Shear deformation behavior and failure mechanisms of graphene reinforced Sn-based solder joints bonded by transient current

• Published in: Materials & design Vol. 224; p. 111369
• Main Authors: Li, Yuan, Xu, Lianyong, Zhao, Lei, Hao, Kangda, Han, Yongdian
• Format: Journal Article
• Language: English
• Published: Elsevier Ltd 01.12.2022; Elsevier
• Subjects: Failure mechanisms; Graphene reinforced Sn-Ag-Cu alloy; Orientation spread; Slip system; Strengthening mechanisms; Orientation spread; Graphene reinforced Sn-Ag-Cu alloy; Slip system; Strengthening mechanisms; Failure mechanisms

[Display omitted] •Crystal orientation spread and the cracks propagation during shear were observed in situ.•The roles of grain boundary types on the deformation of solder joints were confirmed based on molecular dynamics.•The strengthening mechanisms of graphene on composite solder was firstly quan...