Fabrication of multi-material electronic components applying non-contact printing technologies: A review
Recent scientific achievements in the area of printed electronics allow the production of electronic devices with enhanced performances and versatility at a relatively low cost. The transfer from a single to multi-material applications, advances in the sequential deposition of insulators, conductors...
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| Published in | Results in engineering Vol. 15; p. 100578 |
|---|---|
| Main Authors | , , |
| Format | Journal Article |
| Language | English |
| Published |
Elsevier B.V
01.09.2022
Elsevier |
| Online Access | Get full text |
| ISSN | 2590-1230 2590-1230 |
| DOI | 10.1016/j.rineng.2022.100578 |
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| Abstract | Recent scientific achievements in the area of printed electronics allow the production of electronic devices with enhanced performances and versatility at a relatively low cost. The transfer from a single to multi-material applications, advances in the sequential deposition of insulators, conductors or semiconductors enable the progress from uncomplicated antennas and conductive interconnects towards fully printed complex, flexible electronic components, integrated within objects and smart devices at the same time offering greater precision and less complex manufacturing in comparison to traditional fabrication methods. In contrast to conventional fabrication techniques, additive approaches allow for avoiding expensive and tedious mask fabrication and the objects here can be quickly manufactured according to a customised design, thus making the processes feasible when rapid prototyping or fabrication of customised components are necessary. These advantages are good indicators that multi-material printed electronics will gradually replace traditional subtractive fabrication methods, thus there is keen interest to pursue research activities on this subject. Prior to continuing the research, it is of great significance to understand the recent achievements and trends in materials, processes and applications, as well as to identify potential challenges in the field of multi-material printed electronics. The purpose of this review paper is to introduce the reader to the state of art printed electronics applications, present materials, methods of fabrication as well as highlight the challenges.
•The recent advances in multi-material printed electronics are presented.•The challenges in printed electronics fabrication are discussed.•Up to date trends for printed electronics applications are overviewed. |
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| AbstractList | Recent scientific achievements in the area of printed electronics allow the production of electronic devices with enhanced performances and versatility at a relatively low cost. The transfer from a single to multi-material applications, advances in the sequential deposition of insulators, conductors or semiconductors enable the progress from uncomplicated antennas and conductive interconnects towards fully printed complex, flexible electronic components, integrated within objects and smart devices at the same time offering greater precision and less complex manufacturing in comparison to traditional fabrication methods. In contrast to conventional fabrication techniques, additive approaches allow for avoiding expensive and tedious mask fabrication and the objects here can be quickly manufactured according to a customised design, thus making the processes feasible when rapid prototyping or fabrication of customised components are necessary. These advantages are good indicators that multi-material printed electronics will gradually replace traditional subtractive fabrication methods, thus there is keen interest to pursue research activities on this subject. Prior to continuing the research, it is of great significance to understand the recent achievements and trends in materials, processes and applications, as well as to identify potential challenges in the field of multi-material printed electronics. The purpose of this review paper is to introduce the reader to the state of art printed electronics applications, present materials, methods of fabrication as well as highlight the challenges. Recent scientific achievements in the area of printed electronics allow the production of electronic devices with enhanced performances and versatility at a relatively low cost. The transfer from a single to multi-material applications, advances in the sequential deposition of insulators, conductors or semiconductors enable the progress from uncomplicated antennas and conductive interconnects towards fully printed complex, flexible electronic components, integrated within objects and smart devices at the same time offering greater precision and less complex manufacturing in comparison to traditional fabrication methods. In contrast to conventional fabrication techniques, additive approaches allow for avoiding expensive and tedious mask fabrication and the objects here can be quickly manufactured according to a customised design, thus making the processes feasible when rapid prototyping or fabrication of customised components are necessary. These advantages are good indicators that multi-material printed electronics will gradually replace traditional subtractive fabrication methods, thus there is keen interest to pursue research activities on this subject. Prior to continuing the research, it is of great significance to understand the recent achievements and trends in materials, processes and applications, as well as to identify potential challenges in the field of multi-material printed electronics. The purpose of this review paper is to introduce the reader to the state of art printed electronics applications, present materials, methods of fabrication as well as highlight the challenges. •The recent advances in multi-material printed electronics are presented.•The challenges in printed electronics fabrication are discussed.•Up to date trends for printed electronics applications are overviewed. |
| ArticleNumber | 100578 |
| Author | Mohammadlou, Bita Soltan Raghavendra, Ramesh Šakalys, Rokas |
| Author_xml | – sequence: 1 givenname: Rokas surname: Šakalys fullname: Šakalys, Rokas organization: SEAM Research Centre, South East Technological University, Waterford, X91TX03, Ireland – sequence: 2 givenname: Bita Soltan surname: Mohammadlou fullname: Mohammadlou, Bita Soltan organization: SEAM Research Centre, South East Technological University, Waterford, X91TX03, Ireland – sequence: 3 givenname: Ramesh surname: Raghavendra fullname: Raghavendra, Ramesh email: ramesh.raghavendra@i-form.ie organization: SEAM Research Centre, South East Technological University, Waterford, X91TX03, Ireland |
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| CitedBy_id | crossref_primary_10_1063_5_0251824 crossref_primary_10_1016_j_rineng_2023_101122 crossref_primary_10_1016_j_rineng_2023_101177 crossref_primary_10_1016_j_rineng_2024_103204 crossref_primary_10_20517_ss_2023_21 crossref_primary_10_1002_smll_202402638 crossref_primary_10_1007_s40684_023_00533_4 crossref_primary_10_1016_j_rineng_2024_102507 crossref_primary_10_1016_j_rineng_2024_103747 crossref_primary_10_1063_5_0235864 crossref_primary_10_1021_acsanm_3c01814 crossref_primary_10_1002_adma_202307686 crossref_primary_10_1016_j_rineng_2023_101172 |
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