3D printing high interfacial bonding polyether ether ketone components via pyrolysis reactions
Recently, 3D-printed polyether-ether-ketone (PEEK) components have been shown to offer many applications in state-of-the-art electronics, 5G wireless communications, medical implantations, and aerospace components. Nevertheless, a critical barrier that limits the application of 3D printed PEEK compo...
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| Published in | Materials & design Vol. 198; p. 109333 |
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| Main Authors | , , , , , , , , , |
| Format | Journal Article |
| Language | English |
| Published |
Elsevier Ltd
15.01.2021
Elsevier |
| Subjects | |
| Online Access | Get full text |
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| Abstract | Recently, 3D-printed polyether-ether-ketone (PEEK) components have been shown to offer many applications in state-of-the-art electronics, 5G wireless communications, medical implantations, and aerospace components. Nevertheless, a critical barrier that limits the application of 3D printed PEEK components is their weak interfacial bonding strength. Herein, we propose a novel method to improve this unsatisfied situation via the interface plasticizing effect of benzene derivatives obtained from the thermal pyrolysis of trisilanolphenyl polyhedral oligomeric silsequioxane (POSS). Based on this method, the bonding strength of the filaments and interlayers of 3D-printed POSS/PEEK components can reach 82.9MPa and 59.8MPa, respectively. Moreover, the enhancing mechanism of the pyrolysis products derived from the POSS is characterized using pyrolysis-gas chromatography/mass spectrometry (Py-GC/MS), Fourier transform infrared spectroscopy (FTIR), and X-ray computed tomography (X-CT). Our proposed strategy broadens the novel design space for developing additional 3D-printed materials with satisfactory interfacial bonding strength.
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•A novel strategy to improve the interfacial bonding strength of 3D-printed polyether-ether-ketone components via pyrolysis reaction was developed.•Almost isotropy mechanical properties in X-Y plane and 59.8 MPa Z-direction bonding strength were reported.•Higher top layer’s temperatures showed a positive influence on interlayer bonding strength.•The enhancing mechanism of polyhedral-oligomeric-silsequioxane was analyzed from microstructure and pyrolysis analyses. |
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| AbstractList | Recently, 3D-printed polyether-ether-ketone (PEEK) components have been shown to offer many applications in state-of-the-art electronics, 5G wireless communications, medical implantations, and aerospace components. Nevertheless, a critical barrier that limits the application of 3D printed PEEK components is their weak interfacial bonding strength. Herein, we propose a novel method to improve this unsatisfied situation via the interface plasticizing effect of benzene derivatives obtained from the thermal pyrolysis of trisilanolphenyl polyhedral oligomeric silsequioxane (POSS). Based on this method, the bonding strength of the filaments and interlayers of 3D-printed POSS/PEEK components can reach 82.9 MPa and 59.8 MPa, respectively. Moreover, the enhancing mechanism of the pyrolysis products derived from the POSS is characterized using pyrolysis-gas chromatography/mass spectrometry (Py-GC/MS), Fourier transform infrared spectroscopy (FTIR), and X-ray computed tomography (X-CT). Our proposed strategy broadens the novel design space for developing additional 3D-printed materials with satisfactory interfacial bonding strength. Recently, 3D-printed polyether-ether-ketone (PEEK) components have been shown to offer many applications in state-of-the-art electronics, 5G wireless communications, medical implantations, and aerospace components. Nevertheless, a critical barrier that limits the application of 3D printed PEEK components is their weak interfacial bonding strength. Herein, we propose a novel method to improve this unsatisfied situation via the interface plasticizing effect of benzene derivatives obtained from the thermal pyrolysis of trisilanolphenyl polyhedral oligomeric silsequioxane (POSS). Based on this method, the bonding strength of the filaments and interlayers of 3D-printed POSS/PEEK components can reach 82.9MPa and 59.8MPa, respectively. Moreover, the enhancing mechanism of the pyrolysis products derived from the POSS is characterized using pyrolysis-gas chromatography/mass spectrometry (Py-GC/MS), Fourier transform infrared spectroscopy (FTIR), and X-ray computed tomography (X-CT). Our proposed strategy broadens the novel design space for developing additional 3D-printed materials with satisfactory interfacial bonding strength. [Display omitted] •A novel strategy to improve the interfacial bonding strength of 3D-printed polyether-ether-ketone components via pyrolysis reaction was developed.•Almost isotropy mechanical properties in X-Y plane and 59.8 MPa Z-direction bonding strength were reported.•Higher top layer’s temperatures showed a positive influence on interlayer bonding strength.•The enhancing mechanism of polyhedral-oligomeric-silsequioxane was analyzed from microstructure and pyrolysis analyses. |
| ArticleNumber | 109333 |
| Author | Zhao, Wei Li, Yongxiang Ji, Jiawen Niu, Bingjie Li, Han Wang, Gong Li, Qiushi Wang, Yiliang Wu, Xinhui Zhao, Tingting |
| Author_xml | – sequence: 1 givenname: Qiushi surname: Li fullname: Li, Qiushi organization: CAS Key Laboratory of Space Manufacturing Technology, Technology and Engineering Center for Space Utilization, Chinese Academy of Sciences, Beijing 100094, China – sequence: 2 givenname: Wei surname: Zhao fullname: Zhao, Wei email: zhaowei@csu.ac.cn organization: CAS Key Laboratory of Space Manufacturing Technology, Technology and Engineering Center for Space Utilization, Chinese Academy of Sciences, Beijing 100094, China – sequence: 3 givenname: Bingjie surname: Niu fullname: Niu, Bingjie organization: University of Toronto Institute for Aerospace Studies, Toronto M3H 5T6, Canada – sequence: 4 givenname: Yiliang surname: Wang fullname: Wang, Yiliang organization: Department of Chemistry, Tsinghua University, Beijing 100084, China – sequence: 5 givenname: Xinhui surname: Wu fullname: Wu, Xinhui organization: CAS Key Laboratory of Space Manufacturing Technology, Technology and Engineering Center for Space Utilization, Chinese Academy of Sciences, Beijing 100094, China – sequence: 6 givenname: Jiawen surname: Ji fullname: Ji, Jiawen organization: CAS Key Laboratory of Space Manufacturing Technology, Technology and Engineering Center for Space Utilization, Chinese Academy of Sciences, Beijing 100094, China – sequence: 7 givenname: Yongxiang surname: Li fullname: Li, Yongxiang organization: CAS Key Laboratory of Space Manufacturing Technology, Technology and Engineering Center for Space Utilization, Chinese Academy of Sciences, Beijing 100094, China – sequence: 8 givenname: Tingting surname: Zhao fullname: Zhao, Tingting organization: CAS Key Laboratory of Space Manufacturing Technology, Technology and Engineering Center for Space Utilization, Chinese Academy of Sciences, Beijing 100094, China – sequence: 9 givenname: Han surname: Li fullname: Li, Han organization: CAS Key Laboratory of Space Manufacturing Technology, Technology and Engineering Center for Space Utilization, Chinese Academy of Sciences, Beijing 100094, China – sequence: 10 givenname: Gong surname: Wang fullname: Wang, Gong email: wanggong@csu.ac.cn organization: CAS Key Laboratory of Space Manufacturing Technology, Technology and Engineering Center for Space Utilization, Chinese Academy of Sciences, Beijing 100094, China |
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| Keywords | Bonding strength Mechanical properties Thermal pyrolysis POSS 3D printing PEEK |
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| Title | 3D printing high interfacial bonding polyether ether ketone components via pyrolysis reactions |
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