The Latest Plasma-Enhanced Chemical-Vapor Deposition Technology for Large-Size Processing

• Published in: Journal of display technology Vol. 3; no. 4; pp. 386 - 391
• Main Authors: Ya-Tang Yang, Tae Kyung Won, Soo Young Choi, Takehara, T., Nishimura, Y., White, J.M.
• Format: Journal Article
• Language: English
• Published: New York IEEE 01.12.2007; The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
• Subjects: Chemical processes; Chemical technology; Chemical vapor deposition; Deposition; Display devices; Large-area deposition; liquid crystal display (LCD); Liquid crystal displays; Marketing; Markets; Plasma applications; Plasma chemistry; Plasma displays; Plasma materials processing; Plasma temperature; plasma-enhanced chemical-vapor deposition (PECVD); Productivity; Semiconductor devices; Substrates; Thin film transistors; thin-film transistor (TFT); liquid crystal display (LCD); thin-film transistor (TFT); Large-area deposition; plasma-enhanced chemical-vapor deposition (PECVD)

The thin-film transistor liquid crystal display (TFT-LCD) industry has in recent years demanded ever-larger- area substrate processing capability to keep up with consumer market demands for larger and larger displays. This paper discusses the latest plasma-enhanced chemical-vapor deposition (PECVD)...