APA (7th ed.) Citation

Liu, C., Lin, H., Chu, Y., Chen, C., Lyu, D., Chen, K., & Tu, K. (2014). Low-temperature direct copper-to-copper bonding enabled by creep on highly (111)-oriented Cu surfaces. Scripta materialia, 78-79, 65-68. https://doi.org/10.1016/j.scriptamat.2014.01.040

Chicago Style (17th ed.) Citation

Liu, Chien-Min, Han-wen Lin, Yi-Cheng Chu, Chih Chen, Dian-Rong Lyu, Kuan-Neng Chen, and K.N Tu. "Low-temperature Direct Copper-to-copper Bonding Enabled by Creep on Highly (111)-oriented Cu Surfaces." Scripta Materialia 78-79 (2014): 65-68. https://doi.org/10.1016/j.scriptamat.2014.01.040.

MLA (9th ed.) Citation

Liu, Chien-Min, et al. "Low-temperature Direct Copper-to-copper Bonding Enabled by Creep on Highly (111)-oriented Cu Surfaces." Scripta Materialia, vol. 78-79, 2014, pp. 65-68, https://doi.org/10.1016/j.scriptamat.2014.01.040.