1998-Present
IEEE Electronic Library (IEL)
CrossRef
Electronics & Communications Abstracts
Technology Research Database
Advanced Technologies Database with Aerospace
ANTE: Abstracts in New Technology & Engineering
Engineering Research Database
SwePub
SwePub Articles
SWEPUB Chalmers tekniska högskola
DatabaseTitle CrossRef
Technology Research Database
Advanced Technologies Database with Aerospace
Electronics & Communications Abstracts
Engineering Research Database
ANTE: Abstracts in New Technology & Engineering
DatabaseTitleList
Engineering Research Database
Technology Research Database
Engineering Research Database
Database_xml – sequence: 1
  dbid: RIE
  name: IEEE Electronic Library (IEL)
  url: https://proxy.k.utb.cz/login?url=https://ieeexplore.ieee.org/
  sourceTypes: Publisher
DeliveryMethod fulltext_linktorsrc
Discipline Engineering
Physics
EISSN 1558-4135
EndPage 933
ExternalDocumentID oai_research_chalmers_se_77045149_f2e5_4c88_8401_e23e699490a7
2545586371
10_1109_TDEI_2009_5211835
5211835
Genre orig-research
GroupedDBID -~X
0R~
29I
4.4
5GY
5VS
6IK
97E
AAJGR
AASAJ
ABQJQ
ABVLG
ACGFO
ACGFS
ACIWK
AENEX
AETIX
AI.
AIBXA
AKJIK
ALLEH
ALMA_UNASSIGNED_HOLDINGS
ASUFR
ATWAV
BEFXN
BFFAM
BGNUA
BKEBE
BPEOZ
CS3
DU5
EBS
EJD
F5P
HZ~
H~9
ICLAB
IFIPE
IFJZH
IPLJI
JAVBF
LAI
M43
O9-
OCL
P2P
RIA
RIE
RIG
RNS
RXW
TAE
TAF
TN5
VH1
XFK
AAYXX
CITATION
7SP
8FD
L7M
F28
FR3
ADTPV
AOWAS
F1S
ID FETCH-LOGICAL-c432t-f182a3a613c4b148531e6512c31847e3864672d7c1db5f6e4e1f7bd4dc585d03
IEDL.DBID RIE
ISSN 1070-9878
1558-4135
IngestDate Sat Aug 24 00:50:30 EDT 2024
Fri Aug 16 22:13:11 EDT 2024
Sat Aug 17 03:43:28 EDT 2024
Thu Oct 10 19:20:00 EDT 2024
Fri Aug 23 01:06:13 EDT 2024
Wed Jun 26 19:28:49 EDT 2024
IsPeerReviewed true
IsScholarly true
Issue 4
Language English
LinkModel DirectLink
MergedId FETCHMERGED-LOGICAL-c432t-f182a3a613c4b148531e6512c31847e3864672d7c1db5f6e4e1f7bd4dc585d03
Notes ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Feature-1
content type line 23
PQID 912383045
PQPubID 23500
PageCount 8
ParticipantIDs proquest_journals_912383045
crossref_primary_10_1109_TDEI_2009_5211835
swepub_primary_oai_research_chalmers_se_77045149_f2e5_4c88_8401_e23e699490a7
proquest_miscellaneous_34972290
ieee_primary_5211835
proquest_miscellaneous_1031341545
PublicationCentury 2000
PublicationDate 2009-08-01
PublicationDateYYYYMMDD 2009-08-01
PublicationDate_xml – month: 08
  year: 2009
  text: 2009-08-01
  day: 01
PublicationDecade 2000
PublicationPlace New York
PublicationPlace_xml – name: New York
PublicationTitle IEEE transactions on dielectrics and electrical insulation
PublicationTitleAbbrev T-DEI
PublicationYear 2009
Publisher IEEE
The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher_xml – name: IEEE
– name: The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
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– ident: ref1
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– ident: ref2
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– ident: ref10
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SSID ssj0014526
Score 2.2326035
Snippet Dielectric heating is one potential aging mechanism active below partial discharge inception voltage in materials used as high voltage insulation. When exposed...
When exposed to voltage waveforms containing high amount of harmonics, the heat generation will be larger due to increased power losses as compared with power...
