Thermal and hydrodynamic management of a finned-microchannel heat sink applying artificial neural network

• Published in: Case studies in thermal engineering Vol. 45; p. 102996
• Main Authors: Wang, Xiaoqin, Su, Zhanguo, Mansir, Ibrahim B., Singh, Pradeep Kumar, Othman, Nashwan Adnan, Zhang, Lei, Li, Mingkui, Albdeiri, Mahmood Shaker, Elhosiny Ali, H., Dahari, Mahidzal, Deifalla, Ahmed
• Format: Journal Article
• Language: English
• Published: Elsevier Ltd 01.05.2023; Elsevier
• Subjects: Annular microchannel heat sink; Artificial neural network; Fin geometry; Heat transfer management; Relative efficiency index; Annular microchannel heat sink; Fin geometry; Relative efficiency index; Artificial neural network; Heat transfer management

Thermal management of microelectronic circuits will be one of the most difficult challenges facing engineering processes in the near future. High operating temperatures in these devices can degrade the reliability of the components and reduce their life. Therefore, effective cooling technologies tha...