Influence of Zn addition on the microstructure, melt properties and creep behavior of low Ag-content Sn–Ag–Cu lead-free solders

• Published in: Materials science & engineering. A, Structural materials : properties, microstructure and processing Vol. 608; pp. 130 - 138
• Main Authors: El-Daly, A.A., Hammad, A.E., Al-Ganainy, G.S., Ragab, M.
• Format: Journal Article
• Language: English
• Published: Kidlington Elsevier B.V 01.07.2014; Elsevier
• Subjects: Alloying additive; Applied sciences; Brazing. Soldering; Creep; Creep (materials); Creep properties; Creep strength; Cross-disciplinary physics: materials science; rheology; Deformation, plasticity, and creep; Differential scanning calorimetry; Elasticity. Plasticity; Exact sciences and technology; Joining, thermal cutting: metallurgical aspects; Lead-free solder; Materials science; Mathematical models; Mechanical properties and methods of testing. Rheology. Fracture mechanics. Tribology; Metals. Metallurgy; Microstructure; Physics; Solders; Thermal properties; Treatment of materials and its effects on microstructure and properties; Zinc; Thermal properties; Creep properties; Lead-free solder; Microstructure; Differential scanning calorimetry; Temperature dependence; Molten state; Creep; Intermetallic compound; Fiber; Tensile property; Creep strength; Precipitate; Steady state; Tension test; Structure composition relationship; Zinc addition; Lifetime; Soldered joint; Lead free solder; Stress effects; Supercooling; Dislocation pile up

The effects of Zn addition on the microstructure, thermal behavior and tensile creep properties of Sn–1.0Ag–0.3Cu (SAC103) alloy were systematically investigated. Differential scanning calorimetry (DSC) reveals that the reductions of undercooling and pasty range are more significant for Zn-containin...