Influence of Zn addition on the microstructure, melt properties and creep behavior of low Ag-content Sn–Ag–Cu lead-free solders
The effects of Zn addition on the microstructure, thermal behavior and tensile creep properties of Sn–1.0Ag–0.3Cu (SAC103) alloy were systematically investigated. Differential scanning calorimetry (DSC) reveals that the reductions of undercooling and pasty range are more significant for Zn-containin...
Saved in:
Published in | Materials science & engineering. A, Structural materials : properties, microstructure and processing Vol. 608; pp. 130 - 138 |
---|---|
Main Authors | , , , |
Format | Journal Article |
Language | English |
Published |
Kidlington
Elsevier B.V
01.07.2014
Elsevier |
Subjects | |
Online Access | Get full text |
Cover
Loading…
Be the first to leave a comment!