SourceID swepub
proquest
crossref
ieee
SourceType Open Access Repository
Aggregation Database
Publisher
StartPage 926
SubjectTerms Aging
Dielectric heating
Dielectric loss measurement
Dielectric losses
Dielectric materials
dielectric response
Dielectrics
Dielectrics and electrical insulation
Electric potential
electrothermal effects
Frequency
Harmonics
Heating
Insulation
Power loss
Power system harmonics
pulse width modulation
Studies
Temperature
Voltage
Waveforms
Title Dielectric heating in insulating materials subjected to voltage waveforms with high harmonic content
URI https://ieeexplore.ieee.org/document/5211835
https://www.proquest.com/docview/912383045
https://search.proquest.com/docview/1031341545
https://search.proquest.com/docview/34972290
https://research.chalmers.se/publication/95709
Volume 16
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
link http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwjV1ba9VAEB7agqAPXlrFY72s4JOY002yueyj2JYq1qcj9G3Zy4QeCjlikhb89c5kc0IrCr4l2U2yl9m57Mx-A_CuVNo5iU3SSC8ThcElzlpMSDj42lZN7T0biuffyrPv6stFcbEDH-azMIg4Bp_hki9HX37Y-IG3yo5I1BAFFruwW8ssntWaPQacKjvGF8qE7Oh68mCmUh-tjk8-R2TK6QN3ZNCYVOWufnkbM3SUM6eP4HzbwhhecrUcerf0v_4Ab_zfLjyGh5PCKT5GCnkCO9juw4NbMIT7cG8MA_XdAYTjdcyLs_aCuTQVi3UrxoD1eEcKbqRZ0Q2O93AwiH4jiMn1xJnEjb1GVoM7wRu8gsGQBYNjMwCv4LB4at1TWJ2erD6dJVMehsSrPOuThmwQm1sS_F45Mp9o2WJJioInfqAqzOuSuG0WKp8GVzQlKkybygUVPNkiQebPYK_dtPgchC5UioHe5uA4hY1zhbUpaUQhNNK5dAHvtxNjfkS0DTNaKVIbnkVOmqnNNIYLOODxnSvOjw-3U2mm9dgZTQK6ZqfwAt7OpbSQ2DtiW9wMneF8FyTSC67z5h91cqUrBshfwNdII_PPGaV7gme6NP5yzH3TmQ5NVTGCj9KmybAwyte1IZs6NZjlWGqttLTVi7_35BDuR98Vhxu-hL3-54CvSAXq3euR9n8DOXAEtw
link.rule.ids 230,315,786,790,802,891,27955,27956,55107
linkProvider IEEE
linkToHtml http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwjV1Lb9QwEB6VIkQ58OhDLAVqJE6IbJ2N8_AR0VZb2O1pkXqzYnuirpCyiCQg8euZibNRi0DilsRO4sd4Hp7xNwBvM6WtlVhFlXQyUuhtZMsSIxIOrijzqnCODcXlVTb_oj5dp9c78H48C4OIffAZTvmy9-X7jet4q-yURA1RYHoP7pOcl3k4rTX6DDhZdogwlBFZ0sXgw4ylPl2dnV8GbMrhE3ekUJ9W5a6GeRs1tJc0F09guW1jCDD5Ou1aO3W__oBv_N9OPIXHg8opPgQaeQY7WO_Do1tAhPvwoA8Edc0B-LN1yIyzdoL5NBWLdS36kPVwRypuoFrRdJZ3cdCLdiOIzbXEm8TP8geyItwI3uIVDIcsGB6bIXgFB8ZT6w5hdXG--jiPhkwMkVPJrI0qskLKpCTR75QlA4oWLmakKjjiCCrHpMiI38587mJv0ypDhXGVW6-8I2vEy-QIdutNjc9B6FTF6OltDo9TWFmblmVMOpH3lbQ2nsC77cSYbwFvw_R2itSGZ5HTZmozjOEEDnh8x4rj4-PtVJphRTZGk4gu2C08gTdjKS0l9o-UNW66xnDGCxLqKdc5-UedROmcIfInsAg0Mv6ccboHgKYb42767DeNadDkOWP4KG2qGaZGuaIwZFXHBmcJZlorLcv8xd97cgIP56vlwiwurz4fw17wZHHw4UvYbb93-IoUota-7tfBbxJ3CAs
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Ajournal&rft.genre=article&rft.atitle=Dielectric+Heating+in+Insulating+Materials+Subjected+to+Voltage+Waveforms+with+High+Harmonic+Content&rft.jtitle=IEEE+transactions+on+dielectrics+and+electrical+insulation&rft.au=Sonerud%2C+Bj%C3%B6rn&rft.au=Bengtsson%2C+Tord&rft.au=Blennow%2C+J%C3%B6rgen&rft.au=Gubanski%2C+Stanislaw&rft.date=2009-08-01&rft.issn=1558-4135&rft.volume=16&rft.issue=4&rft.spage=926&rft_id=info:doi/10.1109%2FTDEI.2009.5211835&rft.externalDocID=oai_research_chalmers_se_77045149_f2e5_4c88_8401_e23e699490a7
thumbnail_l http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/lc.gif&issn=1070-9878&client=summon
thumbnail_m http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/mc.gif&issn=1070-9878&client=summon
thumbnail_s http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/sc.gif&issn=1070-9878&client=summon