Improvement in thermal conductivity of through-plane aligned boron nitride/silicone rubber composites

• Published in: Materials & design Vol. 165; p. 107580
• Main Authors: Xue, Yang, Li, Xiaofei, Wang, Haosheng, Zhao, Feng, Zhang, Donghai, Chen, Yunfa
• Format: Journal Article
• Language: English
• Published: Elsevier Ltd 05.03.2019; Elsevier
• Subjects: Interface thermal resistance; Mechanical orientation; SR composites; Through-plane thermal conductivity; Vertically aligned-BN; SR composites; Mechanical orientation; Interface thermal resistance; Vertically aligned-BN; Through-plane thermal conductivity

Effective heat dissipation has become a critical issue for electronic devices. In this study, the silicone rubber (SR)/vertically aligned boron nitride (BN) composites were prepared and the thermal conductivity of the composites was systematically investigated. The vertically aligned BNs constructed...