Atomic insights of Cu nanoparticles melting and sintering behavior in Cu Cu direct bonding

• Published in: Materials & design Vol. 197; p. 109240
• Main Authors: Wu, Rui, Zhao, Xiuchen, Liu, Yingxia
• Format: Journal Article
• Language: English
• Published: Elsevier 01.01.2021
• Subjects: Cu nanoparticles; Cucu direct bonding; Molecular dynamics; Phase transformation

With a layer of Cu nanoparticle slurry, it's promising to achieve fast CuCu direct bonding at low temperature. To have a deeper insight and better control of the process, we apply molecular dynamics method to simulate the melting and sintering behavior of Cu nanoparticles during the direct bon...