Investigation of gross die per wafer formulas

Different forms of gross die per wafer formulas are investigated with respect to the accuracy in which they model the exact gross die per wafer count, as a function of die area and die aspect ratio. Coefficients are given with which the different formulas provide a sufficiently accurate model. To mo...

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Bibliographic Details
Published inIEEE transactions on semiconductor manufacturing Vol. 18; no. 1; pp. 136 - 139
Main Author de Vries, D.K.
Format Journal Article
LanguageEnglish
Published New York, NY IEEE 01.02.2005
Institute of Electrical and Electronics Engineers
The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subjects
Accuracy
Applied sciences
Aspect ratio
Clamps
Counting
Electronics
Exact sciences and technology
Fabrication
Foundries
Gross die per wafer (GDW)
Mathematical models
Microelectronic fabrication (materials and surfaces technology)
potential good die
Sawing
Semiconductor device manufacture
Semiconductor device modeling
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Semiconductors
Standardization
Taylor series
Testing
Wafers
yield
Gross die per wafer (GDW)
Die
Microelectronic fabrication
yield
potential good die
Aspect ratio
Wafer
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Summary:Different forms of gross die per wafer formulas are investigated with respect to the accuracy in which they model the exact gross die per wafer count, as a function of die area and die aspect ratio. Coefficients are given with which the different formulas provide a sufficiently accurate model. To model the aspect ratio dependence, it is found that the mean of die width and die height should be used as a parameter.
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ISSN:0894-6507
1558-2345
DOI:10.1109/TSM.2004.836656